New TerraWave Wi-Fi Antennas From Ventev Significantly Minimize Interference in High-Density Venues Like Stadiums, Convention Centers and Campus Lecture Halls

Ventev Wireless Infrastructure, a division of TESSCO Technologies Incorporated (NASDAQ: TESS), today announced three new antenna products to expand the TerraWave portfolio of high-density solutions that address the challenges of Wi-Fi deployments in large venues with many simultaneous users. The two antennas and co-locating mount feature the latest technology to maximize user capacity while minimizing interference.

As Wi-Fi-capable devices such as smartphones and tablets become more and more prevalent in universities, convention centers, airports, manufacturing facilities and other large venues, network owners must convert their traditional, coverage-oriented Wi-Fi networks to high-density networks with sufficient capacity to support numerous individual client devices. Ventev, an engineering-driven manufacturer and leading provider of high-density Wi-Fi products, delivers the solutions to help meet the challenge of providing fast and reliable wireless access.

Challenge: Minimize RF Interference
Minimizing channel interference or “beam bounce” is a critical component of a high-density network and, until now, a frustrating challenge for network administrators trying to maximize capacity. To meet that need, two new High-Density Antennas were developed based on customer feedback and Ventev’s extensive Wi-Fi deployment experience.

Solutions:
4 dBi High-Density Patch Antenna – The lower gain of the TerraWave 4 dBi Antenna limits RF interference making it an ideal solution for facilities with lower ceilings and multi-levels like classrooms and lecture halls, where floor-to-floor interference exists and signal bounce must be minimized.

6 dBi High-Density Patch Antenna with Narrower Beamwidth – With narrow beamwidths of 55 degrees at 2.4 GHz and 35 degrees at 5 GHz, the new 6dBi antenna complements the portfolio of 6dBi TerraWave antennas. Boasting the latest advanced technology in high-density antennas, it reduces the number of users per access point (AP), increasing capacity and improving the individual Wi-Fi user experience.

Challenge: Simplify Installation of the Access Point and the High-Density Antenna in Challenging Environments

Solution:
Co-locating Mount – This new, easy-to-install mount allows both the high-density antenna and the AP to be co-located in one décor-friendly unit. The aesthetically pleasing unit conceals equipment and wires but is rugged enough to be used in tough environments like warehouses and manufacturing plants, or other high-ceiling facilities.

“Our experience deploying high-performance Wi-Fi networks in large venues has enabled us to identify the key interference and co-location issues that needed to be solved,” said Jeff Lime, Vice President of Ventev Wireless Infrastructure. “These new additions to the TerraWave product line are the result of our working closely with campuses and stadiums, among others, to solve these issues with innovative new products.”

The new antennas and mount support access points from most industry-leading manufacturers. TerraWave’s full product line of Wi-Fi antennas feature a broad range of technical specifications (gain, beamwidth, number of ports) and offer a variety of mounting options (ceiling, wall, mast/pole, under the seat) to ensure the right product is selected for the right application. For detailed product information, please visit www.terrawave.com/hdantennas. To order a TerraWave High-Density Antenna or another Ventev solution, wireless professionals should contact TESSCO, Your Total Source® (www.tessco.com).

About Ventev Wireless Infrastructure

Ventev Wireless Infrastructure, a division of TESSCO Technologies Inc., designs and manufactures solutions that deploy, protect, power, and improve the performance of every type of wireless network: Wi-Fi, DAS (distributed antenna systems), cellular, mesh and two-way. The extensive line of products such as antennas, enclosures, cable, and solar-powered base stations support these networks and their applications both indoors and outdoors. Ventev Wireless Infrastructure's (www.ventev.com) three product lines are: TerraWave Solutions (Wi-Fi enclosures, antennas and cable assemblies); Ventev (integrated power and outdoor enclosure solutions); and Wireless Solutions (base station infrastructure including towers, site hardware and grounding).

About TESSCO

TESSCO Technologies Inc. (NASDAQ: TESS), Hunt Valley, Maryland, is Your Total Source® for making wireless work. The convergence of wireless and the Internet is revolutionizing the way we live, work and play. New systems and applications are creating opportunities and challenges at an unprecedented rate. TESSCO is there, thinking in new ways for exceptional outcomes. TESSCO (www.tessco.com) architects and delivers, with innovation, productivity and speed, the product and value chain solutions to organizations responsible for building, using and maintaining wireless broadband systems. The Company is a component of the Russell 2000® index.