Park Electrochemical Corp. (NYSE:PKE) announced the introduction of its new E-752-LT toughened, 350°F (177°C) cure epoxy resin system for Automated Fiber Placement (AFP) processing. E-752-LT is designed for aerospace primary and secondary structural applications and is available in standard modulus and intermediate modulus precision slit tapes and fabrics.
Park’s E-752-LT has been formulated to optimize efficient processing in AFP applications for high volume manufacturing. The controlled rheology of E-752-LT has been specifically designed to facilitate a wide range of laminate processing for autoclave, out-of-autoclave and press cures with low laminate void content (capable of < 1%). The resin system offers a combination of toughness, low moisture absorption and very good mechanical properties. E-752-LT has a dry Tg of 428°F (220°C) and a wet Tg of 315°F (157°C).
For information regarding E-752-LT in North and South America, contact Park Aerospace Technologies Corp. at +1-316-283-6500; for information regarding E-752-LT in Europe, the Middle East and Africa, contact Neltec S.A. at +33-5-62-98-52-90; and for information regarding E-752-LT in Asia and Australia, contact Nelco Products Pte. Ltd. at +65-6861-7117.
Certain portions of this press release may be deemed to constitute forward looking statements that are subject to various factors which could cause actual results to differ materially from Park’s expectations. Such factors include, but are not limited to, general conditions in the electronics and aerospace industries, Park’s competitive position, the status of Park’s relationships with its customers, economic conditions in international markets, the cost and availability of raw materials, transportation and utilities, and the various factors set forth in Item 1A “Risk Factors” and under the caption “Factors That May Affect Future Results” after Item 7 of Park’s Annual Report on Form 10-K for the fiscal year ended March 2, 2014.
Park Electrochemical Corp. is a global advanced materials company which develops and manufactures high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure and high-end computing markets and advanced composite materials, parts and assemblies and low-volume tooling for the aerospace markets. Park’s core capabilities are in the areas of polymer chemistry formulation and coating technology. The Company’s manufacturing facilities are located in Singapore, France, Kansas, Arizona and California. The Company also maintains R&D facilities in Arizona, Kansas and Singapore.
Additional corporate information is available on the Company’s website at www.parkelectro.com.
Contacts:
Martina Bar Kochva, 631-465-3600
