Palomar Technologies Highlights New Features of Component Placement System at OFC Booth #3316

Palomar Technologies, provider of precision automation equipment, process development, and contract assembly services for microelectronics, will highlight the updated features of its Model 3500-III and the capabilities of its Model 6500 component placement systems at booth #3316 at OFC 2008. The conference will be held February 26 – 28, 2008 in San Diego, California.

Both systems can incorporate a size-flexible pulse heat stage with an improved stage controller to accommodate a wide array of applications. For assembly operations using submounts or carriers of edge-emitting laser diodes or VCSELs, there are two types of smaller stages. For butterfly packages, other types of optoelectronic assemblies, high thermal conductivity processes, or cure epoxy processes, there are several larger stage options.

About Palomar Technologies

Palomar Technologies (formerly part of Hughes Aircraft Company) is one of the world’s principal suppliers of automated high-precision wire bonders and component placement systems along with process development and contract assembly services to increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the LED, wireless, photonic, microwave, photovoltaic, computer, automotive, aerospace, and medical industries.

Come talk with Palomar’s experts regarding your application needs. The ultra-high accuracy of the Model 6500 (down to 1.5 micron 3 sigma) or the extra large work area of the Model 3500 may be just the capability your company is looking for. For more information on Palomar Technologies and Palomar Microelectronics, visit http://www.palomartechnologies.com or phone 760-931-3600.