Rudolph to Host Company Sponsored Analyst Event January 13, 2014 (New York, NY)

Rudolph Technologies, Inc. (NYSE: RTEC) today announced that the Company’s management will host a Company Sponsored Analyst Event in New York City, NY, January 13, 2014.

Company Sponsored Analyst Event: New York, NY – January 13, 2014
Rudolph will host an Analyst Meeting and Luncheon for the professional investment community on Monday, January 13, 2014, in New York City, NY. Registration begins at 8:00 a.m. EST, with the program beginning at 8:45 a.m. EST, followed by lunch at 12:00 p.m. EST. One-on-one meetings with management are available by appointment only following the luncheon.

The Rudolph Technologies Analyst Event will include presentations from each of the company’s business units and keynote speaker, Dr. Voya Markovich, President of Microelectronic Organic Packaging Consultants, LLC, who will discuss trends in the Advanced Packaging marketplace.

  • Inspection Business Unit
  • Lithography Systems Group
    • Advanced Packaging Lithography Business Unit
    • Display Products Lithography Business Unit
  • Metrology Business Unit
  • Data Analysis & Review Business Unit

To Attend the Rudolph Technologies 2014 Analyst Event
Members of the professional investment community who wish to attend the Analyst Event and Luncheon are asked to contact Rudolph Technologies’ Investor Relations consultant Laura Guerrant-Oiye, Principal of Guerrant Associates at (808) 882-1467 or via email at lguerrant@guerrantir.com.

About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

Contacts:

Rudolph Technologies, Inc.
Investors:
Laura Guerrant-Oiye, 808-882-1467
lguerrant@guerrantir.com
or
Trade Press:
Amy Pauling, 952-259-1794
amy.pauling@rudolphtech.com

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