The Global Electronic Packaging Market is Expected to Grow at a CAGR of 47.02 Percent from 2014-2019: TechNavio

TechNavio has published a new report on the Global Electronic Packaging Market, which is expected to grow at a CAGR of 47.02 percent from 2014-2019.

Electronics in packaging are used for safety, security, reducing waste, product differentiation, convenience, brand enhancement, and quality assurance. Electronic packaging is created primarily with printed electronics, and advances in this sphere are expected to reduce the costs of electronic packaging dramatically over the projected period.

The new report draws attention to changes in consumer lifestyles, which have made consumers more knowledgeable and involved in their purchases. Consumers are paying more attention to how products are packaged, and are looking for new and innovative packaging.

“Vendors have started giving more importance to product packaging because of increased competition and "product clutter" in the market,” says Faisal Ghaus, Vice President of TechNavio.

Furthermore, the TechNavio report emphasizes the increase in demand for sophisticated functionalities in packaging, which has necessitated some rapid advances in technology.

“Technological advances are being made in sensor devices, especially in terms of providing high-quality services and improved efficiency to end-users, which has resulted in the development of ultra-miniaturized and power-efficient printed and flexible sensors,” says Ghaus.

TechNavio currently has more than 3000 market research reports on a huge range of topics, including:

• Blister Packaging Market in the US 2015-2019
• Global Semiconductor Packaging Materials Market 2015-2019

About TechNavio

TechNavio is a leading global technology research and advisory company.

Founded in 2003, TechNavio has about 200 analysts globally and develops over 2000 pieces of research every year, covering more than 500 technologies across 80 countries.

TechNavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, re-sellers, and end-users.

If you are interested in more information, please contact our media team at media@technavio.com.