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EDITOR'S PICKS
FEATURED VIDEO
EDUCATION
BLOGS
3D ASIP: "It's Complicated"
12/15/2014The presentations at this week's 3D Architectures in Semiconductor Integration and Packaging conference could be summed up in a famous Facebook status....
Cypress and Spansion to merge in $4B all-stock transaction
12/03/2014Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction value...
What’s next for MEMS?
12/16/2014The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ...
3D TSV begins
12/10/2014“Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” announces Yole....
Tune in to the Solid State Watch

Cypress and Spansion announce merger; SEMATECH announces promising EUV research; Global semiconductor sales reach $29.7B in October; Soitec and CEA-Leti establish new solar cell efficiency world record

Click here for more videos

Tech Papers
Upcoming Webcasts
Extending Moore's Law
January 2015 (Date and time TBD) Will IC capability, affordability and diversity continue to grow on a Moore’s ...
How the IoT is Driving Semiconductor Technology
January 2015 (Date and time TBD) The age of the Internet of Things is upon us, with the ...
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MAGAZINE




BLOGS


IEDM 2014 Preview
December 08, 2014

TWITTER


NEWS ANALYSIS & FEATURES


Imec presents ultralow power RFID transponder chip in thin-film transistor technology on plastic at IEDM 2014

12/17/2014  At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip.

Daintree Networks named to "50 Most Promising IoT Companies of 2014"

12/17/2014  Daintree Networks has been named by CIO Review Magazine as one of the '50 Most Promising Internet of Things (IoT) Companies 2014.'

Imec demonstrates broadband graphene optical modulator on silicon

12/17/2014  At this week’s IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry’s first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed.

The simplest element: Turning hydrogen into 'graphene'

12/16/2014  New work from Carnegie's Ivan Naumov and Russell Hemley delves into the chemistry underlying some surprising recent observations about hydrogen, and reveals remarkable parallels between hydrogen and graphene under extreme pressures.

IEDM: Thanks for MEMS-ories

12/16/2014  At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those papers were the subject of a press release two months in advance.

Amkor Technology licenses proprietary copper pillar wafer bump technology to GLOBALFOUNDRIES

12/16/2014  Amkor Technology, Inc., a provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.

Lead islands in a sea of graphene magnetize the material of the future

12/16/2014  Researchers in Spain have discovered that if lead atoms are intercalated on a graphene sheet, a powerful magnetic field is generated by the interaction of the electrons' spin with their orbital movement.

Synopsys and imec expand TCAD collaboration to 5nm and beyond

12/16/2014  Synopsys, Inc. today announced the expansion of its collaboration with imec (nanoelectronics research center imec) to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond.

Worth the detour: European 3D TSV Summit 2015 offers new outlooks on 2.5 and 3D technology

12/16/2014  With just over a month left to go, industry experts are looking forward to the third edition of the European 3D TSV Summit (Jan 19-21, 2015 in Grenoble, France), this year focusing on “Enabling Smarter Systems.”

Innovation in the shadow of volcanic change

12/16/2014  The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

The desktop display market shows signs of life

12/12/2014  Global desktop monitor sell-in revenue rose 7 percent in the third quarter (Q3) of 2014, as average selling prices (ASPs) rose just over 10 percent.

Scientists measure speedy electrons in silicon

12/12/2014  An international team of physicists and chemists based at the University of California, Berkeley, has for the first time taken snapshots of this ephemeral event using attosecond pulses of soft x-ray light lasting only a few billionths of a billionth of a second.

Stacking 2-dimensional materials may lower cost of semiconductor devices

12/12/2014  A team of researchers led by North Carolina State University has found that stacking materials that are only one atom thick can create semiconductor junctions that transfer charge efficiently, regardless of whether the crystalline structure of the materials is mismatched - lowering the manufacturing cost for a wide variety of semiconductor devices such as solar cells, lasers and LEDs.

Murata completes acquisition of Peregrine Semiconductor

12/12/2014  Murata Electronics North America, Inc. and Peregrine Semiconductor Corporation, founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, today announce that Murata has acquired all outstanding shares of Peregrine.

MORE ANALYSIS & FEATURES


Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Extending Moore's Law

January 2015 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2015 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

More Webcasts

EVENTS

International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015

FINANCIALS

NEW COMMENTS


Regional recap: states fund, flaunt nano competitiveness
Innovation in the shadow of volcanic change
Innovation in the shadow of volcanic change

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....