IEDM’s special focus session highlights diverse challenge
November 22, 2013
IFTLE 171 Semicon Taiwan Part 3: Disco, Namics, Amkor
December 02, 2013
GLOBALFOUNDRIES to make Apple chips in New York fab?
November 13, 2013
Are Hardware Hubs Coming?
November 27, 2013
NEWS ANALYSIS & FEATURES
Semiconductor industry leaders to examine the future of 3D NAND at Dec 10 event
12/02/2013 Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures.
Semiconductor Industry Association begins leadership transition
11/27/2013 Semiconductor Industry Association (SIA) president and CEO Brian Toohey has announced his plans to leave the association in 2014 to join New Hampshire-based DEKA Research & Development Corporation as executive vice president.
Leti announces MEMS research collaboration with OMRON
11/27/2013 CEA-Leti today announced a development agreement that will utilize Leti’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.
Soitec and SunEdison enter into patent license agreement
11/26/2013 Soitec and SunEdison, Inc. announced today that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products.
Nanotubes can solder themselves, markedly improving device performance
11/26/2013 University of Illinois researchers have developed a way to heal gaps in wires too small for even the world’s tiniest soldering iron.
Multitest ships first MEMS tri-temp solution for 3+2 axis magnetic test and calibration
11/25/2013 Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its solution for 3-axis magnetometer plus 2-axis low g-test and calibration fully supports the technical features of today’s advanced 3D hall sensors.
Advances in Post-Tape Out Resource Management
11/25/2013 Foundries, both pure-play and independent device manufacturers (IDM), rigorously compete for market share. One factor that helps them get and keep business is turnaround time (TAT). As technology nodes advance, achieving targeted production runtimes in the post-tapeout flow gets ever more challenging.
What can happen when graphene meets a semiconductor
11/25/2013 For all the promise of graphene as a material for next-generation electronics and quantum computing, scientists still don't know enough about this high-performance conductor to effectively control an electric current.
Dongbu HiTek starts volume production of 5 megapixel CMOS image sensor chips
11/25/2013 Dongbu HiTek today announced that it has begun volume production of 5.0 Megapixel (5M) CMOS Image Sensor (CIS) devices for Superpix Micro Technology Co., Ltd., a fabless customer based in Beijing.
Blog Review: November 25, 2013
11/25/2013 New blogs examine Intel’s expanded push into the foundry business, the status of EUV sources, substrates for 3D integration, IEDM sessions, and the challenges of giga-scale circuit design with nano-scale technologies.
Eliminating the Challenges of Giga-Scale Circuit Design With Nano-Scale Technologies
11/25/2013 Dr. Lianfeng Yang of ProPlus Design Solutions, Inc. says that the only way out of today's challenges is to more tightly integrate tools for nano-scale modeling, giga-scale SPICE simulation and DFY.
The Week in Review: Nov. 22, 2013
11/22/2013 SoC solution on a 2.5D silicon interposer exhibited; SEMI reports October 2013 book-to-bill ratio above parity; Soraa to open new semi fab in NY; Dow Corning introduces new silicone for LEDs; SUSS installs excimer laser; EVG introduces non-contact lithography system
Next-generation Leti magnetometers on board Swarm satellites
11/22/2013 CEA-Leti’s next-generation magnetometer technology was launched into space today on board the European Space Agency’s three Swarm satellites to collect unprecedented detail about the Earth’s magnetic field.
Unraveling the mind-body connection with power-efficient IC chipMORE ANALYSIS & FEATURES
11/22/2013 Despite the advances in neuroscience research, the human brain remains a complex puzzle with questions unanswered on how it controls human behaviour, cognitive functions and movements.
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