Spire Corporation (OP: SPIR)
0.3500 USD  +0.0235 (+7.20%)
Official Closing Price  /  Updated: 8:10 PM EDT, Oct 30, 2014  /  Add to My Watchlist      
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Volume 21,100
Open 0.3200
Bid (Size) N/A (0)
Ask (Size) N/A (0)
Prev. Close 0.3265
Today's Range 0.3100 - 0.3500
52wk Range 0.2000 - 1.170
Shares Outstanding 9,207,874
Dividend Yield N/A
Performance
YTD
-27.10%
-27.10%
1 Month
-15.46%
-15.46%
3 Month
-43.55%
-43.55%
6 Month
-61.54%
-61.54%
1 Year
-53.33%
-53.33%
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FEATURED VIDEO
EDUCATION
BLOGS
Imec, Coventor partner to advance CMOS process development
10/28/2014Imec researchers using Coventor’s SEMulator3D platform to model and optimize 7nm manufacturing technology....
Mergers, acquisitions reshape the automotive semi supplier landscape
10/22/2014Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been u...
RF and MEMS Technologies to Enable the IoT
10/24/2014Communications and energy-harvesting capabilities can be integrated into ubiquitous always-on smart nodes....
IBM to pay GlobalFoundries $1.5B to take over chip fabs
10/20/2014IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business....
Tune in to the Solid State Watch EUV available at 10nm; Mentor Graphics appoints new VP of Embedded Systems; ProPlus expands operations in Europe; Rudolph releases new SONUS technology

Click here for more videos

Tech Papers
Upcoming Webcasts
Metrology and Failure Analysis
Nov. 2014 (Date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, ...
Interconnects
Nov. 2014 (Date and time TBD) This webcast will examine the state-of-the-art in conductors and dielectrics, -- including ...
Miss a webcast? Watch it On-Demand Now
Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


SEMI extends ASMC Call for Papers deadline to November 10

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

Synopsys announces availability of DesignWare, non-volatile memory IP for TowerJazz 180nm process technology

10/30/2014  Synopsys, Inc. today announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

SEMICON Japan 2014: New venue and new ideas for rebounding industry

10/29/2014  Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

TSI Semiconductors and Silvaco extend collaboration to accelerate launch of 0.25um BCDMOS process

10/29/2014  Silvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) today announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology.

MegaChips to acquire SiTime for $200M

10/29/2014  SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.

TSMC, Kilopass deliver non-volatile memory for the 16nm finFET process node

10/28/2014  Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

UMC enters volume production for Lantiq's Communication ICs

10/28/2014  United Microelectronics Corporation, a global semiconductor foundry, and Lantiq, a supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq's SPT170 high voltage Power Management ICs.

Intersil announces appointment of industry executives to board of directors

10/28/2014  Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of two accomplished executives to its board of directors, bringing the total number of independent directors to nine.

SMIC and ASML sign volume purchase agreement

10/27/2014  Semiconductor Manufacturing International Corporation and ASML Holding N.V. announce the signing of a volume purchase agreement that will provide SMIC with lithography systems from ASML.

KLA-Tencor reveals 'leveraged recapitalization' plan and an expanded stock repurchase program

10/24/2014  Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.

IMAPS Award Winners for 2014

10/24/2014  At the IMAPS (International Microelecronics & Packaging Society) meeting last week, several of their key annual awards were given out.

New 3D display technology promises greater energy efficiency

10/23/2014  LCD technology developed in Hong Kong maintains the 3D images it displays without drawing power.

STMicroelectronics tops five billion MEMS sensors shipped

10/23/2014  Beyond gaming systems, smartphones, tablets, navigation systems, and other widely adopted applications, ST’s sensors have also been used in thousands of other useful, fun, and valuable applications.

Intematix appoints Jerry Turin as CFO

10/23/2014  Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, today announced Jerry Turin as the company's Chief Financial Officer.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Interconnects

Nov. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

More Webcasts

EVENTS

MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014
2014 IEEE International Electron Device Meeting
San Francisco, CA
http://www.his.com/~iedm/
December 15, 2014 - December 17, 2014
International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015

FINANCIALS

NEW COMMENTS


MegaChips to acquire SiTime for $200M
SEMI approves first HB-LED standards
Cree's new SC5 Technology Platform doubles light output to radically lower system cost

NEW PRODUCTS

VaporSorb filter line protects advanced yield production from Entegris
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....
SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...