Spire Corporation (OP: SPIR)
0.4116 USD  -0.0024 (-0.58%)
Official Closing Price  /  Updated: 5:20 PM EDT, Sep 30, 2014  /  Add to My Watchlist      
Price and Volume
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Volume 4,200
Open 0.4116
Bid (Size) N/A (0)
Ask (Size) N/A (0)
Prev. Close 0.4140
Today's Range 0.4116 - 0.4116
52wk Range 0.3700 - 1.170
Shares Outstanding 9,207,874
Dividend Yield N/A
Performance
YTD
-14.27%
-14.27%
1 Month
-6.45%
-6.45%
3 Month
-36.68%
-36.68%
6 Month
-60.04%
-60.04%
1 Year
+11.24%
+11.24%
Top News
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EDITORS' PICKS


TSMC launches ultra-low power technology platform for IoT and wearable device applications
09/29/2014TSMC today announced the foundry segment's first and most comprehensive ultra-low power technology platform ai...
In the LED packaging world, Flip Chip technology is rising
09/19/2014In the LED packaging world, a wind of change is blowing. A LED TV crisis, and new Chinese players have totally modified the LED industry and i...
 
NANIUM launches the industry’s largest WLCSP in volume production
09/23/2014NANIUM today announced it has successfully launched the industry’s largest Wafer-Level Chip Scale Package (WLCSP) in volume....
Equipment spending shows strong growth for 2014 and 2015
09/10/2014Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion....

MAGAZINE




BLOGS


Sensory Shanghai
September 18, 2014

TWITTER


NEWS ANALYSIS & FEATURES


New technology may lead to prolonged power in mobile devices

09/30/2014  Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn’t die after a few hours of heavy use.

European 3D TSV Summit: “Smarter system integration” theme to focus on both business and technology

09/30/2014  On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France.

A new dimension for integrated circuits: 3D nanomagnetic logic

09/30/2014  Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.

Kurita, SEMATECH partner on wafer surface contamination and cleaning technology in semiconductor processing

09/30/2014  SEMATECH, the global consortium of chipmakers, announced today that Kurita Water Industries Limited has partnered with SEMATECH to develop innovative technologies for low defectivity ultrapure water (UPW) applications used in semiconductor manufacturing.

Gigaphoton introduces "eGrycos" for ArF immersion lasers

09/29/2014  Gigaphoton Inc., a lithography light source manufacturer, announced today that it has completed development of an electricity-reduction technology for its flagship “GT Series” of argon fluoride (ArF) immersion lasers used for semiconductor lithography processing.

Tessera Technologies names Craig Mitchell as CTO and president of Invensas

09/29/2014  Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately.

United States photomask market to reach around $475M by 2019

09/29/2014  According to the recently published TechSci Research report, "United States Photomask Market Forecast & Opportunities, 2019", the photomask market in the United States is forecast to reach $474.58 billion by 2019.

TSMC delivers first fully functional 16 finFET networking processor

09/29/2014  TSMC today announced that its has successfully produced the foundry segment's first fully functional ARM-based networking processor with FinFET technology, through its collaboration with HiSilicon Technologies Co, Ltd.

Smartphone connectivity presents both opportunities and challenges for automotive processor chip suppliers

09/29/2014  The use of smartphones in motor vehicles—already a near-ubiquitous phenomenon—is the most disruptive trend in the automotive infotainment business today, presenting both challenges and opportunities for automakers and their processor semiconductor suppliers.

Printed, flexible, and organic electronics will account for 18% of wearable athletics sensors in 2024

09/26/2014  Printed, flexible and organic electronic (PFOE) sensors can offer flexible form factors, larger area, lower cost, lower power, and better disposability compared to conventional sensors, key attributes for wearable applications.

Silicon Motion elects Han-Ping Shieh to Board of Directors

09/26/2014  Mr. Shieh will replace Mr. Kenneth Kuan-Min Lin, who had chosen not to stand for reelection to the Board of Directors in order to focus more on his venture capital and other activities.

New discovery could pave the way for spin-based computing

09/26/2014  A University of Pittsburgh research team has discovered a way to fuse these two distinct properties in a single material, paving the way for new ultrahigh density storage and computing architectures.

Honeywell advanced materials help mobile devices dissipate heat

09/25/2014  Honeywell Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better.

Southampton scientists grow a new challenger to graphene

09/24/2014  A team of researchers from the University of Southampton's Optoelectronics Research Centre (ORC) has developed a new way to fabricate a potential challenger to graphene.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS

Advanced Packaging

Oct. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

Oct. 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

SEMICON Europa
Grenoble, France
http://www.semiconeuropa.org
October 07, 2014 - October 09, 2014
MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014
2014 IEEE International Electron Device Meeting
San Francisco, CA
http://www.his.com/~iedm/
December 15, 2014 - December 17, 2014

FINANCIALS

NEW COMMENTS


For electronics beyond silicon, a new contender emerges
For electronics beyond silicon, a new contender emerges
For electronics beyond silicon, a new contender emerges

NEW PRODUCTS

SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...
Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...