Global Market Map
CSE 5,966.06 (0.00%)
6,773.63 (-0.94%)
HSI 23,960.43 (0.02%)
Bolsa 45,302.00 (-1.00%)
JCI 4,685.89 (0.00%)
NIKKEI 16,205.90 (-0.71%)
DAX 9,749.54 (-0.51%)
S&P/TSX 15,129.00 (0.00%)
BSE 27,206.74 (0.43%)
Bovespa 56,818.11 (-1.68%)
ASX 5,416.80 (0.91%)
450.99 (-0.46%)
Dow 17,172.68 (-0.62%)
SHANG 2,309.72 (0.87%)
Straits TMS 3,296.57 (-0.26%)
MerVal 5,880.84 (0.00%)
IPSA 3,697.79 (0.00%)
KOSPI 2,028.91 (-0.51%)
Global Markets By Region
Americas Price Change (%) 1 Year % Last Updated
flag Toronto Composite DAILY 15,129.00
-136.35 (-0.89%)
+17.88%
Sep 23, 3:54am
flag Mexican Bolsa IPC Index DAILY 45,302.00
-459.90 (-1.00%)
+10.21%
Sep 23, 3:54am
flag Brazil Bovespa Index DAILY 56,818.11
-970.59 (-1.68%)
+2.00%
Sep 23, 3:54am
flag Argentina Merval Index DAILY 5,880.84
+0.00 (0.00%)
+26.97%
Sep 23, 3:54am
flag Chile IPSA Index DAILY 3,697.79
+0.00 (0.00%)
-3.22%
Sep 23, 3:54am
Asian Pacific Price Change (%) 1 Year % Last Updated
flag Nikkei 225 Index DAILY 16,205.90
-115.27 (-0.71%)
+11.72%
Sep 23, 3:54am
flag ASX All Ordinaries DAILY 5,416.80
+48.60 (0.91%)
+3.56%
Sep 23, 3:54am
flag Seoul Composite DAILY 2,028.91
-10.36 (-0.51%)
+1.16%
Sep 23, 3:54am
flag Hong Kong Hang Seng DAILY 23,960.43
+4.94 (0.02%)
+3.65%
Sep 23, 3:54am
flag Shanghai DAILY 2,309.72
+19.85 (0.87%)
+5.38%
Sep 23, 3:54am
flag Taiwan Weighted DAILY 9,084.90
-49.75 (-0.54%)
+10.86%
Sep 23, 3:54am
flag Singapore Straits Times DAILY 3,296.57
-8.48 (-0.26%)
+3.22%
Sep 23, 3:54am
flag Bombay Sensex Index DAILY 27,206.74
+116.32 (0.43%)
+36.29%
Sep 23, 3:54am
flag Jakarta Composite DAILY 4,685.89
+0.00 (0.00%)
+4.69%
Sep 23, 3:54am
flag Kuala Lumpur Composite DAILY 1,832.26
+0.00 (0.00%)
+3.46%
Sep 23, 3:54am
flag PSE Composite DAILY 7,516.24
+0.00 (0.00%)
+18.68%
Sep 23, 3:54am
flag Sri Lanka All Share DAILY 5,966.06
+0.00 (0.00%)
+4.57%
Sep 23, 3:54am
Europe Price Change (%) 1 Year % Last Updated
flag FTSE DAILY 6,773.63
-64.29 (-0.94%)
+3.28%
Sep 23, 3:54am
flag Paris CAC 40 DAILY 4,442.55
-18.67 (-0.42%)
+6.53%
Sep 23, 3:54am
flag Frankfurt Index DAILY 9,749.54
-49.72 (-0.51%)
+12.89%
Sep 23, 3:54am
flag Belgium 20 Index DAILY 3,220.44
+0.04 (0.00%)
+13.75%
Sep 23, 3:54am
flag Swiss Market Index DAILY 8,817.52
-22.65 (-0.26%)
+9.50%
Sep 23, 3:54am
flag OSE Norway All Share DAILY 684.78
-1.81 (-0.26%)
+23.79%
Sep 23, 3:54am
flag ATX Vienna DAILY 2,291.74
-9.13 (-0.40%)
-8.56%
Sep 23, 3:54am
flag Amsterdam Total Return General DAILY 422.05
-3.69 (-0.87%)
+10.80%
Sep 23, 3:54am
flag Madrid General DAILY 1,116.87
-5.48 (-0.49%)
+21.41%
Sep 23, 3:54am
flag IBEX 35 225 Index DAILY 10,947.90
-54.00 (-0.49%)
+10.88%
Sep 23, 3:54am
flag OMXS-ALL SHARE INDX  450.99
-2.07 (-0.46%)
+11.69%
Sep 23, 4:26am
Africa/Middle East Price Change (%) 1 Year % Last Updated
flag ADX GENERAL IND DAILY 5,142.83
-6.97 (-0.14%)
+36.47%
Sep 23, 4:26am
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EDITORS' PICKS


In the LED packaging world, Flip Chip technology is rising
09/19/2014In the LED packaging world, a wind of change is blowing. A LED TV crisis, and new Chinese players have totally modified the LED industry and i...
SEMI wins request for etch equipment export control review
09/09/2014Major milestone in longstanding push to remove etch equipment from U.S. export control list....
 
Equipment spending shows strong growth for 2014 and 2015
09/10/2014Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion....
GaAs device market posts record revenues in 2013
09/05/2014Ongoing growth in cellular and Wi-Fi applications will continue to drive GaAs device revenues higher. ...

MAGAZINE




BLOGS


Sensory Shanghai
September 18, 2014

TWITTER


NEWS ANALYSIS & FEATURES


Physicists heat freestanding graphene to control curvature of ripples

09/22/2014  An international team of physicists, led by a research group at the University of Arkansas, has discovered that heating can be used to control the curvature of ripples in freestanding graphene.

Vesper launches with very high SNR MEMS microphone

09/22/2014  Intending to improve the smallest audio component found in smartphones, wearables and Internet of Things (IoT) devices, a new Boston-based sensor company called Vesper has designed a microphone that will enhance consumers' acoustic experience with voice capture and sound recording.

NVIDIA unveils Maxwell GPU architecture

09/19/2014  In a major leap forward for gaming, NVIDIA today introduced the first high-end products based on its Maxwell chip architecture -- the new GeForce GTX 980 and 970 GPUs -- delivering unmatched performance, major new graphics capabilities and twice the energy efficiency of the previous generation.

Northeastern University researchers develop novel method for working with nanotubes

09/19/2014  Northeastern University researchers have developed a novel method for controllably constructing precise inter-nanotube junctions and a variety of nanocarbon structures in carbon nanotube arrays.

Toward optical chips

09/19/2014  A promising light source for optoelectronic chips can be tuned to different frequencies.

Photonics community celebrates bipartisan passage of Revitalizing American Manufacturing and Innovation Act

09/19/2014  Photonics community leaders including SPIE, the international society for optics and photonics, are celebrating bipartisan passage by the U.S. House of Representatives of a bill designed to stimulate development and commercialization of new technologies and promote growth of high-value jobs.

SPIE panel tackles mask complexity issues

09/19/2014  Photomasks that take two-and-a-half days to write. Mask data preparation that enters into Big Data territory. And what happens when extreme-ultraviolet lithography really, truly arrives?

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

09/18/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

ProPlus Design Solutions expands sales operations to Europe

09/18/2014  ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

EMCORE Corporation announces CEO transition plan

09/18/2014  EMCORE Corporation, a provider of compound semiconductor-based components and subsystems for the fiber optic and space solar power industries, today announced a transition plan of its Chief Executive Officer position in connection with the announced sale of its Space Photovoltaics business.

For electronics beyond silicon, a new contender emerges

09/18/2014  Silicon has few serious competitors as the material of choice in the electronics industry. Yet transistors, the switchable valves that control the flow of electrons in a circuit, cannot simply keep shrinking to meet the needs of powerful, compact devices; physical limitations like energy consumption and heat dissipation are too significant.

Making quantum dots glow brighter

09/18/2014  Ultrathin layers of metal oxides can change the way quantum dots behave, in some cases turning them into more efficient light emitters.

Samsung now mass producing industry’s first 20nm 6Gb LPDDR3 mobile DRAM

09/18/2014  The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.

Mentor Graphics appoints Vice President for Embedded Technologies

09/18/2014  Mentor Graphics Corp. today announced the appointment of Glenn Perry to the role of vice president of the company's Embedded Systems Division.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS

Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014
Strategic Materials Conference
Santa Clara, CA
http://www.semi.org/node/41386
September 30, 2014 - October 01, 2014
SEMICON Europa
Grenoble, France
http://www.semiconeuropa.org
October 07, 2014 - October 09, 2014
MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014

FINANCIALS

NEW COMMENTS


About Us
JEDEC revises package inspection standard JESD9B
New Swedish manufacturer of advanced deposition equipment for wide band gap semiconductor materials

NEW PRODUCTS

SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...
Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...