Global Market Map
HSI 23,333.18 (-0.30%)
MerVal 5,880.84 (0.00%)
ASX 5,369.90 (-0.06%)
Bolsa 43,450.75 (-0.41%)
BSE 26,855.95 (0.26%)
KOSPI 1,931.65 (-0.27%)
Straits TMS 3,236.50 (1.05%)
6,419.15 (0.30%)
SHANG 2,302.42 (-1.04%)
JCI 4,685.89 (0.00%)
IPSA 3,139.68 (0.37%)
NIKKEI 15,138.96 (-0.37%)
CSE 5,966.06 (0.00%)
Bovespa 52,411.03 (-0.04%)
DAX 9,047.31 (1.20%)
S&P/TSX 14,476.87 (1.15%)
437.12 (1.26%)
Dow 16,461.32 (-0.92%)
Global Markets By Region
Americas Price Change (%) 1 Year % Last Updated
flag Toronto Composite DAILY 14,312.07
-235.64 (-1.62%)
+8.95%
Oct 23, 2:54pm
flag Mexican Bolsa IPC Index DAILY 43,450.75
-179.83 (-0.41%)
+7.51%
Oct 23, 2:54pm
flag Brazil Bovespa Index DAILY 52,411.03
-21.40 (-0.04%)
-6.54%
Oct 23, 2:54pm
flag Argentina Merval Index DAILY 5,880.84
+0.00 (0.00%)
+7.59%
Oct 23, 2:54pm
flag Chile IPSA Index DAILY 3,139.68
+11.72 (0.37%)
-18.42%
Oct 23, 2:54pm
Asian Pacific Price Change (%) 1 Year % Last Updated
flag Nikkei 225 Index DAILY 15,138.96
-56.81 (-0.37%)
+3.03%
Oct 23, 2:54pm
flag ASX All Ordinaries DAILY 5,369.90
-3.40 (-0.06%)
+0.34%
Oct 23, 2:54pm
flag Seoul Composite DAILY 1,931.65
-5.32 (-0.27%)
-5.88%
Oct 23, 2:54pm
flag Hong Kong Hang Seng DAILY 23,333.18
-70.79 (-0.30%)
-0.45%
Oct 23, 2:54pm
flag Shanghai DAILY 2,302.42
-24.13 (-1.04%)
+3.28%
Oct 23, 2:54pm
flag Taiwan Weighted DAILY 8,731.07
-17.76 (-0.20%)
+5.28%
Oct 23, 2:54pm
flag Singapore Straits Times DAILY 3,236.50
+33.76 (1.05%)
+1.27%
Oct 23, 2:54pm
flag Bombay Sensex Index DAILY 26,855.95
+68.72 (0.26%)
+28.53%
Oct 23, 2:54pm
flag Jakarta Composite DAILY 4,685.89
+0.00 (0.00%)
+2.61%
Oct 23, 2:54pm
flag Kuala Lumpur Composite DAILY 1,832.26
+0.00 (0.00%)
+1.83%
Oct 23, 2:54pm
flag PSE Composite DAILY 7,516.24
+0.00 (0.00%)
+13.98%
Oct 23, 2:54pm
flag Sri Lanka All Share DAILY 5,966.06
+0.00 (0.00%)
+0.33%
Oct 23, 2:54pm
Europe Price Change (%) 1 Year % Last Updated
flag FTSE DAILY 6,419.15
+19.42 (0.30%)
-3.53%
Oct 23, 2:54pm
flag Paris CAC 40 DAILY 4,157.68
+52.59 (1.28%)
-2.79%
Oct 23, 2:54pm
flag Frankfurt Index DAILY 9,047.31
+107.17 (1.20%)
+2.03%
Oct 23, 2:54pm
flag Belgium 20 Index DAILY 3,071.41
+9.66 (0.32%)
+5.79%
Oct 23, 2:54pm
flag Swiss Market Index DAILY 8,546.08
+39.94 (0.47%)
+5.19%
Oct 23, 2:54pm
flag OSE Norway All Share DAILY 631.37
-1.90 (-0.30%)
+9.62%
Oct 23, 2:54pm
flag ATX Vienna DAILY 2,147.98
+16.48 (0.77%)
-16.56%
Oct 23, 2:54pm
flag Amsterdam Total Return General DAILY 396.89
+0.88 (0.22%)
+2.22%
Oct 23, 2:54pm
flag Madrid General DAILY 1,044.38
+9.80 (0.95%)
+1.83%
Oct 23, 2:54pm
flag IBEX 35 225 Index DAILY 10,333.70
+83.80 (0.82%)
+4.66%
Oct 23, 2:54pm
flag OMXS-ALL SHARE INDX  437.12
+5.45 (1.26%)
+7.11%
Oct 23, 12:52pm
Africa/Middle East Price Change (%) 1 Year % Last Updated
flag ADX GENERAL IND DAILY 4,829.83
+29.77 (0.62%)
+24.72%
Oct 23, 6:45am
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EDITORS' PICKS


Mergers, acquisitions reshape the automotive semi supplier landscape
10/22/2014Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been u...
Wearable sensor market to expand sevenfold in five years
10/16/2014Driven by rising demand for fitness and health monitoring features as well as by improved user interfaces, shipments of sensors used in wearable...
 
IBM to pay GlobalFoundries $1.5B to take over chip fabs
10/20/2014IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business....
Are We At an Inflection Point with Silicon Scaling and Homogeneous ICs?
10/15/2014In the late 1940’s, three physicists (Bardeen, Brattain and Shockley) invented the first transistor and were later awarded the...

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


Intematix appoints Jerry Turin as CFO

10/23/2014  Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, today announced Jerry Turin as the company's Chief Financial Officer.

SMIC and Maxscend collaborate on 55nm RF IP platform

10/23/2014  Semiconductor Manufacturing International Corporation and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm low leakage logic process.

Finalists announced for MEMS Executive Congress US 2014

10/23/2014  Six companies selected from a pool of applicants will compete in MEMS Industry Group's (MIG)'s MEMS & Sensors Technology Showcase at MEMS Executive Congress.

Cree's new SC5 Technology Platform doubles light output to radically lower system cost

10/23/2014  This new class of LEDs can reduce system costs by up to 40 percent in most lighting applications.

EUV light source developer Adlyte achieves key performance milestone for high-volume manufacturing

10/22/2014  Adlyte Inc., a developer of high-brightness extreme light sources for advanced semiconductor inspection and metrology applications, today announced it has reached a key performance benchmark for its extreme ultraviolet (EUV) light source for high-volume manufacturing (HVM)-readiness.

Samsung starts mass production of 8Gb DDR4 based on 20nm process technology

10/22/2014  Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

Lam Research ships 100th Syndion etch module

10/21/2014  Lam Research Corp., a global supplier of wafer fabrication equipment and services to the semiconductor industry, today announced it has shipped the 100th Syndion module for deep silicon etch applications.

Special UO microscope captures defects in nanotubes

10/21/2014  University of Oregon chemists have devised a way to see the internal structures of electronic waves trapped in carbon nanotubes by external electrostatic charges.

Gigaphoton achieves 3-hour continuous operation of EUV light source

10/21/2014  Gigaphoton Inc. announced today that it has succeeded in achieving 3-hour continuous operation of its prototype LPP EUV light source at 50 percent duty cycle and 42-W output, equivalent to usage in a high-volume-manufacturing (HVM) environment.

Semiconductor equipment book-to-bill declines in September

10/21/2014  While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

10/20/2014  MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

Canadian semiconductor manufacturing industry revenue expected to decline 8% in 2014

10/17/2014  Industry manufacturers, which are typically small- to mid-sized enterprises, will find it difficult to match the research and development (R&D) spending of multinational competitors.

Semiconductor “dust” enables low cost solar cells, LEDs

10/17/2014  The U.S. Patent Office has issued US Patent No. 8,859,310 to Versatilis LLC that shows how fine semiconductor particles, powders or fines, often the waste byproduct of dicing semiconductor wafers into ever smaller chips, can be processed into a sea of low cost solar cells or micro-LEDs.

Magnetic mirrors enable new technologies by reflecting light in uncanny ways

10/17/2014  As in Alice’s journey through the looking-glass to Wonderland, mirrors in the real world can sometimes behave in surprising and unexpected ways, including a new class of mirror that works like no other.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

More Webcasts

EVENTS

MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014
2014 IEEE International Electron Device Meeting
San Francisco, CA
http://www.his.com/~iedm/
December 15, 2014 - December 17, 2014
International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015

FINANCIALS

NEW COMMENTS


MEMS devices for biomedical applications
Top 5 counterfeited semiconductors: Analog ICs top the list
EUV and mask complexity

NEW PRODUCTS

VaporSorb filter line protects advanced yield production from Entegris
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....
SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...