Global Market Map
Straits TMS 3,341.46 (0.55%)
Bolsa 45,464.75 (-0.09%)
ASX 5,648.90 (0.26%)
451.79 (0.14%)
HSI 24,918.75 (-0.62%)
Bovespa 59,821.45 (0.14%)
CSE 5,966.06 (0.00%)
BSE 26,560.15 (0.44%)
IPSA 3,697.79 (0.00%)
DAX 9,569.71 (-0.19%)
MerVal 5,880.84 (0.00%)
Dow 17,106.70 (0.17%)
JCI 4,685.89 (0.00%)
S&P/TSX 15,568.37 (-0.33%)
KOSPI 2,074.93 (0.33%)
6,830.66 (0.12%)
SHANG 2,209.47 (0.11%)
NIKKEI 15,534.82 (0.09%)
Global Markets By Region
Americas Price Change (%) 1 Year % Last Updated
flag Toronto Composite DAILY 15,619.21
+20.47 (0.13%)
Aug 27, 2:54pm
flag Mexican Bolsa IPC Index DAILY 45,464.75
-39.59 (-0.09%)
Aug 27, 2:54pm
flag Brazil Bovespa Index DAILY 59,821.45
+86.28 (0.14%)
Aug 27, 2:54pm
flag Argentina Merval Index DAILY 5,880.84
+0.00 (0.00%)
Aug 27, 2:54pm
flag Chile IPSA Index DAILY 3,697.79
+0.00 (0.00%)
Aug 27, 2:54pm
Asian Pacific Price Change (%) 1 Year % Last Updated
flag Nikkei 225 Index DAILY 15,534.82
+13.60 (0.09%)
Aug 27, 2:54pm
flag ASX All Ordinaries DAILY 5,648.90
+14.40 (0.26%)
Aug 27, 2:54pm
flag Seoul Composite DAILY 2,074.93
+6.88 (0.33%)
Aug 27, 2:54pm
flag Hong Kong Hang Seng DAILY 24,918.75
-155.75 (-0.62%)
Aug 27, 2:54pm
flag Shanghai DAILY 2,209.47
+2.36 (0.11%)
Aug 27, 2:54pm
flag Taiwan Weighted DAILY 9,485.59
+91.63 (0.98%)
Aug 27, 2:54pm
flag Singapore Straits Times DAILY 3,341.46
+18.44 (0.55%)
Aug 27, 2:54pm
flag Bombay Sensex Index DAILY 26,560.15
+117.34 (0.44%)
Aug 27, 2:54pm
flag Jakarta Composite DAILY 4,685.89
+0.00 (0.00%)
Aug 27, 2:54pm
flag Kuala Lumpur Composite DAILY 1,832.26
+0.00 (0.00%)
Aug 27, 2:54pm
flag PSE Composite DAILY 7,516.24
+0.00 (0.00%)
Aug 27, 2:54pm
flag Sri Lanka All Share DAILY 5,966.06
+0.00 (0.00%)
Aug 27, 2:54pm
Europe Price Change (%) 1 Year % Last Updated
flag FTSE DAILY 6,830.66
+7.90 (0.12%)
Aug 27, 2:54pm
flag Paris CAC 40 DAILY 4,395.26
+1.85 (0.04%)
Aug 27, 2:54pm
flag Frankfurt Index DAILY 9,569.71
-18.44 (-0.19%)
Aug 27, 2:54pm
flag Belgium 20 Index DAILY 3,210.07
+6.31 (0.20%)
Aug 27, 2:54pm
flag Swiss Market Index DAILY 8,669.80
-3.49 (-0.04%)
Aug 27, 2:54pm
flag OSE Norway All Share DAILY 683.45
+1.06 (0.16%)
Aug 27, 2:54pm
flag ATX Vienna DAILY 2,339.39
+5.11 (0.22%)
Aug 27, 2:54pm
flag Amsterdam Total Return General DAILY 413.19
+0.26 (0.06%)
Aug 27, 2:54pm
flag Madrid General DAILY 1,104.70
+13.43 (1.23%)
Aug 27, 2:54pm
flag IBEX 35 225 Index DAILY 10,837.40
+10.50 (0.10%)
Aug 27, 2:54pm
flag OMXS-ALL SHARE INDX  451.79
+0.62 (0.14%)
Aug 27, 12:50pm
Africa/Middle East Price Change (%) 1 Year % Last Updated
+13.32 (0.26%)
Aug 27, 6:45am
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Overlay Metrology Suite for Multiple Patterning
08/26/2014KLA-Tencor releases WaferSight PWG, LMS IPRO6, and K-T Analyzer 9.0 to control overlay and critical dimension (CD) in advanced IC fabs....
Intel and Unity Technologies announce collaboration
08/21/2014Intel Corporation and Unity Technologies today announced a strategic collaboration to advance the development of Android-based applications on Intel ...
Intel releases new packaging, test technologies for 14nm foundries
08/27/2014Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging ...
Fairchild Semiconductor to close two facilities, cutting 15% of workforce
08/25/2014Fairchild Semiconductor, a supplier of high performance power and mobile products, today announced it will eliminate its intern...





Competition for graphene

08/27/2014  A new argument has just been added to the growing case for graphene being bumped off its pedestal as the next big thing in the high-tech world by the two-dimensional semiconductors known as MX2 materials.

SemiLEDs launches EF FlipChip LED series

08/27/2014  SemiLEDs Corporation, a global provider of vertical LED technology solutions, today announced sampling and volume availability of the first in its new Enhanced FlipChip, or EF, LED series.

Scientists craft a semiconductor only three atoms thick

08/27/2014  Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick.

Lean strategies and decentralized value chains fuel RFID uptake in manufacturing

08/27/2014  New analysis from Frost & Sullivan, Analysis of the Global RFID in Manufacturing Market, finds that the market earned revenues of $1.29 billion in 2013 and estimates this to nearly quadruple to $4.99 billion in 2020.

Plastic electronics: Opportunity on the edge of commercialization

08/27/2014  The Plastics Electronics Conference and Exposition will co-locate with SEMICON Europa. Plastic Electronics 2014 (PE 2014) is themed “Enabling Applications beyond Limits in Electronics” and will be held at Alpexpo in Grenoble on 7-9 October.

Renasas introduces new package for safety systems for industrial equipment

08/26/2014  Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package.

In rapidly changing display industry, metal oxide TFT backplanes are promising

08/26/2014  MarketResearchReports.Biz released a new market research report this week entitled "Metal Oxide TFT Backplanes For Displays 2014-2024: Technologies, Forecasts, Players."

S2C opens Korean office and appoints country manager

08/26/2014  S2C, Inc. announced today the opening of a direct sales and support office in Seoul, Korea, appointing Suk-Ha Lee (SH Lee) as country manager.

New ClassOne electroplater a "sellout" at SEMICON West

08/25/2014  When ClassOne Technology introduced its new Solstice electroplating systems at SEMICON West last month they didn’t expect to actually sell their first production unit off the show floor, but that’s what happened.

JEDEC releases LPDDR4 Standard for low power memory devices

08/25/2014  JEDEC Solid State Technology Association today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4).

ESI appoints new board member

08/25/2014  Electro Scientific Industries, Inc., a supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that Richard H. Wills, former Chairman and Chief Executive Officer of Tektronix, Inc., was appointed to the company’s Board of Directors.

SRC TECHCON 2014 Conference to feature speakers from GLOBALFOUNDRIES, LinkedIn, High Point University

08/25/2014  The TECHCON 2014 conference hosted by Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, will feature immediate past GLOBALFOUNDRIES CEO Ajit Manocha among the list of executive speakers at the Sept. 7-9 annual event.

The Week in Review: August 22, 2014

08/22/2014  Collaboration for next-generation smart glasses; Book-to-bill ratio holds steady in July; Intel and Unity to collaborate; MediaTek launches new R&D facility; Amkor appoints new member to board of directors; STATS ChipPAC achieves shipping milestone

The Week in Review: August 15, 2014

08/15/2014  The growing semiconductor market in India; MEMSIC's monolithic, wafer-level packaged accelerometer; Si2 adds new director of 3DIC Programs; Worldwide silicon wafer area shipments increased during the second quarter 2014; LightFair announces Call for Speakers




Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers



September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:


Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts


SEMICON Taiwan 2014
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
September 29, 2014 - October 01, 2014



Conflict minerals from DRC
Fairchild Semiconductor to close two facilities, cutting 15% of workforce
Fairchild Semiconductor to close two facilities, cutting 15% of workforce


Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....