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Next generation dopant gas delivery system for ion implant applications
05/24/2018A new class of adsorbent materials offer high capacity storage and safe delivery of dopant gases....
Semi capex forecast to exceed $100B for the first time in 2018
05/22/2018IC Insights raises its full-year spending growth forecast for this year from 8% to 14%....
Ultra-violet lithography: Extending the patterning roadmap to 3nm
05/25/2018This year’s Advanced Lithography TechXPOT at SEMICON West will explore the progress on extreme ultra-violet lithography (EUVL) and it...
Memory device packaging: From leadframe to TSV
05/22/2018Memory devices employ a wide range of packaging technology from wire-bond leadframe and BGA to TSV....

Connect with Industry Experts at The ConFab 2018!

May 20 – 23, 2018





Global substrate-like PCB market: Need for miniaturization drives growth

05/25/2018  The global substrate-like PCB market will grow at a CAGR of over 7% during the forecast period, according to Technavio analysts.

Polymer crystals hold key to record-breaking energy transport

05/25/2018  Scientists from the universities of Bristol and Cambridge have found a way to create polymeric semiconductor nanostructures that absorb light and transport its energy further than previously observed.

Rare element to provide better material for high-speed electronics

05/25/2018  Purdue researchers have discovered a new two-dimensional material, derived from the rare element tellurium, to make transistors that carry a current better throughout a computer chip.

Microsemi continues to expand silicon carbide product portfolios

05/24/2018  Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it will be expanding its Silicon Carbide (SiC) MOSFET and SiC diode product portfolios early next quarter, including samples of its next-generation 1200-volt (V), 25 mOhm and 80 mOhm SiC MOSFET devices.

Silicon breakthrough could make key microwave technology much cheaper and better

05/24/2018  Researchers using powerful supercomputers have found a way to generate microwaves with inexpensive silicon, a breakthrough that could dramatically cut costs and improve devices such as sensors in self-driving vehicles.

Switching with molecules

05/24/2018  Molecular switch will facilitate the development of pioneering electro-optical devices.

Lumentum orders Veeco MOCVD system

05/23/2018  Veeco Instruments Inc. announced that Lumentum Holdings Inc. has ordered the Veeco K475i™Arsenide/Phosphide (As/P) Metal Organic Chemical Vapor Deposition (MOCVD) System for production of its advanced semiconductor components.

Brite Semiconductor joins SiFive's DesignShare program

05/23/2018  The company will be the first to offer DDR IP in the growing ecosystem.

Understanding light-induced electrical current in atomically thin nanomaterials

05/23/2018  Scientists demonstrated that scanning photocurrent microscopy could provide the optoelectronic information needed to improve the performance of devices for power generation, communications, data storage, and lighting.

North American semiconductor equipment industry posts April 2018 billings 

05/23/2018  April 2018 monthly billings for North American equipment manufacturers surpassed the October 2000 record high of $2.6 billion.

GLOBALFOUNDRIES announces industry's most advanced automotive-qualified production FD-SOI process technology

05/23/2018  Manufacturing certification for security, reliability and robustness provides customers with performance and power efficiency for automotive applications.

Kulicke & Soffa further extends LED capabilities

05/22/2018  Kulicke and Soffa Industries, Inc. today announced it has entered into a licensing agreement with Idaho, US based Rohinni LLC (Rohinni), to facilitate the design, commercialization and distribution of next-generation micro and mini LED solutions.

Cadence Design Systems and NI announce collaboration to simplify next-gen semiconductor and RF development

05/22/2018  Cadence Design Systems, Inc. and NI today announced a broad-ranging collaboration to improve the overall semiconductor development and test process of next-generation wireless, automotive and mobile integrated circuits (ICs) and modules.

IEEE International Electron Devices Meeting announces 2018 Call for Papers

05/22/2018  The 64th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 1-5, 2018, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

Cloud computing: the power to optimize manufacturing

05/22/2018  The cloud is an innovation fueled by advanced chip technology, but it has also been a model the industry hesitated to embrace.

SEMICON West adds WT | Wearable Technologies Conference co-location

05/22/2018  U.S. electronics manufacturing event expands with wearables program.

Market growth rate peaks after a strong 2017; IDC forecasts semiconductor revenue growth of 7.7%

05/21/2018  After strong year-over-year growth of 24% in 2017, worldwide semiconductor revenue is forecast to grow for the third consecutive year in 2018 to $450 billion, up 7.7% over 2017.

Micron and Intel extend their leadership in 3D NAND flash memory

05/21/2018  Micron Technology, Inc. (Nasdaq:MU), and Intel Corporation today announced production and shipment of the industry's first 4bits/cell 3D NAND technology.

Gases: Essential materials for display manufacturing

05/21/2018  Technology trends in backplane technology are driving higher gas demand in display manufacturing. Specific gas requirements of process blocks are discussed, and various supply modes are reviewed.



Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.


Featured Supplier

Yield Engineering Systems, Inc.: http://www.yieldengineering.com



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers


Enabling EUV and the patterning roadmap

Tuesday, June 5, 2018 at 1:00 p.m. ET

EUV lithography has steadily been gaining momentum in recent years and edges closer and closer to insertion in manufacturing. While considerable progress has been made and the first uses of EUV appear imminent, there remain some difficulties that will challenge the rate and degree to which EUV can be employed. This talk will aim to explore the patterning-related challenges that remain, summarize some of the ongoing efforts to tackle these challenges, and give an outlook towards the future.

Sponsored By:

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:


Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts


Design Automation Conference 2018
San Francisco, CA
June 24, 2018 - June 28, 2018

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Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...
Radiant Vision Systems announces new automated visual inspection system
11/06/2017Radiant Vision Systems, a provider of high-resolution imaging solutions for automated visual analysis of devices and surfaces, an...
SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...