Audio Pixels Holdings Limited (ASX:AKP) Technical Presentation at Acoustic and Microsystems Conference in France

Audio Pixels Holdings Limited (ASX:AKP) (PINK:ADPXY) is pleased to advise that the technical paper presented by Yuval Cohen, the CTO of Audio Pixels Limited at the Acoustics and Microsystems Conference held on 14-15 November 2011 in Le Mans, France is now available on the company web site at the following link:

http://www.audiopixels.com.au/index.cfm/investor/presentations/digital-loudspeakers-video/

The conference was organized and hosted by Professor Stéphane Durand, Department Head of LAUM the Acoustics Laboratories at the Université du Maine, France a leading academic and research institute specialising in acoustics and vibrations. The technical presentation is in two parts and was pitched to a specialist audience with a good understanding of the technical concepts of digital speakers.

Background

Audio Pixels Holdings Limited is company listed on the Australian Stock Exchange with the code AKP and has its ADR's listed on the OTC market in the USA with code ADPXY. Audio Pixels Holdings Limited owns 100% of Audio Pixels Limited, an unlisted Israeli corporation and was founded in July 2006 and has developed a revolutionary technological platform for reproducing sound, thus enabling the production of an entirely new generation of speakers that will exceed the performance specifications and design demands of the world's top consumer electronics manufacturers.

Audio Pixels patented technologies employ entirely new techniques to generate sound waves directly from a digital audio stream using low cost micro-electromechanical structures (MEMS) rather than conventional loudspeaker elements. This innovation enables the production of speaker products that deliver performance that is many orders of magnitude better than conventional speaker technologies, all in an affordable package that is only one millimetre thick.

Audio Pixels MEMS-based Digital Sound Reconstruction platform enables the market for audio speakers to follow the evolution of the video display market from large, heavy analog tube based monitors to the digital flat panel displays of today. Driving the rationale for change in audio speakers is the ever-increasing demand for smaller, thinner, clearer sounding, more power-efficient speakers. Conventional speaker technologies remain deeply rooted in the original voice coil inventions of Alexander Graham Bell. The inherent limitations of such speakers prohibit the delivery of quality sound in smaller packages. Audio Pixels innovative patents in the fields of electromechanical structures, pressure generation, acoustic wave generation and control, signal processing and packaging, combine to forever change this paradigm.

Market research overwhelmingly suggests that both manufacturers and consumers alike are starving for real innovation in audio speakers, in particular for good quality sound in a form factor that is far more compliant with current device and lifestyle trends. While the industry at large has been able to digitize and shrink all other device electronics, the last remaining barrier is the speaker, which remains large, heavy, bulky and extremely restrictive.

Upon achieving mass production capabilities Audio Pixels plans to sell and/or license its products to the manufacturers of speakers and consumer electronic devices worldwide, which collectively consume billions of speaker units annually. Audio Pixels will produce and sell a single type of silicon chip that can be used either as a standalone speaker or cascaded in any multiples of the same chip in order to achieve the desired performance specifications. This modular paradigm is entirely unique to the audio industry, which today expends significant resources designing and specifying new drivers, acoustic chambers and drive electronics for each new device. Audio Pixels innovative approach not only facilitates maximum flexibility to its customers, it further enables the customer to calibrate on the design and production of a singular product model, maximizing economies of scale, while limiting overhead associated with multiple versions of products.

Management maintains active exchange with industry leading companies spanning a broad cross section of the MEMS and consumer electronic industries. Audio Pixels Limited has already demonstrated the technology to potential customers and strategic partners.

About Audio Pixels Holdings Limited:

Audio Pixels Holdings Limited (ASX:AKP) was founded in July 2006 has developed a revolutionary technological platform for reproducing sound, thus enabling the production of an entirely new generation of speakers that will exceed the performance specifications and design demands of the world’s top consumer electronics manufacturers.

Contact:
Ian Dennis
Director
Audio Pixels Holdings Limited
Phone: +61-2-9233-3915
Email: iadennis@bigpond.net.au
 


Source:

Audio Pixels Holdings Limited

Copyright (C) 2011 ABN Newswire. All rights reserved.

Stock Market XML and JSON Data API provided by FinancialContent Services, Inc.
Nasdaq quotes delayed at least 15 minutes, all others at least 20 minutes.
Markets are closed on certain holidays. Stock Market Holiday List
By accessing this page, you agree to the following
Privacy Policy and Terms and Conditions.
Press Release Service provided by PRConnect.
Stock quotes supplied by Six Financial
Postage Rates Bots go here

TOP STORIES

EDITOR'S PICKS
FEATURED VIDEO
EDUCATION
BLOGS
Imec, Coventor partner to advance CMOS process development
10/28/2014Imec researchers using Coventor’s SEMulator3D platform to model and optimize 7nm manufacturing technology....
Mergers, acquisitions reshape the automotive semi supplier landscape
10/22/2014Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been u...
RF and MEMS Technologies to Enable the IoT
10/24/2014Communications and energy-harvesting capabilities can be integrated into ubiquitous always-on smart nodes....
IBM to pay GlobalFoundries $1.5B to take over chip fabs
10/20/2014IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business....
Tune in to the Solid State Watch EUV available at 10nm; Mentor Graphics appoints new VP of Embedded Systems; ProPlus expands operations in Europe; Rudolph releases new SONUS technology

Click here for more videos

Tech Papers
Upcoming Webcasts
Metrology and Failure Analysis
Nov. 2014 (Date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, ...
Interconnects
Nov. 2014 (Date and time TBD) This webcast will examine the state-of-the-art in conductors and dielectrics, -- including ...
Miss a webcast? Watch it On-Demand Now
Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


SEMI extends ASMC Call for Papers deadline to November 10

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

Synopsys announces availability of DesignWare, non-volatile memory IP for TowerJazz 180nm process technology

10/30/2014  Synopsys, Inc. today announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

SEMICON Japan 2014: New venue and new ideas for rebounding industry

10/29/2014  Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

TSI Semiconductors and Silvaco extend collaboration to accelerate launch of 0.25um BCDMOS process

10/29/2014  Silvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) today announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology.

MegaChips to acquire SiTime for $200M

10/29/2014  SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.

TSMC, Kilopass deliver non-volatile memory for the 16nm finFET process node

10/28/2014  Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

UMC enters volume production for Lantiq's Communication ICs

10/28/2014  United Microelectronics Corporation, a global semiconductor foundry, and Lantiq, a supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq's SPT170 high voltage Power Management ICs.

Intersil announces appointment of industry executives to board of directors

10/28/2014  Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of two accomplished executives to its board of directors, bringing the total number of independent directors to nine.

SMIC and ASML sign volume purchase agreement

10/27/2014  Semiconductor Manufacturing International Corporation and ASML Holding N.V. announce the signing of a volume purchase agreement that will provide SMIC with lithography systems from ASML.

KLA-Tencor reveals 'leveraged recapitalization' plan and an expanded stock repurchase program

10/24/2014  Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.

IMAPS Award Winners for 2014

10/24/2014  At the IMAPS (International Microelecronics & Packaging Society) meeting last week, several of their key annual awards were given out.

New 3D display technology promises greater energy efficiency

10/23/2014  LCD technology developed in Hong Kong maintains the 3D images it displays without drawing power.

STMicroelectronics tops five billion MEMS sensors shipped

10/23/2014  Beyond gaming systems, smartphones, tablets, navigation systems, and other widely adopted applications, ST’s sensors have also been used in thousands of other useful, fun, and valuable applications.

Intematix appoints Jerry Turin as CFO

10/23/2014  Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, today announced Jerry Turin as the company's Chief Financial Officer.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Interconnects

Nov. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

More Webcasts

EVENTS

MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014
2014 IEEE International Electron Device Meeting
San Francisco, CA
http://www.his.com/~iedm/
December 15, 2014 - December 17, 2014
International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015

FINANCIALS

NEW COMMENTS


MegaChips to acquire SiTime for $200M
SEMI approves first HB-LED standards
Cree's new SC5 Technology Platform doubles light output to radically lower system cost

NEW PRODUCTS

VaporSorb filter line protects advanced yield production from Entegris
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....
SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...