December 15, 2011 at 21:40 PM EST
Technical Presentation at Acoustic and Microsystems Conference in France

SYDNEY, Dec. 15, 2011 /PRNewswire-Asia/ -- Audio Pixels Holdings Limited (AKP:ASX; OTC:ADPXY) is pleased to advise that the technical paper presented by Yuval Cohen, the CTO of Audio Pixels Limited at the Acoustics and Microsystems Conference held on 14-15 November 2011 in Le Mans, France is now available on the company web site at the following link:

http://www.audiopixels.com.au/index.cfm/investor/presentations/digital-loudspeakers-video/

The conference was organized and hosted by Professor Stephane Durand, Department Head of LAUM the Acoustics Laboratories at the Universite du Maine, France a leading academic and research institute specialising in acoustics and vibrations. The technical presentation is in two parts and was pitched to a specialist audience with a good understanding of the technical concepts of digital speakers.

About Audio Pixels Holdings Limited

Audio Pixels Holdings Limited is company listed on the Australian Stock Exchange with the code AKP and has its ADR's listed on the OTC market in the USA with code ADPXY. Audio Pixels Holdings Limited owns 100% of Audio Pixels Limited, an unlisted Israeli corporation and was founded in July 2006 and has developed a revolutionary technological platform for reproducing sound, thus enabling the production of an entirely new generation of speakers that will exceed the performance specifications and design demands of the world's top consumer electronics manufacturers.

Audio Pixels patented technologies employ entirely new techniques to generate sound waves directly from a digital audio stream using low cost micro-electromechanical structures (MEMS) rather than conventional loudspeaker elements. This innovation enables the production of speaker products that deliver performance that is many orders of magnitude better than conventional speaker technologies, all in an affordable package that is only one millimetre thick.

Audio Pixels MEMS-based Digital Sound Reconstruction platform enables the market for audio speakers to follow the evolution of the video display market from large, heavy analog tube based monitors to the digital flat panel displays of today. Driving the rationale for change in audio speakers is the ever-increasing demand for smaller, thinner, clearer sounding, more power-efficient speakers. Conventional speaker technologies remain deeply rooted in the original voice coil inventions of Alexander Graham Bell. The inherent limitations of such speakers prohibit the delivery of quality sound in smaller packages. Audio Pixels innovative patents in the fields of electromechanical structures, pressure generation, acoustic wave generation and control, signal processing and packaging, combine to forever change this paradigm.

Market research overwhelmingly suggests that both manufacturers and consumers alike are starving for real innovation in audio speakers, in particular for good quality sound in a form factor that is far more compliant with current device and lifestyle trends. While the industry at large has been able to digitize and shrink all other device electronics, the last remaining barrier is the speaker, which remains large, heavy, bulky and extremely restrictive.

Upon achieving mass production capabilities Audio Pixels plans to sell and/or license its products to the manufacturers of speakers and consumer electronic devices worldwide, which collectively consume billions of speaker units annually. Audio Pixels will produce and sell a single type of silicon chip that can be used either as a standalone speaker or cascaded in any multiples of the same chip in order to achieve the desired performance specifications. This modular paradigm is entirely unique to the audio industry, which today expends significant resources designing and specifying new drivers, acoustic chambers and drive electronics for each new device. Audio Pixels innovative approach not only facilitates maximum flexibility to its customers, it further enables the customer to calibrate on the design and production of a singular product model, maximizing economies of scale, while limiting overhead associated with multiple versions of products.

Management maintains active exchange with industry leading companies spanning a broad cross section of the MEMS and consumer electronic industries. Audio Pixels Limited has already demonstrated the technology to potential customers and strategic partners.

Forward-looking statements

This release may contain certain forward-looking statements with respect to the financial condition, results of operations and business of AKP and certain of the plans and objectives of AKP with respect to these items. By their nature, forward-looking statements involve risk and uncertainty because they relate to events and depend on circumstances that will occur in the future and there are many factors that could cause actual results and developments to differ materially from those expressed or implied by these forward-looking statements.

CONTACT:

Ian Dennis
Director
Audio Pixels Holdings Limited
Telephone: +61-2-9233-3915

SOURCE Audio Pixels Holdings Limited

Stock Market XML and JSON Data API provided by FinancialContent Services, Inc.
Nasdaq quotes delayed at least 15 minutes, all others at least 20 minutes.
Markets are closed on certain holidays. Stock Market Holiday List
By accessing this page, you agree to the following
Privacy Policy and Terms and Conditions.
Press Release Service provided by PRConnect.
Stock quotes supplied by Six Financial
Postage Rates Bots go here

EDITORS' PICKS


GLOBALFOUNDRIES and Samsung join forces on 14nm finFETs
04/17/2014GLOBALFOUNDRIES and Samsung are announcing a joint program for 14nm FinFETs that offers a single process design kit (PDK) and manufacturing at fo...
Catching the (invisible) wave
04/11/2014UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applicatio...
 
Dow Corning moves to defend Chinese patent for LED optical silicone encapsulants
04/17/2014Dow Corning filed a complaint through its Chinese subsidiary and licensee with the Shanghai First Intermediate Court. ...
Scalable CVD process for making 2-D molybdenum diselenide
04/10/2014Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method fo...

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


SEMI announces 2nd Vietnam Semiconductor Strategy Summit

04/18/2014  Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

LG-Swiss researchers announce graphene membrane breakthrough

04/18/2014  The findings open up the possibility in the future to develop highly efficient filters to treat air and water.

In the permanent bonding market, EV Group is leading, Applied Materials and Tokyo Electron are merging

04/18/2014  Permanent bonding technology is a key process for a wide range of applications in the semiconductor industry such as MEMS, advanced packaging, LED devices, and SOI substrate applications.

Global scientific team "visualizes" a new crystallization process

04/17/2014  Sometimes engineers invent something before they fully comprehend why it works. To understand the "why," they must often create new tools and techniques in a virtuous cycle that improves the original invention while also advancing basic scientific knowledge.

MKS introduces dynamic frequency tuning patented DFT technology offered in RF plasma generators

04/17/2014  MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced Dynamic Frequency Tuning (DFT) technology in RF plasma generators.

Deca Technologies ships 100-millionth wafer-level packaged component

04/16/2014  Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component.

Dynaloy scientists to highlight time- and money-saving benefits of new single wafer cleaning technology

04/16/2014  Scientists from Dynaloy, LLC and EV Group will explain a new, one-step cleaning process for removing negative dry film and negative spin-on film photoresist on April 24, 2014 at the SEMATECH Surface Preparation and Cleaning Conference in Austin, Texas.

SMIC appoints Hiroshi Ogawa as General Manager of SMIC Japan

04/15/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that Hiroshi Ogawa was appointed as General Manager of SMIC Japan Corporation.

Mentor Graphics design and verification tools certified for TSMC 16nm FinFET production

04/15/2014  Mentor Graphics Corp. today announced that its IC design to silicon solution has achieved certification for TSMC's Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process.

Shiny quantum dots brighten the future of solar cells

04/14/2014  A house window that doubles as a solar panel could be on the horizon, thanks to recent quantum-dot work by Los Alamos National Laboratory researchers in collaboration with scientists from University of Milano-Bicocca (UNIMIB), Italy.

SEMI reports 2013 semiconductor photomask sales of $3.1B

04/14/2014  SEMI reports that the worldwide semiconductor photomask market was $3.1 billion in 2013 and is forecasted to reach $3.3 billion in 2015.

KLA-Tencor Corporation receives Intel’s Preferred Quality Supplier Award

04/11/2014  KLA-Tencor Corporation has been recognized as one of 18 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2013.

The Week in Review: April 11, 2014

04/11/2014  SIA reports sales of semiconductors in February 2014 increased 11.4 percent from February 2013; GSA celebrates 20 years; SEMI expanding Innovation Village at SEMICON Europa

IP interoperability in SoCs: Mix and match doesn’t always work

03/26/2014  More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified specifications that inevitably raise the bar for performance and power usage, and it will probably contain new IP that must be integrated.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS

Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

EVENTS

The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014

FINANCIALS

NEW COMMENTS


Current and future trends in vacuum process technology
Catching the (invisible) wave
UV LED Curing for the Electronics Industry

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...