As millions of college students prepare to head off to spring break,
Sallie Mae, the nation’s No. 1 financial services company specializing
in education, offers students and their parents greater peace of mind
through its travel insurance program.
“Spring break should be a well-deserved time of fun and relaxation for
college students,” said Charlie Rocha, senior vice president, Sallie
Mae. “Travel insurance gives students and their parents the security of
knowing that their vacation plans, and more importantly their safety,
can be well protected.”
Offered through the recently launched Sallie Mae Insurance Services,
travel insurance includes the critical benefit of trip interruption
insurance and other services to meet the needs of a typical college
student. A sudden late snow storm or stomach bug can turn a welcome
break from the books into a loss of thousands of dollars. Generally
costing 4 percent of total trip cost, travel insurance is a small
investment to protect the cost of a trip. In fact, students can purchase
travel insurance right up until their departure date.
Sallie Mae’s travel insurance benefits include:
Sallie Mae’s travel insurance helps ensure that students’ needs will be
met in the event of a trip cut short due to weather conditions or when
the fun comes to an end because of a medical issue. To learn more, visit www.SallieMae.com/insurance.
Sallie Mae (NASDAQ: SLM) is the nation’s No. 1 financial services
company specializing in education. Whether college is a long way off or
just around the corner, Sallie Mae turns education dreams into reality
for its 25 million customers. With products and services that include
college savings programs, scholarship search tools, education loans,
tuition insurance, and online banking, Sallie Mae offers solutions that
help families save, plan, and pay for college. Sallie Mae also provides
financial services to hundreds of college campuses as well as to federal
and state governments. Learn more at SallieMae.com. Commonly known as
Sallie Mae, SLM Corporation and its subsidiaries are not sponsored by or
agencies of the United States of America.
07/28/2014 Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.
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07/25/2014 New approaches to start-ups can unlock mega-trend opportunities.
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07/23/2014 Peregrine Semiconductor Corporation, founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, and RF Micro Devices, Inc., a designer and manufacturer of high-performance radio frequency solutions, today announced that they have settled all outstanding claims between the companies.
07/23/2014 Micron Technology, Inc. and TechInsights today announced that Micron has been honored with both the Most Innovative Memory Device and Semiconductor of the Year awards for their 16nm NAND Flash memory technology in TechInsights' 11th Annual Insight Awards.
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07/23/2014 Graphene, a material that consists of a lattice of carbon atoms, one atom thick, is widely touted as being the most electrically conductive material ever studied. However, not all graphene is the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function.
07/23/2014 A Berkeley Lab-Intel collaboration outlines the chemistry of photoresist, enabling smaller features for future generations of microprocessors.
07/23/2014 OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.
This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment.
May 22, 2014Sponsored by Diamond-MT
Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014Sponsored by Master Bond, Inc.,
Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014Sponsored by Mentor Graphics
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July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.
August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.