Audio Pixels Holdings Ltd Sponsored ADR (OP: ADPXY)
8.040 USD  -0.080 (-0.99%)
Streaming Delayed Price  /  Updated: 10:14 AM EDT, May 22, 2015  /  Add to My Watchlist      
Price and Volume
Price 8.040
Open 7.400
Prev. Close 8.120
Change
-0.08
% Change
-0.99%
Bid (Size) N/A (0)
Ask (Size) N/A (0)
High 8.040
Low 7.400
52 Week High 12.94
52 Week Low 4.070
EPS N/A
Price / Earnings N/A
Dividend Yield N/A
Shares Outstanding N/A
Volume 7,761
Average Volume (3 Mo) 675
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Price Performance
YTD
-0.18 (-2.18%)
1 Month
+0.51 (6.84%)
3 Month
+0.94 (13.24%)
6 Month
-1.05 (-11.55%)
1 Year
+4.48 (125.84%)
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EDITOR'S PICKS
FEATURED VIDEO
EDUCATION
BLOGS
New Applied PVD system targets TiN hardmasks for 10nm, 7nm chips
05/19/2015Applied Materials introduced the Applied Endura Cirrus HTX PVD, a physical vapor deposition system for creating titanium nitride hardmas...
IBM's silicon photonics technology ready to speed up cloud and Big Data applications
05/12/2015IBM today announced a significant milestone in the development of silicon photonics technology, which enables silico...
Growing in maturity, the MEMS industry is getting its second wind
05/19/2015In 2014, the MEMS sector represented an $11.1B business for Si-based devices. According to Yole Développement (Yole) latest MEMS repor...
First quarter semiconductor sales up 6% compared to last year
05/04/2015The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $83.1 billion during the first quart...
Tune in to the Solid State Watch

First quarter semiconductor sales up 6% compared to last year; New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead; Microchip and GlobalFoundries announce new55nm embedded NVM; ASE and TDK announce plans for joint venture agreement

Click here for more videos

Tech Papers
Upcoming Webcasts
Sensor Fusion and the Role of MEMS in IoT
Thursday May 28, 2015 at 1:00 p.m. EST MEMS have quite different process and material requirements compared to ...
Interconnects
June 2015 (Date and time TBD) This webcast will examine the state-of-the-art in conductors and dielectrics, -- including ...
Miss a webcast? Watch it On-Demand

Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings

05/21/2015  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Research institutes globally invest in Oxford Instruments' plasma systems for graphene and 2D materials development

05/21/2015  As developments in graphene and 2D materials technology continue to increase, research institutes globally are investing in Oxford Instruments’ plasma processing Nanofab equipment using CVD, PECVD and ICPCVD techniques to further their work in this important area.

Advantest develops semiconductor circuit analysis terahertz technology

05/21/2015  Semiconductor test equipment supplier Advantest Corporation announced today that it has developed a technology utilizing short-pulse terahertz waves for analysis of electrical circuits.

Samtec joins IRT Nanoelec Silicon Photonics Program

05/21/2015  Samtec, Inc., a supplier of high-speed interconnects, microelectronics, and micro-optical solutions, is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec.

SRC awarded NIST funding to develop Semiconductor Synthetic Biology Consortium

05/21/2015  Semiconductor Research Corporation announced that it has received funding from the National Institute of Standards and Technology (NIST) Advanced Manufacturing Technology (AMTech) program to create a Semiconductor Synthetic Biology (SemiSynBio) consortium whose mission is to develop a SemiSynBio roadmap.

Six top 20 semiconductor suppliers show >20% growth

05/21/2015  SK Hynix moves into top 5, MediaTek climbs into top 10, and Sharp and UMC move into the top 20 ranking.

3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory market

05/21/2015  Ever growing volumes of data to be stored and accessed, and advancing process technologies for sophisticated control of deposition and etch in complex stacks of new materials, are creating a window of opportunity for an emerging variety of next-generation non-volatile memory technologies.

imec and Tokyo Electron demonstrate electrical advantages of direct Cu etch scheme for advanced interconnects

05/20/2015  Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects.

GLOBALFOUNDRIES offers new low-power 28nm solution for high-performance mobile and IoT applications

05/20/2015  Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs.

Advantest launches its first integrated test solution for optical transceivers

05/19/2015  Semiconductor test equipment supplier Advantest Corporation has introduced its new 28G OPM (28-gigabit Optical Port Module), the company's first solution designed specifically for testing optical transceivers.

Freescale introduces its first GaN RF power transistor for cellular base stations

05/19/2015  Freescale Semiconductor today introduced its first gallium nitride (GaN) RF power transistor for cellular base stations.

Peregrine Semiconductor announces new general manager VP

05/19/2015  Peregrine Semiconductor Corp., founder of RF SOI, today announced the promotion of Duncan Pilgrim to vice president and general manager of the newly formed high performance analog (HPA) business unit.

Computing at the speed of light

05/19/2015  University of Utah engineers have taken a step forward in creating the next generation of computers and mobile devices capable of speeds millions of times faster than current machines.

EV Group NILphotonics Competence Center sees strong demand For emerging photonic applications

05/19/2015  Newly launched center assisting customers in developing products and applications in photonics; leads to multiple system orders.

MORE ANALYSIS & FEATURES


Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Sensor Fusion and the Role of MEMS in IoT

Thursday May 28, 2015 at 1:00 p.m. EST

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
More Webcasts

EVENTS

65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...