Bruker Corporation (NQ: BRKR)
19.61 USD  -0.32 (-1.61%)
Official Closing Price  /  Updated: 8:10 PM EDT, Apr 17, 2015  /  Add to My Watchlist      
Other Filings
Form DEF 14A
Source: SEC/Edgar
April 14, 2015
Form 8-K
Source: SEC/Edgar
February 23, 2015
Form 8-K
Source: SEC/Edgar
February 19, 2015
Form SC 13G
Source: SEC/Edgar
February 13, 2015
Form SC 13G/A
Source: SEC/Edgar
February 11, 2015
Form SC 13G/A
Source: SEC/Edgar
February 10, 2015
Form 8-K
Source: SEC/Edgar
February 02, 2015
Form 8-K
Source: SEC/Edgar
December 15, 2014
Form 8-K
Source: SEC/Edgar
November 17, 2014
Form 8-K
Source: SEC/Edgar
November 06, 2014
Form 8-K
Source: SEC/Edgar
August 06, 2014
Form 8-K
Source: SEC/Edgar
July 23, 2014
Form SD
Source: SEC/Edgar
May 30, 2014
Form 8-K
Source: SEC/Edgar
May 20, 2014
Form 8-K
Source: SEC/Edgar
May 07, 2014
Form ARS
Source: SEC/Edgar
April 17, 2014
Form DEF 14A
Source: SEC/Edgar
April 16, 2014
Form 8-K
Source: SEC/Edgar
February 19, 2014
Form 8-K
Source: SEC/Edgar
February 18, 2014
Form SC 13G/A
Source: SEC/Edgar
February 12, 2014
Form SC 13G/A
Source: SEC/Edgar
February 11, 2014
Form 8-K
Source: SEC/Edgar
January 13, 2014
Form 8-K
Source: SEC/Edgar
November 01, 2013
Form 8-K
Source: SEC/Edgar
July 31, 2013
Form SC 13G/A
Source: SEC/Edgar
May 23, 2013
Form 8-K
Source: SEC/Edgar
May 16, 2013
Form 8-K
Source: SEC/Edgar
May 13, 2013
Form 8-K
Source: SEC/Edgar
May 02, 2013
Form ARS
Source: SEC/Edgar
April 11, 2013
Form DEF 14A
Source: SEC/Edgar
April 10, 2013
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EDITOR'S PICKS
FEATURED VIDEO
EDUCATION
BLOGS
Global semiconductor sales increase in February compared to last year
04/06/2015The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $27.8 billion for the month of Feb...
2014 top MEMS players ranking: Rising of the first MEMS titan
03/24/2015With an impressive 20 percent growth in MEMS revenue compared to 2013, and sales revenues of more than $1.2B, Robert Bosch GmbH is the clea...
Silicon Summit speakers look at the future of chip technology
04/17/2015GSA's Silicon Summit at the Computer History Museum in Mountain View, Calif., not far from Google’s headquarters, was dominated by talk ...
U.S.-headquartered companies capture bulk of IDM, fabless IC sales
04/03/2015Recent acquisitions expeted to boost Europe's share in coming years....
Tune in to the Solid State Watch

Cypress and Spansion complete merger; Strong fab equipment spending forecast for 2015; 11 IC product categories to exceed total IC market growth in 2015; Global mobile phone display module shipments signal stronger competition among manufacturers

Click here for more videos

Tech Papers
Upcoming Webcasts
3D Integration: The Most Effective Path for Future IC Scaling
Thursday, April 23, 2015 at 12:00 p.m. EST It is well recognized that dimensional scaling has reached its ...
Trends in Materials: The Smartphone Driver
Thursday, April 30, 2015 at 1:00 p.m. EST To understand 3-D FinFET doping and high mobility channel material, ...
Miss a webcast? Watch it On-Demand

Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

MAGAZINE




BLOGS


IoT and The ConFab 2015
February 25, 2015

TWITTER


NEWS ANALYSIS & FEATURES


Engineer improves rechargeable batteries with MoS2 nano 'sandwich'

04/17/2015  The key to better cellphones and other rechargeable electronics may be in tiny "sandwiches" made of nanosheets, according to mechanical engineering research from Kansas State University.

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale

04/17/2015  Total top 10 marketshare of semiconductor industry now back over 50 percent.

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

San'an licenses Japanese LED patent portfolio to Luminus Devices

04/16/2015  San'an Optoelectronics Co., Ltd. today announced that it has licensed the United States patents of an LED patent portfolio it recently acquired from a major Japanese company to its subsidiary, Luminus Devices, Inc.

Semiconductor CEOs urge congress to enact Trade Promotion Authority

04/16/2015  The SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter today to congressional leaders expressing support for the legislation and urging its swift passage.

KLA-Tencor introduces new portfolio for advanced semiconductor packaging

04/16/2015  Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

Samsung Galaxy S6 Edge pricier to build, cheaper to buy than comparable Apple iPhone 6 Plus

04/16/2015  The recently released Samsung Galaxy S6 Edge is the most expensive Galaxy S line smartphone yet built, but has a lower retail price than a comparable iPhone 6 Plus, according to a preliminary estimate by IHS and its Technology Mobile Handsets Intelligence Service.

A*STAR's IME and partners to enable low cost packaging technology for system scaling within smart devices

04/15/2015  A*STAR’s Institute of Microelectronics (IME), together with industry partners, have formed a High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium to extend FOWLP capabilities for applications in devices such as smart phones, tablets, navigation tools and gaming consoles.

Solution-grown nanowires make the best lasers

04/14/2015  Take a material that is a focus of interest in the quest for advanced solar cells. Discover a "freshman chemistry level" technique for growing that material into high-efficiency, ultra-small lasers. The result, disclosed Monday, April 13 in Nature Materials, is a shortcut to lasers that are extremely efficient and able to create many colors of light.

Quantization of 'surface Dirac states' could lead to exotic applications

04/14/2015  Researchers from the RIKEN Center for Emergent Matter Science in Japan have uncovered the first evidence of an unusual quantum phenomenon--the integer quantum Hall effect--in a new type of film, called a 3D topological insulator.

ClassOne enters ECD lab partnership with Shanghai Sinyang

04/14/2015  Semiconductor equipment manufacturer ClassOne Technology announced today that it has signed a joint electrochemical deposition (ECD) applications lab agreement with Shanghai Sinyang Semiconductor Materials Co., Ltd.

GaN Systems seals distribution deal in Japan and Asia

04/14/2015  GaN Systems Inc., a developer of gallium nitride power switching semiconductors, today announced it has signed an agreement with Japanese semiconductor and electronic component distributor, Value Integrated Technology (Vitec).

Fifty years of Moore's Law made possible by semiconductor equipment and materials suppliers worldwide

04/14/2015  April 2015 marks the 50th anniversary of one of the business world’'s most profound drivers, now commonly referred to as Moore's Law.

SEMI seminar focuses on European packaging, assembly and test

04/14/2015  On June 18, the SEMI Packaging Tech Seminar will take place in Vila do Conde, Portugal.

MORE ANALYSIS & FEATURES


Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

More Technology Papers

WEBCASTS

3D Integration: The Most Effective Path for Future IC Scaling

Thursday, April 23, 2015 at 12:00 p.m. EST

It is well recognized that dimensional scaling has reached its diminishing return phase. The industry is now looking at monolithic 3D to be the future technology driver. Yet, until recently, the path to monolithic 3D has required the development of new transistor types and processes. This Webcast will present game-changing monolithic 3D process flows which use the existing transistor of existing manufacturing line and existing process flows. Now the most effective path for future IC scaling is indeed monolithic 3D, which offers the lowest development and manufacturing cost for future ICs.

Sponsored By:
Trends in Materials: The Smartphone Driver

Thursday, April 30, 2015 at 1:00 p.m. EST

To understand 3-D FinFET doping and high mobility channel material, this talk will first review the current doping and Fin/channel mobility enhancement techniques used for 22nm FinFET production by Intel for both high performance logic and SOC devices and the changes they made for their 2nd generation 14nm FinFET.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

EVENTS

SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...