Bruker Corporation (NQ: BRKR)
21.15 USD  UNCHANGED
Streaming Delayed Price  /  Updated: 8:10 PM EDT, Apr 17, 2014  /  Add to My Watchlist      
Historical Prices
Date Open High Low Close Volume Change (%)
May 31, 2005 4.000 4.490 4.000 4.200 237,663 +0.24(+6.06%)
May 27, 2005 4.000 4.000 3.940 3.960 59,415 -0.03(-0.75%)
May 26, 2005 4.000 4.000 3.960 3.990 72,183 -0.01(-0.25%)
May 25, 2005 3.950 4.030 3.850 4.000 184,933 +0.04(+1.01%)
May 24, 2005 4.000 4.020 3.920 3.960 114,600 -0.01(-0.25%)
May 23, 2005 3.900 4.040 3.900 3.970 189,323 +0.02(+0.51%)
May 20, 2005 3.990 3.990 3.880 3.950 90,762 -0.02(-0.50%)
May 19, 2005 4.070 4.070 3.860 3.970 193,377 -0.04(-1.00%)
May 18, 2005 4.020 4.050 3.930 4.010 216,900 +0.06(+1.52%)
May 17, 2005 3.920 4.060 3.830 3.950 209,903 +0.05(+1.28%)
May 16, 2005 3.870 3.900 3.800 3.900 80,349 +0.09(+2.36%)
May 13, 2005 3.900 3.970 3.800 3.810 143,851 -0.03(-0.78%)
May 12, 2005 3.630 3.940 3.560 3.840 470,053 +0.25(+6.96%)
May 11, 2005 3.590 3.680 3.420 3.590 135,621 +0.05(+1.41%)
May 10, 2005 3.690 3.700 3.470 3.540 100,110 -0.22(-5.85%)
May 09, 2005 3.600 3.760 3.590 3.760 47,499 +0.17(+4.74%)
May 06, 2005 3.600 3.840 3.440 3.590 187,178 -0.03(-0.83%)
May 05, 2005 3.550 3.700 3.450 3.620 142,671 +0.10(+2.84%)
May 04, 2005 3.420 3.530 3.400 3.520 75,049 +0.12(+3.53%)
May 03, 2005 3.250 3.420 3.180 3.400 55,812 +0.03(+0.89%)
May 02, 2005 3.220 3.390 3.160 3.370 145,060 +0.11(+3.37%)
Apr 29, 2005 3.120 3.310 3.120 3.260 79,259 +0.15(+4.82%)
Apr 28, 2005 3.130 3.180 3.110 3.110 100,069 -0.06(-1.89%)
Apr 27, 2005 3.120 3.200 3.070 3.170 24,511 +0.01(+0.32%)
Apr 26, 2005 3.260 3.330 3.120 3.160 80,374 -0.15(-4.53%)
Apr 25, 2005 3.310 3.310 3.240 3.310 32,090 +0.06(+1.85%)
Apr 22, 2005 3.330 3.370 3.230 3.250 67,222 -0.10(-2.99%)
Apr 21, 2005 3.390 3.390 3.270 3.350 77,630 +0.03(+0.90%)
Apr 20, 2005 3.350 3.400 3.290 3.320 55,632 -0.08(-2.35%)
Apr 19, 2005 3.400 3.440 3.350 3.400 30,302 +0.04(+1.19%)
Apr 18, 2005 3.200 3.460 3.200 3.360 38,799 +0.14(+4.35%)
Apr 15, 2005 3.330 3.400 3.210 3.220 50,974 -0.16(-4.73%)
Apr 14, 2005 3.350 3.490 3.350 3.380 32,827 +0.00(+0.00%)
Apr 13, 2005 3.610 3.610 3.350 3.380 305,851 -0.22(-6.11%)
Apr 12, 2005 3.600 3.660 3.570 3.600 48,124 -0.03(-0.83%)
Apr 11, 2005 3.550 3.680 3.500 3.630 138,331 +0.08(+2.25%)
Apr 08, 2005 3.650 3.650 3.540 3.550 18,792 -0.10(-2.74%)
Apr 07, 2005 3.650 3.670 3.510 3.650 41,982 +0.02(+0.55%)
Apr 06, 2005 3.700 3.750 3.610 3.630 53,345 -0.05(-1.36%)
Apr 05, 2005 3.750 3.830 3.670 3.680 143,602 -0.02(-0.54%)
Apr 04, 2005 3.440 3.740 3.440 3.700 81,211 +0.17(+4.82%)
Apr 01, 2005 3.550 3.570 3.490 3.530 72,781 +0.01(+0.28%)
Mar 31, 2005 3.450 3.530 3.330 3.520 49,785 +0.04(+1.15%)
Mar 30, 2005 3.330 3.490 3.310 3.480 135,168 +0.02(+0.58%)
Mar 29, 2005 3.440 3.500 3.390 3.460 72,607 +0.03(+0.87%)
Mar 28, 2005 3.450 3.490 3.380 3.430 121,166 +0.01(+0.29%)
Mar 24, 2005 3.210 3.480 3.190 3.420 77,842 +0.26(+8.23%)
Mar 23, 2005 3.240 3.300 3.160 3.160 78,187 -0.10(-3.07%)
Mar 22, 2005 3.210 3.400 3.210 3.260 98,038 +0.02(+0.62%)
Mar 21, 2005 3.440 3.470 3.240 3.240 208,316 -0.24(-6.90%)
Mar 18, 2005 3.450 3.640 3.440 3.480 155,084 -0.12(-3.33%)
Mar 17, 2005 3.550 3.650 3.440 3.600 127,357 +0.11(+3.15%)
Mar 16, 2005 3.950 3.950 3.460 3.490 387,222 -0.46(-11.65%)
Mar 15, 2005 3.900 4.090 3.830 3.950 294,163 +0.10(+2.60%)
Mar 14, 2005 3.730 3.900 3.550 3.850 124,626 +0.18(+4.90%)
Mar 11, 2005 3.830 3.960 3.560 3.670 113,932 -0.08(-2.13%)
Mar 10, 2005 3.810 3.830 3.690 3.750 119,644 +0.03(+0.81%)
Mar 09, 2005 3.850 4.000 3.720 3.720 244,655 -0.06(-1.59%)
Mar 08, 2005 3.790 3.880 3.750 3.780 59,373 +0.03(+0.80%)
Mar 07, 2005 3.900 3.900 3.730 3.750 102,413 -0.19(-4.82%)
Mar 04, 2005 4.050 4.050 3.900 3.940 61,235 +0.03(+0.77%)
Mar 03, 2005 3.800 4.050 3.800 3.910 196,108 +0.20(+5.39%)
Mar 02, 2005 3.580 3.780 3.510 3.710 46,602 +0.05(+1.37%)
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EDITORS' PICKS


GLOBALFOUNDRIES and Samsung join forces on 14nm finFETs
04/17/2014GLOBALFOUNDRIES and Samsung are announcing a joint program for 14nm FinFETs that offers a single process design kit (PDK) and manufacturing at fo...
Catching the (invisible) wave
04/11/2014UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applicatio...
 
Dow Corning moves to defend Chinese patent for LED optical silicone encapsulants
04/17/2014Dow Corning filed a complaint through its Chinese subsidiary and licensee with the Shanghai First Intermediate Court. ...
Scalable CVD process for making 2-D molybdenum diselenide
04/10/2014Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method fo...

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


SEMI announces 2nd Vietnam Semiconductor Strategy Summit

04/18/2014  Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

LG-Swiss researchers announce graphene membrane breakthrough

04/18/2014  The findings open up the possibility in the future to develop highly efficient filters to treat air and water.

In the permanent bonding market, EV Group is leading, Applied Materials and Tokyo Electron are merging

04/18/2014  Permanent bonding technology is a key process for a wide range of applications in the semiconductor industry such as MEMS, advanced packaging, LED devices, and SOI substrate applications.

Global scientific team "visualizes" a new crystallization process

04/17/2014  Sometimes engineers invent something before they fully comprehend why it works. To understand the "why," they must often create new tools and techniques in a virtuous cycle that improves the original invention while also advancing basic scientific knowledge.

MKS introduces dynamic frequency tuning patented DFT technology offered in RF plasma generators

04/17/2014  MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced Dynamic Frequency Tuning (DFT) technology in RF plasma generators.

Deca Technologies ships 100-millionth wafer-level packaged component

04/16/2014  Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component.

Dynaloy scientists to highlight time- and money-saving benefits of new single wafer cleaning technology

04/16/2014  Scientists from Dynaloy, LLC and EV Group will explain a new, one-step cleaning process for removing negative dry film and negative spin-on film photoresist on April 24, 2014 at the SEMATECH Surface Preparation and Cleaning Conference in Austin, Texas.

SMIC appoints Hiroshi Ogawa as General Manager of SMIC Japan

04/15/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that Hiroshi Ogawa was appointed as General Manager of SMIC Japan Corporation.

Mentor Graphics design and verification tools certified for TSMC 16nm FinFET production

04/15/2014  Mentor Graphics Corp. today announced that its IC design to silicon solution has achieved certification for TSMC's Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process.

Shiny quantum dots brighten the future of solar cells

04/14/2014  A house window that doubles as a solar panel could be on the horizon, thanks to recent quantum-dot work by Los Alamos National Laboratory researchers in collaboration with scientists from University of Milano-Bicocca (UNIMIB), Italy.

SEMI reports 2013 semiconductor photomask sales of $3.1B

04/14/2014  SEMI reports that the worldwide semiconductor photomask market was $3.1 billion in 2013 and is forecasted to reach $3.3 billion in 2015.

KLA-Tencor Corporation receives Intel’s Preferred Quality Supplier Award

04/11/2014  KLA-Tencor Corporation has been recognized as one of 18 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2013.

The Week in Review: April 11, 2014

04/11/2014  SIA reports sales of semiconductors in February 2014 increased 11.4 percent from February 2013; GSA celebrates 20 years; SEMI expanding Innovation Village at SEMICON Europa

IP interoperability in SoCs: Mix and match doesn’t always work

03/26/2014  More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified specifications that inevitably raise the bar for performance and power usage, and it will probably contain new IP that must be integrated.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS

Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

EVENTS

The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014

FINANCIALS

NEW COMMENTS


Current and future trends in vacuum process technology
Catching the (invisible) wave
UV LED Curing for the Electronics Industry

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...