Bruker Corporation (NQ: BRKR)
18.75 USD  +0.45 (+2.46%)
Official Closing Price  /  Updated: 5:20 PM EDT, Mar 30, 2015  /  Add to My Watchlist      
Historical Prices
Date Open High Low Close Volume Change (%)
May 31, 2005 4.000 4.490 4.000 4.200 237,663 +0.24(+6.06%)
May 27, 2005 4.000 4.000 3.940 3.960 59,415 -0.03(-0.75%)
May 26, 2005 4.000 4.000 3.960 3.990 72,183 -0.01(-0.25%)
May 25, 2005 3.950 4.030 3.850 4.000 184,933 +0.04(+1.01%)
May 24, 2005 4.000 4.020 3.920 3.960 114,600 -0.01(-0.25%)
May 23, 2005 3.900 4.040 3.900 3.970 189,323 +0.02(+0.51%)
May 20, 2005 3.990 3.990 3.880 3.950 90,762 -0.02(-0.50%)
May 19, 2005 4.070 4.070 3.860 3.970 193,377 -0.04(-1.00%)
May 18, 2005 4.020 4.050 3.930 4.010 216,900 +0.06(+1.52%)
May 17, 2005 3.920 4.060 3.830 3.950 209,903 +0.05(+1.28%)
May 16, 2005 3.870 3.900 3.800 3.900 80,349 +0.09(+2.36%)
May 13, 2005 3.900 3.970 3.800 3.810 143,851 -0.03(-0.78%)
May 12, 2005 3.630 3.940 3.560 3.840 470,053 +0.25(+6.96%)
May 11, 2005 3.590 3.680 3.420 3.590 135,621 +0.05(+1.41%)
May 10, 2005 3.690 3.700 3.470 3.540 100,110 -0.22(-5.85%)
May 09, 2005 3.600 3.760 3.590 3.760 47,499 +0.17(+4.74%)
May 06, 2005 3.600 3.840 3.440 3.590 187,178 -0.03(-0.83%)
May 05, 2005 3.550 3.700 3.450 3.620 142,671 +0.10(+2.84%)
May 04, 2005 3.420 3.530 3.400 3.520 75,049 +0.12(+3.53%)
May 03, 2005 3.250 3.420 3.180 3.400 55,812 +0.03(+0.89%)
May 02, 2005 3.220 3.390 3.160 3.370 145,060 +0.11(+3.37%)
Apr 29, 2005 3.120 3.310 3.120 3.260 79,259 +0.15(+4.82%)
Apr 28, 2005 3.130 3.180 3.110 3.110 100,069 -0.06(-1.89%)
Apr 27, 2005 3.120 3.200 3.070 3.170 24,511 +0.01(+0.32%)
Apr 26, 2005 3.260 3.330 3.120 3.160 80,374 -0.15(-4.53%)
Apr 25, 2005 3.310 3.310 3.240 3.310 32,090 +0.06(+1.85%)
Apr 22, 2005 3.330 3.370 3.230 3.250 67,222 -0.10(-2.99%)
Apr 21, 2005 3.390 3.390 3.270 3.350 77,630 +0.03(+0.90%)
Apr 20, 2005 3.350 3.400 3.290 3.320 55,632 -0.08(-2.35%)
Apr 19, 2005 3.400 3.440 3.350 3.400 30,302 +0.04(+1.19%)
Apr 18, 2005 3.200 3.460 3.200 3.360 38,799 +0.14(+4.35%)
Apr 15, 2005 3.330 3.400 3.210 3.220 50,974 -0.16(-4.73%)
Apr 14, 2005 3.350 3.490 3.350 3.380 32,827 +0.00(+0.00%)
Apr 13, 2005 3.610 3.610 3.350 3.380 305,851 -0.22(-6.11%)
Apr 12, 2005 3.600 3.660 3.570 3.600 48,124 -0.03(-0.83%)
Apr 11, 2005 3.550 3.680 3.500 3.630 138,331 +0.08(+2.25%)
Apr 08, 2005 3.650 3.650 3.540 3.550 18,792 -0.10(-2.74%)
Apr 07, 2005 3.650 3.670 3.510 3.650 41,982 +0.02(+0.55%)
Apr 06, 2005 3.700 3.750 3.610 3.630 53,345 -0.05(-1.36%)
Apr 05, 2005 3.750 3.830 3.670 3.680 143,602 -0.02(-0.54%)
Apr 04, 2005 3.440 3.740 3.440 3.700 81,211 +0.17(+4.82%)
Apr 01, 2005 3.550 3.570 3.490 3.530 72,781 +0.01(+0.28%)
Mar 31, 2005 3.450 3.530 3.330 3.520 49,785 +0.04(+1.15%)
Mar 30, 2005 3.330 3.490 3.310 3.480 135,168 +0.02(+0.58%)
Mar 29, 2005 3.440 3.500 3.390 3.460 72,607 +0.03(+0.87%)
Mar 28, 2005 3.450 3.490 3.380 3.430 121,166 +0.01(+0.29%)
Mar 24, 2005 3.210 3.480 3.190 3.420 77,842 +0.26(+8.23%)
Mar 23, 2005 3.240 3.300 3.160 3.160 78,187 -0.10(-3.07%)
Mar 22, 2005 3.210 3.400 3.210 3.260 98,038 +0.02(+0.62%)
Mar 21, 2005 3.440 3.470 3.240 3.240 208,316 -0.24(-6.90%)
Mar 18, 2005 3.450 3.640 3.440 3.480 155,084 -0.12(-3.33%)
Mar 17, 2005 3.550 3.650 3.440 3.600 127,357 +0.11(+3.15%)
Mar 16, 2005 3.950 3.950 3.460 3.490 387,222 -0.46(-11.65%)
Mar 15, 2005 3.900 4.090 3.830 3.950 294,163 +0.10(+2.60%)
Mar 14, 2005 3.730 3.900 3.550 3.850 124,626 +0.18(+4.90%)
Mar 11, 2005 3.830 3.960 3.560 3.670 113,932 -0.08(-2.13%)
Mar 10, 2005 3.810 3.830 3.690 3.750 119,644 +0.03(+0.81%)
Mar 09, 2005 3.850 4.000 3.720 3.720 244,655 -0.06(-1.59%)
Mar 08, 2005 3.790 3.880 3.750 3.780 59,373 +0.03(+0.80%)
Mar 07, 2005 3.900 3.900 3.730 3.750 102,413 -0.19(-4.82%)
Mar 04, 2005 4.050 4.050 3.900 3.940 61,235 +0.03(+0.77%)
Mar 03, 2005 3.800 4.050 3.800 3.910 196,108 +0.20(+5.39%)
Mar 02, 2005 3.580 3.780 3.510 3.710 46,602 +0.05(+1.37%)
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TOP STORIES

EDITOR'S PICKS
FEATURED VIDEO
EDUCATION
BLOGS
2014 top MEMS players ranking: Rising of the first MEMS titan
03/24/2015With an impressive 20 percent growth in MEMS revenue compared to 2013, and sales revenues of more than $1.2B, Robert Bosch GmbH is the clea...
NXP-Freescale merger to result in world's eighth largest chip maker
03/18/2015The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-la...
Small powerful systems give rise to medical semiconductor sales
03/19/2015Market for medical semiconductors seen rising to $8.2 billion in 2018....
Recovering economies driving growth in the industrial semiconductor market
03/16/2015The industrial semiconductor market will post a 9.7 percent compound annual growth rate (CAGR) over the next several years as ...
Tune in to the Solid State Watch

Cypress and Spansion complete merger; Strong fab equipment spending forecast for 2015; 11 IC product categories to exceed total IC market growth in 2015; Global mobile phone display module shipments signal stronger competition among manufacturers

Click here for more videos

Tech Papers
Upcoming Webcasts
3D Integration
April 2015 (Date and time TBD) Die stacking enables better chip performance in a small form factor, meeting ...
Materials
April 2015 (Date and time TBD) Success in electronics manufacturing increasingly relies on the materials used in production ...
Miss a webcast? Watch it On-Demand

Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

MAGAZINE




BLOGS


IoT and The ConFab 2015
February 25, 2015

TWITTER


NEWS ANALYSIS & FEATURES


Mentor Graphics launches Xpedition Package Integrator flow for IC-package-board design

03/27/2015  Mentor Graphics Corporation announced its new Xpedition Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization.

Solving molybdenum disulfide's 'thin' problem

03/27/2015  Research team increases material's light emission by twelve times.

Chemists make new silicon-based nanomaterials

03/27/2015  Chemists from Brown University have come up with a way to make new nanomaterials from a silicon-based compound.

ULVAC announces world's first, low temperature PZT sputtering technology

03/26/2015  ULVAC, Inc. this week announced industry's first low temperature PZT sputtering technology in mass production scale, enabling future advanced MEMS device integrated on CMOS which will be the mainstream of next generation MEMS devices.

Micron and Intel unveil new 3D NAND flash memory

03/26/2015  Micron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

Imec demonstrates 50GHz Ge waveguide electro-absorption modulator

03/25/2015  At this week’s OFC 2015, the largest global conference and exposition for optical communications, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz.

Dr. Terry Brewer receives the Kathryn C. Hach Award for Entrepreneurial Success from the American Chemical Society

03/25/2015  Dr. Terry Brewer, founder and CEO of Brewer Science, was presented the Kathryn C. Hach Award for Entrepreneurial Success on Tuesday, March 24, 2015, at the American Chemical Society’s 249th National Meeting.

LEDs Taiwan opens today in Taipei

03/25/2015  LED Taiwan, opening today at TWTC Nangang Exhibition Hall in Taipei, is Taiwan's only LED manufacturing-focused exposition.

Optoelectronics, sensors/actuators, and discretes growth accelerates

03/25/2015  After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.

Apple dictates the ranking of top 10 MEMS manufacturers in 2014

03/25/2015  Apple boosted Bosch’s MEMS revenue in 2014 again as Bosch is the sole supplier of the pressure sensors added to the iPhone 6 and 6+.

Silicon Space Technology appoints Bernd Lienhard as New CEO

03/24/2015  Silicon Space Technology today announced that its Board of Directors appointed Bernd Lienhard as the company’s Chief Executive Officer, replacing David Patterson who has been interim CEO for the past three months.

Stephen G. Daly joins MACOM's Board of Directors

03/24/2015  M/A-COM Technology Solutions Holdings, Inc., a supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, today announced the appointment of Stephen G. Daly as an independent director.

Seoul Semiconductor introduces new modules based on Acrich3 technology

03/24/2015  Seoul Semiconductor, a developer of LED technology, announced the availability of new Acrich3 modules for a wide range of residential and commercial lighting applications.

MORE ANALYSIS & FEATURES


Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS

3D Integration

April 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

EVENTS

SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015

NEW PRODUCTS

Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...