Bruker Corporation (NQ: BRKR)
23.65 USD  +0.14 (+0.60%)
Official Closing Price  /  Updated: 8:10 PM EDT, Jul 30, 2014  /  Add to My Watchlist      
Historical Prices
Date Open High Low Close Volume Change (%)
May 31, 2005 4.000 4.490 4.000 4.200 237,663 +0.24(+6.06%)
May 27, 2005 4.000 4.000 3.940 3.960 59,415 -0.03(-0.75%)
May 26, 2005 4.000 4.000 3.960 3.990 72,183 -0.01(-0.25%)
May 25, 2005 3.950 4.030 3.850 4.000 184,933 +0.04(+1.01%)
May 24, 2005 4.000 4.020 3.920 3.960 114,600 -0.01(-0.25%)
May 23, 2005 3.900 4.040 3.900 3.970 189,323 +0.02(+0.51%)
May 20, 2005 3.990 3.990 3.880 3.950 90,762 -0.02(-0.50%)
May 19, 2005 4.070 4.070 3.860 3.970 193,377 -0.04(-1.00%)
May 18, 2005 4.020 4.050 3.930 4.010 216,900 +0.06(+1.52%)
May 17, 2005 3.920 4.060 3.830 3.950 209,903 +0.05(+1.28%)
May 16, 2005 3.870 3.900 3.800 3.900 80,349 +0.09(+2.36%)
May 13, 2005 3.900 3.970 3.800 3.810 143,851 -0.03(-0.78%)
May 12, 2005 3.630 3.940 3.560 3.840 470,053 +0.25(+6.96%)
May 11, 2005 3.590 3.680 3.420 3.590 135,621 +0.05(+1.41%)
May 10, 2005 3.690 3.700 3.470 3.540 100,110 -0.22(-5.85%)
May 09, 2005 3.600 3.760 3.590 3.760 47,499 +0.17(+4.74%)
May 06, 2005 3.600 3.840 3.440 3.590 187,178 -0.03(-0.83%)
May 05, 2005 3.550 3.700 3.450 3.620 142,671 +0.10(+2.84%)
May 04, 2005 3.420 3.530 3.400 3.520 75,049 +0.12(+3.53%)
May 03, 2005 3.250 3.420 3.180 3.400 55,812 +0.03(+0.89%)
May 02, 2005 3.220 3.390 3.160 3.370 145,060 +0.11(+3.37%)
Apr 29, 2005 3.120 3.310 3.120 3.260 79,259 +0.15(+4.82%)
Apr 28, 2005 3.130 3.180 3.110 3.110 100,069 -0.06(-1.89%)
Apr 27, 2005 3.120 3.200 3.070 3.170 24,511 +0.01(+0.32%)
Apr 26, 2005 3.260 3.330 3.120 3.160 80,374 -0.15(-4.53%)
Apr 25, 2005 3.310 3.310 3.240 3.310 32,090 +0.06(+1.85%)
Apr 22, 2005 3.330 3.370 3.230 3.250 67,222 -0.10(-2.99%)
Apr 21, 2005 3.390 3.390 3.270 3.350 77,630 +0.03(+0.90%)
Apr 20, 2005 3.350 3.400 3.290 3.320 55,632 -0.08(-2.35%)
Apr 19, 2005 3.400 3.440 3.350 3.400 30,302 +0.04(+1.19%)
Apr 18, 2005 3.200 3.460 3.200 3.360 38,799 +0.14(+4.35%)
Apr 15, 2005 3.330 3.400 3.210 3.220 50,974 -0.16(-4.73%)
Apr 14, 2005 3.350 3.490 3.350 3.380 32,827 +0.00(+0.00%)
Apr 13, 2005 3.610 3.610 3.350 3.380 305,851 -0.22(-6.11%)
Apr 12, 2005 3.600 3.660 3.570 3.600 48,124 -0.03(-0.83%)
Apr 11, 2005 3.550 3.680 3.500 3.630 138,331 +0.08(+2.25%)
Apr 08, 2005 3.650 3.650 3.540 3.550 18,792 -0.10(-2.74%)
Apr 07, 2005 3.650 3.670 3.510 3.650 41,982 +0.02(+0.55%)
Apr 06, 2005 3.700 3.750 3.610 3.630 53,345 -0.05(-1.36%)
Apr 05, 2005 3.750 3.830 3.670 3.680 143,602 -0.02(-0.54%)
Apr 04, 2005 3.440 3.740 3.440 3.700 81,211 +0.17(+4.82%)
Apr 01, 2005 3.550 3.570 3.490 3.530 72,781 +0.01(+0.28%)
Mar 31, 2005 3.450 3.530 3.330 3.520 49,785 +0.04(+1.15%)
Mar 30, 2005 3.330 3.490 3.310 3.480 135,168 +0.02(+0.58%)
Mar 29, 2005 3.440 3.500 3.390 3.460 72,607 +0.03(+0.87%)
Mar 28, 2005 3.450 3.490 3.380 3.430 121,166 +0.01(+0.29%)
Mar 24, 2005 3.210 3.480 3.190 3.420 77,842 +0.26(+8.23%)
Mar 23, 2005 3.240 3.300 3.160 3.160 78,187 -0.10(-3.07%)
Mar 22, 2005 3.210 3.400 3.210 3.260 98,038 +0.02(+0.62%)
Mar 21, 2005 3.440 3.470 3.240 3.240 208,316 -0.24(-6.90%)
Mar 18, 2005 3.450 3.640 3.440 3.480 155,084 -0.12(-3.33%)
Mar 17, 2005 3.550 3.650 3.440 3.600 127,357 +0.11(+3.15%)
Mar 16, 2005 3.950 3.950 3.460 3.490 387,222 -0.46(-11.65%)
Mar 15, 2005 3.900 4.090 3.830 3.950 294,163 +0.10(+2.60%)
Mar 14, 2005 3.730 3.900 3.550 3.850 124,626 +0.18(+4.90%)
Mar 11, 2005 3.830 3.960 3.560 3.670 113,932 -0.08(-2.13%)
Mar 10, 2005 3.810 3.830 3.690 3.750 119,644 +0.03(+0.81%)
Mar 09, 2005 3.850 4.000 3.720 3.720 244,655 -0.06(-1.59%)
Mar 08, 2005 3.790 3.880 3.750 3.780 59,373 +0.03(+0.80%)
Mar 07, 2005 3.900 3.900 3.730 3.750 102,413 -0.19(-4.82%)
Mar 04, 2005 4.050 4.050 3.900 3.940 61,235 +0.03(+0.77%)
Mar 03, 2005 3.800 4.050 3.800 3.910 196,108 +0.20(+5.39%)
Mar 02, 2005 3.580 3.780 3.510 3.710 46,602 +0.05(+1.37%)
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EDITORS' PICKS


An EDA view of semiconductor manufacturing
07/24/2014The concern that there is a significant break between tools used by designers targeting leading edge processes, those at 32 nm and smaller to be precise, and ...
Solid State Technology and SEMI announce the 2014 “Best of West” Award winner
07/09/2014Solid State Technology and SEMI, yesterday announced the recipient of the 2014 “Best of West” Award — Nikon Corpo...
 
IBM announces $3B research initiative
07/15/2014IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology nee...
Applied Materials and Tokyo Electron unveil new company name
07/08/2014 Applied Materials, Inc. and Tokyo Electron Limited today unveiled the new name and logo of their combined company which will be used once t...

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


Silicon Image appoints new Chief Financial Officer

07/30/2014  Silicon Image, a provider of multimedia connectivity solutions and services, today announced the appointment of Raymond Cook as Chief Financial Officer effective July 28, 2014.

TriQuint becomes first manufacturer to achieve MRL 9 for GaN

07/30/2014  TriQuint Semiconductor, Inc., a RF solutions supplier and technology innovator, announced that it is the first gallium nitride (GaN) RF chip manufacturer to achieve Manufacturing Readiness Level (MRL) 9.

A call to provide advanced equipment to growth companies

07/28/2014  Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Harnessing big data

07/28/2014  Addressing the analytics challenges in supply chain management.

Superfast stress inspection for overlay control

07/28/2014  Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics

07/28/2014  Reducing plasma-induced damage is key to advancing the scaling limits.

Can lean innovation bring growth and profits back to semiconductors?

07/25/2014  New approaches to start-ups can unlock mega-trend opportunities.

Fusion bonding for next-generation 3D-ICs

07/24/2014  Recent developments in wafer bonding technology have demonstrated the ability to achieve improved bond alignment accuracy.

A*STAR and industry partners form S$200M semiconductor R&D joint labs

07/24/2014  Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

07/24/2014  Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

Peregrine Semiconductor and RF Micro Devices settle outstanding litigation

07/23/2014  Peregrine Semiconductor Corporation, founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, and RF Micro Devices, Inc., a designer and manufacturer of high-performance radio frequency solutions, today announced that they have settled all outstanding claims between the companies.

Micron 16nm NAND flash memory awarded Most Innovative Memory Device and Semiconductor of the Year

07/23/2014  Micron Technology, Inc. and TechInsights today announced that Micron has been honored with both the Most Innovative Memory Device and Semiconductor of the Year awards for their 16nm NAND Flash memory technology in TechInsights' 11th Annual Insight Awards.

A new multi-bit 'spin' for MRAM storage

07/23/2014  Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.

Understanding graphene’s electrical properties on an atomic level

07/23/2014  Graphene, a material that consists of a lattice of carbon atoms, one atom thick, is widely touted as being the most electrically conductive material ever studied. However, not all graphene is the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Advances in Wet Processing and Wafer Cleaning

August 14th at 1:00 p.m. ET Wet Processing, including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions, including a new concept of tailoring chemistries to dissolve very small particles rather than physically removing them.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
More Webcasts

EVENTS

SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014

FINANCIALS

NEW COMMENTS


Harnessing big data
Harnessing big data
VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

NEW PRODUCTS

Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....