Bruker Corporation (NQ: BRKR)
20.28 USD  -0.12 (-0.59%)
Streaming Delayed Price  /  Updated: 12:22 PM EDT, Aug 20, 2014  /  Add to My Watchlist      
Historical Prices
Date Open High Low Close Volume Change (%)
May 31, 2005 4.000 4.490 4.000 4.200 237,663 +0.24(+6.06%)
May 27, 2005 4.000 4.000 3.940 3.960 59,415 -0.03(-0.75%)
May 26, 2005 4.000 4.000 3.960 3.990 72,183 -0.01(-0.25%)
May 25, 2005 3.950 4.030 3.850 4.000 184,933 +0.04(+1.01%)
May 24, 2005 4.000 4.020 3.920 3.960 114,600 -0.01(-0.25%)
May 23, 2005 3.900 4.040 3.900 3.970 189,323 +0.02(+0.51%)
May 20, 2005 3.990 3.990 3.880 3.950 90,762 -0.02(-0.50%)
May 19, 2005 4.070 4.070 3.860 3.970 193,377 -0.04(-1.00%)
May 18, 2005 4.020 4.050 3.930 4.010 216,900 +0.06(+1.52%)
May 17, 2005 3.920 4.060 3.830 3.950 209,903 +0.05(+1.28%)
May 16, 2005 3.870 3.900 3.800 3.900 80,349 +0.09(+2.36%)
May 13, 2005 3.900 3.970 3.800 3.810 143,851 -0.03(-0.78%)
May 12, 2005 3.630 3.940 3.560 3.840 470,053 +0.25(+6.96%)
May 11, 2005 3.590 3.680 3.420 3.590 135,621 +0.05(+1.41%)
May 10, 2005 3.690 3.700 3.470 3.540 100,110 -0.22(-5.85%)
May 09, 2005 3.600 3.760 3.590 3.760 47,499 +0.17(+4.74%)
May 06, 2005 3.600 3.840 3.440 3.590 187,178 -0.03(-0.83%)
May 05, 2005 3.550 3.700 3.450 3.620 142,671 +0.10(+2.84%)
May 04, 2005 3.420 3.530 3.400 3.520 75,049 +0.12(+3.53%)
May 03, 2005 3.250 3.420 3.180 3.400 55,812 +0.03(+0.89%)
May 02, 2005 3.220 3.390 3.160 3.370 145,060 +0.11(+3.37%)
Apr 29, 2005 3.120 3.310 3.120 3.260 79,259 +0.15(+4.82%)
Apr 28, 2005 3.130 3.180 3.110 3.110 100,069 -0.06(-1.89%)
Apr 27, 2005 3.120 3.200 3.070 3.170 24,511 +0.01(+0.32%)
Apr 26, 2005 3.260 3.330 3.120 3.160 80,374 -0.15(-4.53%)
Apr 25, 2005 3.310 3.310 3.240 3.310 32,090 +0.06(+1.85%)
Apr 22, 2005 3.330 3.370 3.230 3.250 67,222 -0.10(-2.99%)
Apr 21, 2005 3.390 3.390 3.270 3.350 77,630 +0.03(+0.90%)
Apr 20, 2005 3.350 3.400 3.290 3.320 55,632 -0.08(-2.35%)
Apr 19, 2005 3.400 3.440 3.350 3.400 30,302 +0.04(+1.19%)
Apr 18, 2005 3.200 3.460 3.200 3.360 38,799 +0.14(+4.35%)
Apr 15, 2005 3.330 3.400 3.210 3.220 50,974 -0.16(-4.73%)
Apr 14, 2005 3.350 3.490 3.350 3.380 32,827 +0.00(+0.00%)
Apr 13, 2005 3.610 3.610 3.350 3.380 305,851 -0.22(-6.11%)
Apr 12, 2005 3.600 3.660 3.570 3.600 48,124 -0.03(-0.83%)
Apr 11, 2005 3.550 3.680 3.500 3.630 138,331 +0.08(+2.25%)
Apr 08, 2005 3.650 3.650 3.540 3.550 18,792 -0.10(-2.74%)
Apr 07, 2005 3.650 3.670 3.510 3.650 41,982 +0.02(+0.55%)
Apr 06, 2005 3.700 3.750 3.610 3.630 53,345 -0.05(-1.36%)
Apr 05, 2005 3.750 3.830 3.670 3.680 143,602 -0.02(-0.54%)
Apr 04, 2005 3.440 3.740 3.440 3.700 81,211 +0.17(+4.82%)
Apr 01, 2005 3.550 3.570 3.490 3.530 72,781 +0.01(+0.28%)
Mar 31, 2005 3.450 3.530 3.330 3.520 49,785 +0.04(+1.15%)
Mar 30, 2005 3.330 3.490 3.310 3.480 135,168 +0.02(+0.58%)
Mar 29, 2005 3.440 3.500 3.390 3.460 72,607 +0.03(+0.87%)
Mar 28, 2005 3.450 3.490 3.380 3.430 121,166 +0.01(+0.29%)
Mar 24, 2005 3.210 3.480 3.190 3.420 77,842 +0.26(+8.23%)
Mar 23, 2005 3.240 3.300 3.160 3.160 78,187 -0.10(-3.07%)
Mar 22, 2005 3.210 3.400 3.210 3.260 98,038 +0.02(+0.62%)
Mar 21, 2005 3.440 3.470 3.240 3.240 208,316 -0.24(-6.90%)
Mar 18, 2005 3.450 3.640 3.440 3.480 155,084 -0.12(-3.33%)
Mar 17, 2005 3.550 3.650 3.440 3.600 127,357 +0.11(+3.15%)
Mar 16, 2005 3.950 3.950 3.460 3.490 387,222 -0.46(-11.65%)
Mar 15, 2005 3.900 4.090 3.830 3.950 294,163 +0.10(+2.60%)
Mar 14, 2005 3.730 3.900 3.550 3.850 124,626 +0.18(+4.90%)
Mar 11, 2005 3.830 3.960 3.560 3.670 113,932 -0.08(-2.13%)
Mar 10, 2005 3.810 3.830 3.690 3.750 119,644 +0.03(+0.81%)
Mar 09, 2005 3.850 4.000 3.720 3.720 244,655 -0.06(-1.59%)
Mar 08, 2005 3.790 3.880 3.750 3.780 59,373 +0.03(+0.80%)
Mar 07, 2005 3.900 3.900 3.730 3.750 102,413 -0.19(-4.82%)
Mar 04, 2005 4.050 4.050 3.900 3.940 61,235 +0.03(+0.77%)
Mar 03, 2005 3.800 4.050 3.800 3.910 196,108 +0.20(+5.39%)
Mar 02, 2005 3.580 3.780 3.510 3.710 46,602 +0.05(+1.37%)
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EDITORS' PICKS


Strong growth in second quarter 2014 silicon wafer shipments
08/12/2014Worldwide silicon wafer area shipments increased during the second quarter 2014 when compared to first quarter area shipments according to t...
Global semiconductor industry on pace for record sales through first half of 2014
08/05/2014Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest g...
 
The growing semiconductor market in India
08/14/2014The semiconductor industry in India is estimated to grow from $10.02 billion in 2013 to $52.58 billion in 2020 at CAGR of 26.72%, according to Research and Mar...
Defying expectations, global LCD TV market rises in first half
08/07/2014Liquid-crystal-display television (LCD TV) panels enjoyed unexpected growth in the first half of this year, tied to enthusiastic TV viewin...

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


Renesas Electronics expands portfolio of Simple Power Supply ICs

08/20/2014  Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

08/20/2014  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

Promising ferroelectric materials suffer from unexpected electric polarizations

08/19/2014  Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

MIPT and RAS scientists made an important step towards creating medical nanorobots

08/19/2014  Researchers from the Institute of General Physics of the Russian Academy of Sciences, the Institute of Bioorganic Chemistry of the Russian Academy of Sciences and MIPT have made an important step towards creating medical nanorobots.

Himax Technologies and Lumus announce collaboration to develop next-generation smart glasses

08/19/2014  Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

Alpha and Omega Semiconductor announces promotion of Yifan Liang to CFO

08/19/2014  Alpha and Omega Semiconductor Limited, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced that the Board of Directors of AOS has promoted Mr. Yifan Liang, the Interim Chief Financial Officer, to serve as the Chief Financial Officer of AOS, effective immediately.

Intersil announces single-chip display power and LED driver for smartphones

08/19/2014  Intersil Corporation, a provider of power management and precision analog solutions, today announced the ISL98611 display power and LED driver for smartphones.

Mentor Graphics announces 25th annual PCB Technology Leadership Awards program

08/19/2014  Mentor Graphics Corporation today announced the call-for-entries of its 25th annual Technology Leadership Awards (TLA) competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design.

SmartPlay to offer design services for customers of Intel Custom Foundry

08/19/2014  SmartPlay Inc., a design services company with expertise in digital, analog, wireless software and system design, announced that it is ready to offer design services to customers of Intel Custom Foundry that require expertise, know-how and unique IP in critical embedded applications.

Gigaphoton unveils new function that enables 50% reduction of neon gas consumption for ArF immersion lasers

08/18/2014  Gigaphoton Inc., a lithography light source manufacturer, today unveils a new function, called “eTGM,” available for its flagship high-output GT Series of ArF immersion laser products.

ON Semiconductor completes acquisition of Aptina Imaging

08/18/2014  ON Semiconductor today announced the completion of its acquisition of Aptina Imaging.

Riding the embedded software wave

08/18/2014  Software that controls and powers embedded devices is playing a key role in making possible the highly integrated, multi-functional ‘smart’ devices we take for granted in our daily lives – from the ubiquitous smart phones/tablet to ‘smart’ home appliances and wearable electronics.

The Week in Review: August 15, 2014

08/15/2014  The growing semiconductor market in India; MEMSIC's monolithic, wafer-level packaged accelerometer; Si2 adds new director of 3DIC Programs; Worldwide silicon wafer area shipments increased during the second quarter 2014; LightFair announces Call for Speakers

Researchers prove stability of wonder material silicene

08/15/2014  An international team of researchers has taken a significant step towards understanding the fundamental properties of the two-dimensional material silicene by showing that it can remain stable in the presence of oxygen.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Metrology

August 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014

FINANCIALS

NEW COMMENTS


MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer
The growing semiconductor market in India
Moore's Law has stopped at 28nm

NEW PRODUCTS

Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....