Audio Pixels Holdings Ltd Sponsored ADR (OP: ADPXY)
8.330 USD  +0.320 (+4.00%)
Official Closing Price  /  Updated: 5:20 PM EST, Dec 19, 2014  /  Add to My Watchlist      
Historical Prices
Date Open High Low Close Volume Change (%)
Dec 19, 2014 8.370 8.370 8.330 8.330 200 +0.32(+4.00%)
Dec 18, 2014 8.010 8.010 8.010 8.010 100 +0.21(+2.69%)
Dec 17, 2014 7.800 7.800 7.800 7.800 100 +0.05(+0.65%)
Dec 16, 2014 7.750 7.750 7.750 7.750 445 -0.15(-1.90%)
Dec 11, 2014 7.900 7.900 7.900 0 -0.07(-0.88%)
Dec 08, 2014 7.970 7.970 7.970 0 -0.45(-5.34%)
Dec 05, 2014 8.420 8.420 8.010 8.420 600 -0.04(-0.47%)
Dec 04, 2014 8.289 8.540 8.289 8.460 1,000 +1.19(+16.37%)
Dec 03, 2014 7.270 7.270 7.270 7.270 100 +0.17(+2.39%)
Nov 28, 2014 7.100 7.100 7.100 0 +0.35(+5.19%)
Nov 26, 2014 6.750 6.750 6.750 0 -1.89(-21.88%)
Nov 24, 2014 8.640 8.640 8.640 0 -0.16(-1.82%)
Nov 21, 2014 8.800 8.800 8.800 8.800 200 -0.26(-2.87%)
Nov 20, 2014 9.060 9.060 9.060 9.060 500 -0.03(-0.33%)
Nov 19, 2014 8.970 9.090 8.970 9.090 300 -0.38(-4.01%)
Nov 17, 2014 9.470 9.470 9.470 0 -0.11(-1.15%)
Nov 14, 2014 9.580 9.580 9.580 10,800 +0.59(+6.52%)
Nov 13, 2014 8.994 8.994 8.994 8.994 220 -0.09(-0.95%)
Nov 12, 2014 8.989 9.080 8.989 9.080 590 -0.27(-2.89%)
Nov 10, 2014 9.350 9.350 9.350 0 -0.20(-2.09%)
Nov 07, 2014 9.480 9.550 9.430 9.550 2,300 +0.00(+0.00%)
Nov 06, 2014 9.510 9.550 9.500 9.550 900 -0.15(-1.55%)
Nov 03, 2014 9.700 9.700 9.700 0 -0.51(-5.03%)
Oct 31, 2014 10.20 10.21 10.20 10.21 2,000 +0.38(+3.91%)
Oct 30, 2014 9.780 9.830 9.780 9.830 2,470 -0.22(-2.24%)
Oct 29, 2014 10.05 10.05 10.05 10.05 1,000 -0.29(-2.85%)
Oct 24, 2014 10.35 10.35 10.35 0 +1.33(+14.75%)
Oct 22, 2014 9.020 9.020 9.020 9.020 150 +0.05(+0.53%)
Oct 17, 2014 8.970 8.972 8.970 8.972 500 -0.17(-1.84%)
Oct 16, 2014 9.140 9.140 9.140 9.140 100 -1.86(-16.91%)
Oct 13, 2014 11.00 11.00 11.00 0 -0.40(-3.51%)
Oct 09, 2014 11.40 11.40 11.40 0 -0.05(-0.47%)
Oct 08, 2014 11.45 11.45 11.45 11.45 500 -0.08(-0.66%)
Oct 06, 2014 11.53 11.53 11.53 0 +0.01(+0.09%)
Oct 02, 2014 11.52 11.52 11.52 0 -0.60(-4.95%)
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TOP STORIES

EDITOR'S PICKS
FEATURED VIDEO
EDUCATION
BLOGS
3D ASIP: "It's Complicated"
12/15/2014The presentations at this week's 3D Architectures in Semiconductor Integration and Packaging conference could be summed up in a famous Facebook status....
Cypress and Spansion to merge in $4B all-stock transaction
12/03/2014Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction value...
What’s next for MEMS?
12/16/2014The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ...
3D TSV begins
12/10/2014“Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” announces Yole....
Tune in to the Solid State Watch

Murata completes acquisition of Peregrine; North Carolina State University researches stacking semiconductor materials; SIA announces new president and CEO; Entegris announces availability of 450mm wafer carriers

Click here for more videos

Tech Papers
Upcoming Webcasts
Extending Moore's Law
January 2015 (Date and time TBD) Will IC capability, affordability and diversity continue to grow on a Moore’s ...
How the IoT is Driving Semiconductor Technology
January 2015 (Date and time TBD) The age of the Internet of Things is upon us, with the ...
Miss a webcast? Watch it On-Demand

Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


IoT's divergent needs will drive different types of technologies

12/19/2014  Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.

LED manufacturing with NMP-free resist stripping

12/19/2014  The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry.

The most expensive defect

12/18/2014  Defects that aren’t detected inline cost fabs the most.

From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

12/18/2014  Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.

Book-to-bill climbs above parity in November

12/18/2014  North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.

Laser spike annealing resolves sub-20nm logic device manufacturing challenges

12/18/2014  LSA technology plays an enabling role to overcoming manufacturing challenges for sub-20nm logic devices.

Process Watch: Fab managers don’t like surprises

12/18/2014  Nobody likes surprises - especially the managers of $10 billion factories.

Imec presents ultralow power RFID transponder chip in thin-film transistor technology on plastic at IEDM 2014

12/17/2014  At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip.

Daintree Networks named to "50 Most Promising IoT Companies of 2014"

12/17/2014  Daintree Networks has been named by CIO Review Magazine as one of the '50 Most Promising Internet of Things (IoT) Companies 2014.'

Imec demonstrates broadband graphene optical modulator on silicon

12/17/2014  At this week’s IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry’s first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed.

The simplest element: Turning hydrogen into 'graphene'

12/16/2014  New work from Carnegie's Ivan Naumov and Russell Hemley delves into the chemistry underlying some surprising recent observations about hydrogen, and reveals remarkable parallels between hydrogen and graphene under extreme pressures.

IEDM: Thanks for MEMS-ories

12/16/2014  At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those papers were the subject of a press release two months in advance.

Amkor Technology licenses proprietary copper pillar wafer bump technology to GLOBALFOUNDRIES

12/16/2014  Amkor Technology, Inc., a provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.

Lead islands in a sea of graphene magnetize the material of the future

12/16/2014  Researchers in Spain have discovered that if lead atoms are intercalated on a graphene sheet, a powerful magnetic field is generated by the interaction of the electrons' spin with their orbital movement.

MORE ANALYSIS & FEATURES


Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Extending Moore's Law

January 2015 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2015 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

More Webcasts

EVENTS

International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015

FINANCIALS

NEW COMMENTS


Regional recap: states fund, flaunt nano competitiveness
Innovation in the shadow of volcanic change
Innovation in the shadow of volcanic change

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....