NXP SEMICONDUCTORS (NQ: NXPI)
70.26 USD  +1.70 (+2.48%)
Official Closing Price  /  Updated: 8:10 PM EDT, Sep 16, 2014  /  Add to My Watchlist      
Historical Prices
Date Open High Low Close Volume Change (%)
Sep 16, 2014 68.40 70.49 68.40 70.26 2,222,490 +1.70(+2.48%)
Sep 15, 2014 70.05 70.58 68.42 68.56 2,855,040 -1.42(-2.03%)
Sep 12, 2014 71.42 71.50 69.91 69.98 2,335,366 -1.36(-1.91%)
Sep 11, 2014 70.15 71.46 70.15 71.34 2,211,875 +0.71(+1.01%)
Sep 10, 2014 70.89 71.00 69.59 70.63 3,174,877 +0.61(+0.87%)
Sep 09, 2014 71.03 73.09 68.79 70.02 9,013,985 -1.17(-1.64%)
Sep 08, 2014 71.31 72.18 70.65 71.19 4,187,070 +0.20(+0.28%)
Sep 05, 2014 69.84 71.10 69.29 70.99 3,674,714 +1.56(+2.25%)
Sep 04, 2014 69.34 69.82 68.80 69.43 3,779,959 +0.18(+0.26%)
Sep 03, 2014 69.50 70.38 68.75 69.25 4,706,290 +0.18(+0.26%)
Sep 02, 2014 70.00 70.00 68.72 69.07 4,401,649 +0.55(+0.80%)
Aug 29, 2014 68.52 68.52 68.52 0 +1.56(+2.33%)
Aug 28, 2014 65.78 66.97 65.06 66.96 2,681,222 +1.42(+2.17%)
Aug 27, 2014 65.42 65.70 64.04 65.54 1,708,222 +0.80(+1.24%)
Aug 26, 2014 65.56 65.89 64.71 64.74 2,328,558 -0.80(-1.22%)
Aug 25, 2014 65.72 65.85 65.01 65.54 2,021,390 +0.11(+0.17%)
Aug 22, 2014 64.90 65.84 64.20 65.43 3,308,214 +1.40(+2.19%)
Aug 21, 2014 64.28 64.45 63.76 64.03 2,672,390 -0.17(-0.26%)
Aug 20, 2014 63.35 64.46 63.26 64.20 3,371,438 +0.94(+1.49%)
Aug 19, 2014 63.11 63.97 62.70 63.26 2,679,984 +0.03(+0.05%)
Aug 18, 2014 62.16 63.27 60.82 63.23 6,773,918 -0.66(-1.03%)
Aug 15, 2014 64.34 64.38 62.71 63.89 2,154,516 +0.17(+0.27%)
Aug 14, 2014 63.34 63.75 62.74 63.72 1,940,276 +0.70(+1.11%)
Aug 13, 2014 63.56 63.56 62.62 63.02 2,456,560 +0.50(+0.80%)
Aug 12, 2014 61.66 62.67 61.11 62.52 1,666,713 +0.82(+1.33%)
Aug 11, 2014 61.52 62.28 61.52 61.70 1,623,111 +0.61(+1.00%)
Aug 08, 2014 60.56 61.24 59.82 61.09 2,304,062 +0.59(+0.98%)
Aug 07, 2014 62.73 62.99 60.19 60.50 3,942,569 -2.44(-3.88%)
Aug 06, 2014 61.36 63.83 60.57 62.94 3,825,601 +0.96(+1.55%)
Aug 05, 2014 62.61 62.67 61.57 61.98 2,462,336 -0.75(-1.20%)
Aug 04, 2014 63.02 63.45 62.25 62.73 2,478,357 +0.33(+0.53%)
Aug 01, 2014 62.57 63.22 61.66 62.40 2,928,262 +0.05(+0.08%)
Jul 31, 2014 62.18 62.72 61.10 62.35 3,755,351 -1.03(-1.63%)
Jul 30, 2014 62.15 63.73 61.76 63.38 3,723,639 +1.69(+2.74%)
Jul 29, 2014 62.11 62.80 61.50 61.69 4,592,171 -0.65(-1.04%)
Jul 28, 2014 63.03 63.30 61.18 62.34 5,192,052 -0.66(-1.05%)
Jul 25, 2014 65.50 65.50 62.71 63.00 6,229,536 -2.33(-3.57%)
Jul 24, 2014 67.00 67.30 64.55 65.33 5,939,700 +0.79(+1.22%)
Jul 23, 2014 66.10 66.59 63.64 64.54 6,084,462 -1.71(-2.58%)
Jul 22, 2014 66.50 67.32 66.20 66.25 3,434,602 -0.03(-0.05%)
Jul 21, 2014 66.55 67.40 65.87 66.28 2,105,556 -0.33(-0.50%)
Jul 18, 2014 65.44 66.65 64.94 66.61 2,449,431 +1.68(+2.59%)
Jul 17, 2014 66.35 66.47 64.74 64.93 2,950,970 -2.10(-3.13%)
Jul 16, 2014 66.30 67.26 66.12 67.03 1,536,704 +1.27(+1.93%)
Jul 15, 2014 66.35 66.69 65.39 65.76 1,976,481 -0.59(-0.89%)
Jul 14, 2014 66.82 67.44 66.05 66.35 1,445,919 -0.07(-0.11%)
Jul 11, 2014 65.71 66.50 65.35 66.42 1,419,291 +0.99(+1.51%)
Jul 10, 2014 65.01 65.56 64.05 65.43 3,048,803 -0.96(-1.45%)
Jul 09, 2014 66.19 66.81 65.76 66.39 1,653,577 +0.72(+1.10%)
Jul 08, 2014 66.89 67.25 64.75 65.67 2,925,562 -1.24(-1.85%)
Jul 07, 2014 67.54 67.79 66.58 66.91 1,499,110 -0.45(-0.67%)
Jul 03, 2014 67.36 67.36 67.36 0 +0.76(+1.14%)
Jul 02, 2014 67.00 67.06 66.16 66.60 2,033,821 -0.55(-0.82%)
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EDITORS' PICKS


SEMI wins request for etch equipment export control review
09/09/2014Major milestone in longstanding push to remove etch equipment from U.S. export control list....
UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor
09/04/2014Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing develope...
 
Equipment spending shows strong growth for 2014 and 2015
09/10/2014Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion....
GaAs device market posts record revenues in 2013
09/05/2014Ongoing growth in cellular and Wi-Fi applications will continue to drive GaAs device revenues higher. ...

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


Element Six selected by European Consortium as a partner to develop ultrafast pulse disk lasers

09/16/2014  Element Six today announced it has been selected by the European Commission’s Seventh Framework Programme for Research and Technological Development to help develop a new ultrafast pulse disk laser.

eBeam Initiative Survey indicates new eBeam expectations for photomask production

09/16/2014  Continued semiconductor scaling drives new mask design requirements; use of complex mask shapes predicted to increase

Design and Manufacturing Technology Development in Future IC Foundries

09/16/2014  Virtual Roundtable provides perspective on the need for greater integration within the “fabless-foundry” ecosystem.

Monolithic 3D breakthrough at IEEE S3S 2014

09/15/2014  In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) could be built using the existing fab and the existing transistor flow.

35 European start-ups showcased at SEMICON Europa’s Innovation Village

09/15/2014  35 major European start-ups will participate in the Innovation Village and present their new technologies at SEMICON Europa.

Kateeva receives $38 million in financing

09/15/2014  Kateeva announced that it has closed its Series D round with $38 million in financing. The newest participant is Samsung Venture Investment Corporation (SVIC).

Process Watch: Sampling matters

09/15/2014  Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Sapphire display covers featured in Apple smart watches but not in iPhone 6

09/11/2014  The long wait is finally over. From a sapphire industry standpoint, Apple killed the suspense within the first 10 minutes by announcing that its new 4.7” and 5.5” iPhone 6 and iPhone 6 plus will both feature a traditional ion-exchange strengthened glass display cover.

Outlook: Healthy equipment spending into 2015

09/10/2014  The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

Beautiful, brilliant people

09/10/2014  It would be difficult to overstate how critical the development of a workable, high volume manufacturing EUV lithography solution is to the semiconductor industry.

SEMI advocates for the industry in Washington

09/10/2014  With changes coming in Washington, SEMI has important work ahead supporting the innovators and job creators of this country.

The semiconductor industry: Out in front, but lagging behind

09/10/2014  Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.

Leti and LUCIOM focusing on high-data-rate bidirectional transceivers for enriched LiFi applications

09/10/2014  CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers.

Global shutter image sensors

09/09/2014  Different GS pixel architectures and technologies are presented and performances compared.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS

Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014
Strategic Materials Conference
Santa Clara, CA
http://www.semi.org/node/41386
September 30, 2014 - October 01, 2014
SEMICON Europa
Grenoble, France
http://www.semiconeuropa.org
October 07, 2014 - October 09, 2014
MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014

FINANCIALS

NEW COMMENTS


Moore's Law has stopped at 28nm
Beautiful, brilliant people
IMI adds SATS PSi to gain power semiconductor share

NEW PRODUCTS

SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...
Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...