PROSHARES ULTRA FTSE CHINA 25 (NY: XPP)
65.59 USD  +0.66 (+1.02%)
Official Closing Price  /  Updated: 6:40 PM EDT, Aug 1, 2014  /  Add to My Watchlist      
Fund Overview
PROSHARES ULTRA FTSE CHINA 25
Sector
Exchange Traded NY
Net Assets 39.35M
Inception Date
Related Funds AUT MTH XOG YMLI
Quote
Price 65.59
Volume 28,654
Last Trade Aug 01, 6:40pm
Change (%)
+0.66 (1.02%)
Prev. Close 64.93
YTD %
+21.17%
Dividend Yield N/A
Performance
YTD
+11.46 (21.17%)
1 Month
+10.34 (18.71%)
3 Month
+18.27 (38.61%)
6 Month
+18.69 (39.85%)
1 Year
+19.30 (41.69%)
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EDITORS' PICKS


An EDA view of semiconductor manufacturing
07/24/2014The concern that there is a significant break between tools used by designers targeting leading edge processes, those at 32 nm and smaller to be precise, and ...
Solid State Technology and SEMI announce the 2014 “Best of West” Award winner
07/09/2014Solid State Technology and SEMI, yesterday announced the recipient of the 2014 “Best of West” Award — Nikon Corpo...
 
Wireless connectivity semiconductors maintain strong double-digit growth in health and fitness
07/31/2014Semiconductors providing wireless connectivity in health and fitness devices are set for solid double-digi...
IBM announces $3B research initiative
07/15/2014IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology nee...

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


Smart cities to rise fourfold in number from 2013 to 2025

07/31/2014  The number of smart cities worldwide will quadruple within a 12-year period that started last year, proliferating as local governments work with the private sector to cope with a multitude of challenges confronting urban centers.

Materials matter — Enabling the future of IC fabrication and packaging

07/31/2014  The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

Cambridge Nanotherm appoints Ralph Weir as CEO

07/31/2014  Cambridge Nanotherm, a producer of semiconductor heatsink technology, today announced that it has appointed semiconductor industry veteran Ralph Weir as its CEO.

Silicon Image appoints new Chief Financial Officer

07/30/2014  Silicon Image, a provider of multimedia connectivity solutions and services, today announced the appointment of Raymond Cook as Chief Financial Officer effective July 28, 2014.

TriQuint becomes first manufacturer to achieve MRL 9 for GaN

07/30/2014  TriQuint Semiconductor, Inc., a RF solutions supplier and technology innovator, announced that it is the first gallium nitride (GaN) RF chip manufacturer to achieve Manufacturing Readiness Level (MRL) 9.

A call to provide advanced equipment to growth companies

07/28/2014  Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Harnessing big data

07/28/2014  Addressing the analytics challenges in supply chain management.

Superfast stress inspection for overlay control

07/28/2014  Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics

07/28/2014  Reducing plasma-induced damage is key to advancing the scaling limits.

Can lean innovation bring growth and profits back to semiconductors?

07/25/2014  New approaches to start-ups can unlock mega-trend opportunities.

Fusion bonding for next-generation 3D-ICs

07/24/2014  Recent developments in wafer bonding technology have demonstrated the ability to achieve improved bond alignment accuracy.

A*STAR and industry partners form S$200M semiconductor R&D joint labs

07/24/2014  Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

07/24/2014  Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

Sustainability through Materials Recovery

07/16/2014  Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site options are reviewed for helium, argon, sulfuric acid and Xenon.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Advances in Wet Processing and Wafer Cleaning

August 14th at 1:00 p.m. ET Wet Processing, including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions, including a new concept of tailoring chemistries to dissolve very small particles rather than physically removing them.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
More Webcasts

EVENTS

SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014

FINANCIALS

NEW COMMENTS


IBM announces $3B research initiative
Fusion bonding for next-generation 3D-ICs
Can lean innovation bring growth and profits back to semiconductors?

NEW PRODUCTS

Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....