SPDR DOW JONES INDUSTRIAL AVERAGE ETF TRUST (NY: DIA)
177.80 USD  +0.10 (+0.06%)
Official Closing Price  /  Updated: 4:15 PM EST, Nov 24, 2014  /  Add to My Watchlist      
Fund Overview
SPDR DOW JONES INDUSTRIAL AVERAGE ETF TRUST
Sector
Exchange Traded NY
Net Assets N/A
Inception Date
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Quote
Price 177.80
Volume 2,400,080
Last Trade Nov 24, 4:15pm
Change (%)
+0.10 (0.06%)
Prev. Close 177.70
YTD %
+8.34%
Dividend Yield 2.03%
Performance
YTD
+13.69 (8.34%)
1 Month
+11.35 (6.82%)
3 Month
+7.18 (4.21%)
6 Month
+11.33 (6.81%)
1 Year
+17.40 (10.85%)
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TOP STORIES

EDITOR'S PICKS
FEATURED VIDEO
EDUCATION
BLOGS
China and US boost worldwide industrial semiconductor market in 2014
11/20/2014Continuing strength in China and a resurgent U.S. economy are combining to drive accelerated growth in the worldwide market for semi...
Slight increase in third quarter 2014 silicon wafer shipments
11/12/2014Worldwide silicon wafer area shipments increased during the third quarter 2014 when compared to second quarter area shipments according to ...
Notebook PC shipments rise year over year as tablet PCs decline
11/18/2014Notebook PC growth was primarily driven by the developed regions of North America and Western Europe, which increased year-over-year ship...
Double-digit growth: Record sales to shake up Top 20 semi supplier ranking
11/10/2014TSMC, MediaTek, and SK Hynix’s sales are each expected to jump by >20% this year....
Tune in to the Solid State Watch

The growing sensors market; Texas Instruments to expand operations in China; GlobalFoundries partners in INVECAS; Worldwide sales of semiconductors hits record-breaking high.

Click here for more videos

Tech Papers
Upcoming Webcasts
Extending Moore's Law
January 2014 (Date and time TBD) Will IC capability, affordability and diversity continue to grow on a Moore’s ...
How the IoT is Driving Semiconductor Technology
January 2014 (Date and time TBD) The age of the Internet of Things is upon us, with the ...
Miss a webcast? Watch it On-Demand

Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


Micron Technology CFO to retire in 2015

11/24/2014  Micron Technology, Inc. announced that Ronald C. Foster, Chief Financial Officer (CFO) and Vice President of Finance, will retire from Micron next year.

Hybrid Memory Cube Consortium releases new specification

11/24/2014  The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

PDSTI completes acquisition of Montage

11/24/2014  Montage Technology Group Limited, a global fabless provider of analog and mixed-signal semiconductor solutions addressing the home entertainment and cloud computing markets, today announced that Montage Technology Global Holdings, Ltd., an entity jointly formed by Shanghai Pudong Science and Technology Investment Co., Ltd. and China Electronics Investment Holdings Limited, has completed its acquisition of the company.

Physicists and chemists work to improve digital memory technology

11/24/2014  The improvements in random access memory that have driven many advances of the digital age owe much to the innovative application of physics and chemistry at the atomic scale.

UO-industry collaboration points to improved nanomaterials

11/21/2014  A potential path to identify imperfections and improve the quality of nanomaterials for use in next-generation solar cells has emerged from a collaboration of University of Oregon and industry researchers.

North American book-to-bill report shows equipment order activity has moderated

11/21/2014  North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI.

Large-area TFT LCD panel shipments and revenues return to growth in 2014

11/20/2014  TFT LCD panel suppliers are rejuvenating their large-area panel business plans this year as the market demand for key applications grows.

Paul A. Mascarena joins ON Semiconductor's board of directors

11/20/2014  ON Semiconductor Corporation today announced that Paul A. Mascarenas has joined its Board of Directors. The Board also appointed Mr. Mascarenas to its Science and Technology Committee.

A path to brighter images and more efficient LCD displays

11/20/2014  University of Utah engineers have developed a polarizing filter that allows in more light, leading the way for mobile device displays that last much longer on a single battery charge and cameras that can shoot in dim light.

X-FAB MEMS Foundry wins “Foundry of the Year” Award at MEMS Executive Congress

11/20/2014  X-FAB MEMS Foundry today announced it received the “MEMS Foundry of the Year” award at the Best in MEMS & Sensors Innovation Awards ceremony, as part of the MEMS Industry Group’s 10th annual MEMS Executive Congress held in Scottsdale, Arizona last week.

SmartKem announces new TFT fabrication facility to meet market demand for flexible semiconductors

11/20/2014  SmartKem, a supplier of high performance semiconductor materials for the manufacture of truly flexible displays and electronics, has announced the opening of a new thin-film-transistor (TFT) fabrication and testing facility at the company’s Manchester site – doubling the size of the company.

NFC IGZO TFT for Game Cards

11/20/2014  Holst Centre, imec, and Cartamundi work on flexible Near Field Communication tags embedded in paper cards.

SCHOTT advances MEMS technology by using HermeS glass wafers with through glass vias

11/19/2014  The international technology group SCHOTT is expanding its HermeS wafers with hermetically sealed, solid through glass vias (TGV) into MEMS applications.

Holst Centre, imec and CARTAMUNDI join forces to create the near field communication chip of the future

11/19/2014  Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Extending Moore's Law

January 2014 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2014 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
FinFETs

February 2014 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

More Webcasts

EVENTS

2014 IEEE International Electron Device Meeting
San Francisco, CA
http://www.his.com/~iedm/
December 15, 2014 - December 17, 2014
International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015

FINANCIALS

NEW COMMENTS


Trends in Semiconductor Materials
Gas filter technology aims to extinguish pharma fire risk
Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....