EXTRA SPACE STORAGE, Inc. (NY: EXR)
65.45 USD  -0.89 (-1.34%)
Official Closing Price  /  Updated: 4:15 PM EST, Feb 26, 2015  /  Add to My Watchlist      
Price and Volume
Detailed Quote
Chart for  (: )
 
Intraday
1 Week
1 Month
3 Month
1 Year
 
Compare to:
Volume 930,514
Open 66.35
Bid (Size) 62.13 (300)
Ask (Size) 68.87 (300)
Prev. Close 66.34
Today's Range 65.04 - 66.35
52wk Range 47.12 - 68.08
Shares Outstanding 116,330,711
Dividend Yield 2.87%
Performance
YTD
+11.05%
+11.05%
1 Month
-1.92%
-1.92%
3 Month
+10.39%
+10.39%
6 Month
+24.10%
+24.10%
1 Year
+37.01%
+37.01%
Top News
More News
Stock Market XML and JSON Data API provided by FinancialContent Services, Inc.
Nasdaq quotes delayed at least 15 minutes, all others at least 20 minutes.
Markets are closed on certain holidays. Stock Market Holiday List
By accessing this page, you agree to the following
Privacy Policy and Terms and Conditions.
Press Release Service provided by PRConnect.
Stock quotes supplied by Six Financial
Postage Rates Bots go here

TOP STORIES

EDITOR'S PICKS
FEATURED VIDEO
EDUCATION
BLOGS
Smartphone display manufacturers facing pressure to further reduce prices in 2015
02/20/2015Even as smartphone panel resolution continues to rise, and as display sizes continue to grow, panel manufacturers are f...
Applied's merger with TEL: Still a work in progress
02/11/2015Applied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or exp...
Top semiconductor R&D leaders ranked for 2014
02/26/2015Intel’s R&D expenditures were 2x greater than nearest competitor; Qualcomm with largest percentage increase; Nvidia with highest R&D/sales ra...
Imec reports breakthrough results on DSA
02/19/2015At next week’s SPIE advanced lithography conference, to be held in San Jose, Calif., Feb. 22-26, imec will present breakthrough results on Directed Self-Assem...
Tune in to the Solid State Watch

Solid growth in automotive semiconductor market; $4M grant to UMass Lowell for printed and flexible electronics development; Book-to-bill ratio below parity; Researchers use oxides to flip graphene conductivity

Click here for more videos

Tech Papers
Upcoming Webcasts
3D Integration
March 2015 (Date and time TBD) Die stacking enables better chip performance in a small form factor, meeting ...
Materials
April 2015 (Date and time TBD) Success in electronics manufacturing increasingly relies on the materials used in production ...
Miss a webcast? Watch it On-Demand

Solid State Technology is looking for more speakers to present during our upcoming webcasts! Submit your abstract here.

MAGAZINE




BLOGS


IoT and The ConFab 2015
February 25, 2015

TWITTER


NEWS ANALYSIS & FEATURES


Imec demonstrates compact wavelength-division multiplexing CMOS silicon photonics transceiver

02/26/2015  This week, at the 2015 International Solid State Circuits Conference (ISSCC), imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceive

Semiconductor unit shipments to exceed one trillion devices in 2017

02/26/2015  Updated forecast expects robust 8.2% average annual unit shipment growth through 2019.

Directed Self Assembly Hot Topic at SPIE

02/25/2015  At this week’s SPIE Advanced Lithography Symposium in San Jose, Calif., the hottest three-letter acronym is less EUV and more DSA, as in directed self-assembly.

Technologists focus on semiconductor factory productivity and process solutions at ASMC 2015

02/25/2015  The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2015) will be held May 3-6 in Saratoga Springs, New York.

Imec and Panasonic present breakthrough in CMOS-based transceivers for mm-wave radar systems

02/25/2015  Today, at the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79GHz.

Penang to host inaugural SEMICON Southeast Asia

02/25/2015  The inaugural SEMICON Southeast Asia, will run from 22–24 April at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia.

Proponents of EUV, immersion lithography face off at SPIE

02/25/2015  The two main camps in optical lithography are arrayed for battle at the SPIE Advanced Lithography Symposium. EUVt lithography, on one side, is represented by ASML Holding, its Cymer subsidiary, and ASML’s EUV customers, notably Intel, Samsung Electronics, and TSMC. On the other side is 193i immersion lithography, represented by Nikon and its customers, which also include Intel and other leading chipmakers.

Freescale pushes for a secure Internet of Things

02/24/2015  As the Internet of Things (IoT) continues to gain momentum, Freescale Semiconductor and its partners are tackling the most dire challenge the young movement has faced to date – the alarming lack of unified guidelines for ensuring the security of IoT applications.

Radio chip for the 'Internet of things'

02/24/2015  At this year's Consumer Electronics Show in Las Vegas, the big theme was the "Internet of things" -- the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.

Optical nanoantennas set the stage for a NEMS lab-on-a-chip revolution

02/24/2015  Newly developed tiny antennas, likened to spotlights on the nanoscale, offer the potential to measure food safety, identify pollutants in the air and even quickly diagnose and treat cancer, according to the Australian scientists who created them.

Fan-Out Wafer Level Packaging: With a $200M market in 2015, Yole is expecting 30% CAGR in the coming years

02/24/2015  “Fan-Out Wafer Level Packaging (FOWLP) is already in high-volume” announces Yole Développement (Yole) in its new report, Fan-Out and Embedded Die: Technologies & Market. According to Yole’s analysts, FOWLP market reaches almost $200M in 2015.

AG Semiconductor Services and JA Mitsui Leasing join forces

02/24/2015  AG Semiconductor Services, LLC (AGSS), one of the largest suppliers of used electronics manufacturing equipment, is pleased to announce that it has entered into a strategic relationship with JA Mitsui Leasing, Ltd. (JAML).

SmartKem collaborates with Centre for Process Innovation to support customer pre-production

02/24/2015  SmartKem has announced an extensive collaboration programme with the Centre for Process Innovation (CPI) for the development of pre-production prototypes featuring the SmartKem unique range of semiconductor inks for the manufacture of ultra flexible thin-film transistors (TFT).

SPIE plenary takes in photonics, 3DICs, connected devices

02/23/2015  Speakers at the plenary session of the SPIE Advanced Lithography conference covered a wide variety of topics, from photonics to 3D chips to the Internet of Things, on Monday morning, February 23, in San Jose, Calif.

MORE ANALYSIS & FEATURES


Innovators

n&k systems: the go-to solutions for the most challenging thin-films and periodic structures

The company offers a wide portfolio of fully-and semi-automated systems for production control and R&D in Semiconductor, Photomask, Data Storage, and Flat Panel Display industries.
Sponsored By: n&k Technology, Inc.

SACHEM reveals innovations in IGZO and TSV reveal processing

SACHEM is a global chemical science company specializing in designing and manufacturing ultrapure chemistries for the microelectronics manufacturing industries.
Sponsored By: SACHEM

Technifab keeps cold liquids colder

Technifab designs, builds and installs cryogenic liquid systems along with providing the assistance customers need to make a cryogenic delivery system work.
Sponsored By: Technifab

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

EVENTS

The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015

FINANCIALS

NEW COMMENTS


Applied's merger with TEL: Still a work in progress
Thermal performance of 3DICs
Smartphone display manufacturers facing pressure to further reduce prices in 2015

NEW PRODUCTS

MKS introduces the I-Series family of high flow mass flow controllers
02/25/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced th...
TMC introduces stage-base 450 with voice coil technology
02/10/2015TMC, a developer of high-performance vibration and motion cancellation technology, has introduced Stage-Base 450, its next generation of frame-m...
Entegris launches Dispense System optimized for 3D and MEMS applications
02/03/2015Entegris, Inc. announced the latest addition to its IntelliGen family of two-stage dispense technologies used in microelectronic...