ALISO VIEJO, Calif., July 12, 2016 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new imaging/video solution for the development of low power and reliable video processing applications. The new platform is comprised of a field programmable gate array (FPGA) mezzanine card (FMC), a comprehensive intellectual property (IP) suite and graphical user interface (GUI). The FMC plugged into the SmartFusion™2 Advanced Development Kit demonstrates Microsemi's IGLOO™2 FPGA and SmartFusion2 system-on-chip (SoC) FPGA capabilities to support configurable and scalable camera, imaging and video designs.
In addition to its modular IP suite and hardware kit, the new imaging/video solution includes a flexible image sensor interface connector as well as graphical user interface (GUI)-based software, enabling users to configure sensor display demonstrations in real time. Designs can be easily reused across multiple platforms using Libero SoC Design Suite, a comprehensive, easy to learn, easy to adopt development toolset for designing with Microsemi's power efficient FPGAs and SoC FPGAs. The imaging/video IP suite is available now in the company's Libero SoC IP vault. Designers can leverage the kit for numerous camera and display applications across medical, industrial, automotive, defense and aerospace markets. With features like low power, reliability and design/data security, the solution becomes ideal for a variety of applications, including drones, machine vision, robotics, infrared cameras, head-up display, target acquisition systems, medical imaging, surveillance and automotive imaging.
"Microsemi's imaging/video kit and IP suite are central to our ongoing efforts to build a robust portfolio of solutions for video and imaging applications which are differentiated from competitors with our expertise in low power," said Chowdhary Musunuri, senior director, SoC Products Group, at Microsemi. "We are pleased to offer customers this initial kit to speed their adoption of Microsemi FPGAs and SoCs in camera and display-based designs, and we look forward to announcing additional image design solutions to serve this market's specific needs."
The company's new kit features an FMC-based imaging/video card with flexible image sensor interface, a display interface for 7:1 low-voltage differential signaling (LVDS), HDMI connections and an audio processor. The initial image sensor board offers an AR0330-based image sensor module with a parallel bus interface. Future image sensor boards will offer other interfaces such as Mobile Industry Processor Interface (MIPI) camera serial interface (CSI-2), and high-speed serial pixel (HiSPi). In addition, because the hardware is FMC-based, the kit, which plugs into the M2S150-ADV-DEV-KIT, could also be used with future Microsemi FPGAs and SoCs.
"The machine vision system market is growing at a significant rate of 12.6 percent and likely to reach $8.6 billion by 2021," said Dependra Lal, senior analyst at market research firm IndustryARC. "A shift towards the integration of advanced vision systems with autonomous robots, in order to guide robots' arms and navigate them in production lines, is further fuelling the growth of machine vision system in industrial and medical applications."
Product Availability
Microsemi's imaging/video kit is available now. For more information including ordering codes and pricing, visit http://www.microsemi.com/products/fpga-soc/imaging and http://www.microsemi.com/products/fpga-soc/imaging#getting-started or contact sales.support@microsemi.com.
Imaging Customer Webinar July 19
Microsemi will be hosting a customer webinar titled, "New Imaging and Video Solution for FPGA and SoC Designers" on July 19, 2016 at 8 a.m. PDT. The webinar will discuss the capabilities of the imaging and video FMC hardware, details of IP available in the modular IP suite and target applications for this new solution. To register, visit https://attendee.gotowebinar.com/register/3466872687865987073.
About Microsemi's IGLOO2 FPGAs and SmartFusion2 SoC FPGAs
Microsemi's IGLOO2 FPGAs and SmartFusion2 SoC FPGAs deliver more resources in low density devices, with the lowest power, proven security and exceptional reliability. The devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microsemi FPGAs and SoC FPGAs are used by customers in in communications, industrial, medical, defense and aviation markets. PCIe Gen 2 connectivity starts at just 10K logic elements (LEs). SmartFusion2 SoC FPGAs offer a 166MHz ARM Cortex-M3 processor with up to 512KB of embedded flash and a complete peripheral set. IGLOO2 FPGAs offer a high performance memory subsystem with up to 512KB embedded flash, 2 x 32 KB embedded static random-access memory (SRAM), two direct memory access (DMA) engines and two double date rate (DDR) controllers. Microsemi also offers a broad range of military, automotive and space grade FPGAs and SoC FPGAs. For more information visit: http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2 and http://www.microsemi.com/products/fpga-soc/fpga/igloo2-fpga.
About Microsemi's Industrial and Industrial IoT Solutions Portfolio
Microsemi is a provider of industrial and industrial IoT solutions, products and services for applications such as automation, smart energy, networking, transportation and surveillance. This includes secure, reliable and low power field programmable gate arrays (FPGAs) and system-on-chip (SoC) FPGAs with intellectual property (IP) building blocks and development software; industrial Ethernet switches with management software and PHYs; Power-over-Ethernet (PoE) integrated circuits (ICs) and midspans; 1588 precision timing and synchronization devices; comprehensive drivers and interfaces ICs including sensor interface devices; power discretes such as Silicon Carbide (SiC) MOSFETs, power modules and state-of-the-art audio processing solutions. For more information about Microsemi's complementary product portfolio for industrial applications, visit http://www.microsemi.com/applications/industrial. For more information on Microsemi's security products and technologies, visit http://www.microsemi.com/applications/security and for more information on Microsemi's product directory, visit http://www.microsemi.com/products/.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the availability of a new imaging/video solution for the development of low power and reliable video processing applications, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
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