FSI International, Inc. (Nasdaq: FSII), a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today that a leading Asia-based foundry has ordered an ANTARES® CryoKinetic Cleaning System. The evaluation system will be used for particle removal after in-line wafer testing and other high defectivity steps to focus on improving overall device yield. The system is expected to ship in January 2011. FSI has over 150 ANTARES process chambers in production at foundry and logic device producers worldwide.

The ANTARES® System is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. CryoKinetic processing technology is an all-dry, non-reactive process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL.

FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and cryogenic aerosol technologies, customers are able to achieve their process performance, flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. For more information, visit FSI’s website at http://www.fsi-intl.com.