Hong Kong, Feb 3, 2015 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group", stock code: 1347), a leading pure-play 200mm foundry in the world, announced today that it shipped more than 565 million Java smart card chips in 2014, hitting a historical high and surging by 62% compared with the 348 million shipments in 2013. Such significant growth is mainly benefited from the applications of Java smart cards driven by global mobile communication market as well as the recognition and support gained from multiple renowned fabless chip design houses in the industry.
Java smart cards, given their perfect extendibility, good compatibility and high security, have been widely used in a number of areas demanding high security, including telecommunication and finance, etc. Company's 0.13um and 0.11um embedded non-volatile memory (eNVM) solution offers high reliability and 100 years of data retention after 300,000 endurance. Its eNVM solutions deliver superior performance on smaller die size relative to those of its competitors. In particular, the chip's unit cost of the 0.11um embedded flash memory technology, with only twenty-five mask layers, is relatively lower compared to that of 300mm wafer process technology. It is recognized as the most cost-effective solution in the market nowadays. These advantages make Hua Hong Semiconductor the foundry of choice for a variety of fast growing eNVM applications such as smart cards and MCUs.
As a technology leader in the smart card foundry field for years, Hua Hong Semiconductor is now the largest smart card IC foundry in the world. It shipped 3.14 billion smart card chips, which include 2.66 billion SIM card chips in 2014, accounting for approximately 50% share in the global market.
"Given the market opportunity of rapidly growing mobile payment, we look forward to stepping further in the high density flash memory Java smart card market. We are actively developing a chip manufacturing process platform to cater the needs of high integration, high performance, high reliability, high security and low power consumption for the new generation mobile payment, and enhance the market competitiveness of our clients' products," said Dr. Cheng Fu, Executive Vice President of Hua Hong Semiconductor.
Source: Hua Hong Semiconductor
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