Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced that Paul F. McLaughlin, the Company’s Chairman and Chief Executive Officer, will participate in the D.A. Davidson & Co. 7th Annual Technology Forum Investor Conference. Mr. McLaughlin will present Wednesday, May 27, 2015 from 8:15 to 8:55 AM EDT, with one-on-one meetings held throughout the day. The conference will be held at The Grand Hyatt Hotel, New York, New York.
For additional information or to schedule a one-on-one meeting, please contact your D.A. Davidson & Co. contact.
About Rudolph Technologies
Rudolph Technologies, Inc. is a
leader in the design, development, manufacture and support of defect
inspection, advanced packaging lithography, process control metrology,
and data analysis systems and software used by semiconductor device
manufacturers worldwide. Rudolph provides a full-fab solution through
its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device
manufacturers to drive down the costs and time to market of their
products. The Company’s expanding portfolio of equipment and software
solutions is used in both the wafer processing and final manufacturing
of ICs, and in adjacent markets such as FPD, LED and Solar.
Headquartered in Flanders, New Jersey, Rudolph supports its customers
with a worldwide sales and service organization. Additional information
can be found on the Company’s website at www.rudolphtech.com.
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Contacts:
Rudolph Technologies, Inc.
Steven R. Roth,
973-448-4302
Senior Vice President & CFO
steven.roth@rudolphtech.com
or
Guerrant
Associates
Laura Guerrant-Oiye, 808-882-1467
Principal
lguerrant@guerrantir.com