The report on the global High Density Interconnect PCB Market covers historical market trends, current market dynamics, market valuation by segmentation as well as region, key player's market share analysis, competitive landscape and supply chain analysis.
Pune, India - February 4, 2019 /MarketersMedia/ —
Market Highlights
Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) market is expected to have significant growth over the forecast period. The increasing need for smaller, energy-efficient, and high-performance PCBs in diverse electronic products acts as the major driving factor for the growth of HDI PCB market globally. However, the high cost associated with manufacturing and lack of expertise in manufacturing are hampering the market growth.
In this study, the HDI PCB market is segmented based on number of high-density interconnection layer, industry vertical, and regions/country. By number of high-density interconnection layer, the market is segmented into 1, 2 or more, and all. On the basis of industry vertical, the market is segmented into consumer electronics, military and defense, telecom and IT, automotive, manufacturing, medical devices, and others. Finally, the regions covered in this study are North America- US, Canada, and Mexico; Europe- Germany, France, the UK, and the rest of Europe; Asia-Pacific- China, India, Japan, and the rest of Asia-Pacific; and the rest of the world, which includes Middle East and Africa and Latin America.
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Major Key players
• Epec, LLC (US),
• TTM Technologies (US),
• PCBCART (China),
• Millennium Circuits Limited (US),
• RAYMING (China),
• Mistral Solutions Pvt. Ltd. (India),
• SIERRA CIRCUITS, INC. (US),
• Advanced Circuits (US),
• FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan),
• FINELINE Ltd. (Israel),
• Austria Technologie & Systemtechnik Aktiengesellschaft (Austria).
Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) Market is expected to grow from USD 8,683.9 million in 2018 to USD 15,600.6 million by 2023, at a CAGR of 12.4% during the forecast period, 2018–2013.
Competitive Analysis
According to the latest trend in the HDI PCB Market, most enterprises are expanding their technological capabilities, with increased investments in research and developments activities. Most of the companies have adopted inorganic strategy to expand their businesses, wherein, partnership and collaboration accounted for XX%, whereas; merger & acquisition accounted for XX% of the overall key development undergone by the key players in the market.
Regional Analysis
The global market for global HDI PCB is estimated to grow at a significant rate during the forecast period from 2018 to 2023. The geographical analysis of the market is studied for North America, Europe, Asia-Pacific, and the rest of the world.
North America is presumed to have significant growth in the HDI PCB market. The US and Canada are the leading countries in the region. The growth is attributed to increase in demand for wearable devices in the healthcare sectors and high demand in the automotive sector. Asia Pacific is also anticipated to be the fastest growing region in the HDI PCB market over the forecast period. India, Japan, South Korea, and China are the leading countries in the HCI PCB market. This is due to the presence of a large number of electronics and semiconductor manufacturers in the region and wide usage of consumer electronics products in the region.
Segmentation.
The global HDI PCB Market is segmented into number of high-density interconnection layer, industry vertical, and regions/country.
By number of high density interconnection layer, the market is segmented into 1, 2, and all.
By industry vertical, the market is segmented into consumer electronics, military and defense, telecom and IT, automotive, manufacturing, medical devices, and others.
By region, the market is segmented into North America, Europe, Asia-Pacific, and rest of the world.
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Intended Audience
• HDI PCB manufacturers
• Electronic product manufacturers
• Resellers and Distributors
• Standard Making Bodies and Associations
• Automotive and Manufacturing Industries
• Custom electronic product developers
LIST OF TABLES
Table 1 Global High-Density Interconnect PCB Market, By Region, 2018-2023
Table 2 North America High-Density Interconnect PCB Market, By Country, 2018-2023
Table 3 Europe High-Density Interconnect PCB Market, By Country, 2018-2023
Table 4 Asia-Pacific High-Density Interconnect PCB Market, By Country, 2018-2023
Table 5 Rest of the World High-Density Interconnect PCB Market, By Country, 2018-2023
Table 6 North America High-Density Interconnect PCB Market, By Industry Vertical, By Country, 2018-2023
Continued…….
LIST OF FIGURES
FIGURE 1 Global High-Density Interconnect PCB Market: Segmentation
FIGURE 2 Forecast Methodology
FIGURE 3 Porter’s Five Forces Analysis of Global High-Density Interconnect PCB Market
FIGURE 4 Value Chain of Global High-Density Interconnect PCB Market
FIGURE 5 Share of Global High-Density Interconnect PCB Market by Country, 2017
Continued…….
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Contact Info:
Name: abhishek Sawant
Organization: Market Research Future
Phone: +1 646 845 9312
Website: https://www.marketresearchfuture.com/reports/high-density-interconnect-pcb-market-7290
Source: MarketersMedia
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