Taiwan's Advanced Semiconductor launches $400 mln convertible bond-terms

HONG KONG, Aug 29 (Reuters) - Taiwan's Advanced Semiconductor Engineering Inc plans to raise $400 million selling convertible bonds due 2018, according to a term sheet of the deal seen by Reuters on Thursday.
Data & News supplied by www.cloudquote.io
Stock quotes supplied by Barchart
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the following
Privacy Policy and Terms and Conditions.