About Us

About Cabling Installation & Maintenance

Our mission: Bringing practical business and technical intelligence to today's structured cabling professionals

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on.

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Cabling Installation & Maintenance is published by Endeavor Business Media, a division of EndeavorB2B.

Contact Cabling Installation & Maintenance

Editorial

Patrick McLaughlin

Serena Aburahma

Advertising and Sponsorship Sales

Peter Fretty - Vice President, Market Leader

Tim Carli - Business Development Manager

Brayden Hudspeth - Sales Development Representative

Subscriptions and Memberships

Subscribe to our newsletters and manage your subscriptions

Feedback/Problems

Send a message to our general in-box

 

My Watchlist
Indicators
Cabling Market Index
Markets
Stocks
ETFs
Tools
Markets:
Overview
News
Currencies
International
Treasuries

Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

By: via Business Wire

Highlights:

  • Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA optimization
  • Native 3D partitioning flow automates intelligent creation of memory-on-logic 3D stacking configuration, providing PPA improvements for 3D stack designs
  • Customers can confidently adopt the Cadence Integrity 3D-IC platform and Samsung Foundry’s multi-die implementation flow to create next-generation hyperscale computing, mobile, automotive and AI applications

Cadence Design Systems, Inc. (Nasdaq: CDNS), a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE™), today announced that Samsung Foundry has qualified the Cadence® Integrity™ 3D-IC platform’s 2D-to-3D native 3D partitioning flow. Using the new flow, customers can partition existing 2D designs into 3D memory-on-logic configurations and achieve better power, performance and area (PPA) with a homogeneous 3D stack when compared with the original 2D design. The flow also provides robust 3D-IC system planning, implementation and early analysis capabilities for the partitioned design, which is ideal for customers creating complex, next-generation hyperscale computing, mobile, automotive and AI applications.

Hitting a memory wall where RAM access cannot keep pace with CPU execution speed causes the overall system to slow down due to memory latency. One way to overcome this is to place memories on top of the logic in a homogenous stacking configuration. The configuration, when mounted on the same package, reduces wirelength and area and speeds up memory access, thus helping to improve the performance of the CPU core.

The Integrity 3D-IC platform’s 3D partitioning enables the user to separate out memory macros and standard cells and place them on two different dies within a 3D homogeneous stack. The automated flow performs partitioning and full implementation of the 3D stack while building connections between the macros and standard cells. Once the contents of each die are finalized, the system and package can be implemented in the Integrity 3D-IC platform, enabling bump planning, implementation, co-design with other dies, and early analysis of thermal, power and static timing analysis (STA).

“Customers faced with varying automated partitioning requirements for 3D-IC configurations can take advantage of this unique capability in Samsung Foundry’s MDI reference flow based on Native 3D partitioning in Cadence’s new Integrity 3D-IC platform to explore the effects of chip stacking,” said Sangyun Kim, vice president of Foundry Design Technology Team at Samsung Electronics. “This successful cooperation between Cadence and Samsung provides customers with a partitioning, implementation and analysis flow for stacked 3D designs that enables them to reduce power consumption and area while improving overall system performance.”

“Through our ongoing collaboration with Samsung Foundry, we’ve collaborated to innovate in the area of multi-die implementation and deliver automated Native 3D partitioning flows,” said Vivek Mishra, corporate vice president, Product Engineering in the Digital & Signoff Group at Cadence. “Samsung Foundry’s advanced packaging for multi-die implementation, combined with Cadence’s unified Integrity 3D-IC platform, provides our mutual customers with robust multi-die solutions.”

The Integrity 3D-IC platform provides customers with a common cockpit and database, a complete planning system, seamless implementation tool integration, integrated system-level analysis capabilities and an easy-to-use interface and lets users co-design with the Virtuoso® Design Environment and Allegro® packaging technologies. The platform also includes a broader Cadence 3D-IC solution portfolio including the Voltus™ IC Power Integrity Solution for power delivery network (PDN) analysis, Celsius™ Thermal Solver for 3D thermal analysis, Tempus™ Timing Signoff Solution for 3D signoff timing and Pegasus™ Verification System for system layout-versus-schematic (LVS). For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/Integrity3DICpl.

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design™ strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For seven years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2021 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

Category: Featured

Cadence, a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE), announced that Samsung Foundry has qualified the Cadence® Integrity™ 3D-IC platform’s 2D-to-3D native 3D partitioning flow. #hyperscale #mobile #automotive #AI

Contacts

More News

View More
Why Seagate Is Wall Street's New Favorite AI Infrastructure Play
Via MarketBeat
Topics Artificial Intelligence
Tickers BAC STX
3 AI Infrastructure Stocks With Upside After the Summer Rally
Via MarketBeat
Topics Artificial Intelligence
Tickers AMZN ANET AVGO GOOGL META MSFT
Can Advantage2 Help Overcome D-Wave's Share Price Plateau?
Via MarketBeat
Tickers F GEV NVDA QBTS
Eli Lilly’s Oral GLP-1 Breakthrough Could Change Everything
Via MarketBeat
Tickers LLY
The Fed Cut Rates: What Now for the S&P 500 and Equity Markets?
Via MarketBeat
Topics ETFs Economy Stocks
Tickers NVDA SNOW SPY WDAY
Stock Quote API & Stock News API supplied by www.cloudquote.io
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the following
Privacy Policy and Terms Of Service.