About Us

About Cabling Installation & Maintenance

Our mission: Bringing practical business and technical intelligence to today's structured cabling professionals

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on.

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Cabling Installation & Maintenance is published by Endeavor Business Media, a division of EndeavorB2B.

Contact Cabling Installation & Maintenance

Editorial

Patrick McLaughlin

Serena Aburahma

Advertising and Sponsorship Sales

Peter Fretty - Vice President, Market Leader

Tim Carli - Business Development Manager

Brayden Hudspeth - Sales Development Representative

Subscriptions and Memberships

Subscribe to our newsletters and manage your subscriptions

Feedback/Problems

Send a message to our general in-box

 

My Watchlist
Indicators
Cabling Market Index
Markets
Stocks
ETFs
Tools
Markets:
Overview
News
Currencies
International
Treasuries

Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings

By: via Business Wire

Highlights:

  • Cadence’s Integrity 3D-IC platform, the industry’s first comprehensive solution that integrates system planning, chip and packaging implementation and system-level analysis in a single platform, is the leading full-flow solution certified for TSMC’s 3DFabric technologies
  • TSMC and Cadence collaborated to develop TSMC’s new 3Dblox standard to advance 3D-IC design
  • Joint customers using Cadence and TSMC offerings can accelerate multi-chiplet design turnaround time

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence® Integrity™ 3D-IC platform has achieved certification for and met all reference design flow criteria for TSMC’s 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips (TSMC-SoIC™) technologies. As part of the collaboration, the companies worked together to enable Cadence’s support of the TSMC 3DbloxTM standard to help customers accelerate advanced multi-die package design across 5G, AI, mobile, hyperscale computing and IoT applications.

The Cadence Integrity 3D-IC platform combines system planning, implementation, Cadence Allegro® X packaging technologies and system-level analysis and is the industry’s leading full-flow platform enabled for TSMC’s new 3Dblox standard, which speeds 3D front-end design partitioning in complex systems. 3Dblox streamlines key aspects of design methodologies and allows chiplet reuse, providing a seamless interface for Cadence system analysis tools for early power delivery network (PDN) and thermal analysis via the Cadence Voltus™ IC Power Integrity Solution and Celsius™ Thermal Solver, extraction and static timing analysis via the Cadence Quantus™ Extraction Solution and Tempus™ Timing Signoff Solution and system-level layout versus schematic (LVS) checks via the Cadence Pegasus™ Verification System. Cadence’s new Allegro Substrate Router (ASR) technology is integrated with Allegro X packaging technologies for ultra-high density die-to-die and die-to-package RDL auto-routing.

“In today’s electronics market, customers need every advantage they can get when developing the highly sophisticated 3D-ICs that power emerging application areas,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “By working to ensure the Cadence Integrity 3D-IC platform is certified for use with TSMC 3DFabric technologies, our mutual customers can enjoy significant gains in design efficiency that will help them get advanced, multi-chip solutions to market quickly.”

“Our Integrity 3D-IC platform offers system planning, packaging and system-level analysis in a single platform, which provides customers with seamless design creation capabilities and a comprehensive signoff flow that supports TSMC’s 3DFabric offerings,” said Dr. Chin-Chi Teng, senior vice president and general manager in the Digital & Signoff Group at Cadence. “By continuing to collaborate with TSMC, we’re giving our customers an efficient way to leverage the latest developments in 3D chip and multi-die technologies without compromising on time to market.”

The Cadence Integrity 3D-IC platform is part of the company’s broader 3D-IC offering and aligns with the Cadence Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence. For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/integrityadv3dicpr.

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For eight years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2022 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

Category: Featured

Cadence announced that the leading Cadence Integrity 3D-IC platform has achieved certification for and met all reference design flow criteria for TSMC’s 3DFabric offerings, including InFO, CoWoS and TSMC-SoIC.

Contacts

More News

View More
Why Seagate Is Wall Street's New Favorite AI Infrastructure Play
Via MarketBeat
Topics Artificial Intelligence
Tickers BAC STX
3 AI Infrastructure Stocks With Upside After the Summer Rally
Via MarketBeat
Topics Artificial Intelligence
Tickers AMZN ANET AVGO GOOGL META MSFT
Can Advantage2 Help Overcome D-Wave's Share Price Plateau?
Via MarketBeat
Tickers F GEV NVDA QBTS
Eli Lilly’s Oral GLP-1 Breakthrough Could Change Everything
Via MarketBeat
Tickers LLY
The Fed Cut Rates: What Now for the S&P 500 and Equity Markets?
Via MarketBeat
Topics ETFs Economy Stocks
Tickers NVDA SNOW SPY WDAY
Stock Quote API & Stock News API supplied by www.cloudquote.io
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the following
Privacy Policy and Terms Of Service.