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Our mission: Bringing practical business and technical intelligence to today's structured cabling professionals

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on.

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Cabling Installation & Maintenance is published by Endeavor Business Media, a division of EndeavorB2B.

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Xperi and LAPIS, a ROHM Group Company, Enter into Hybrid Bonding License Agreement

Technology transfer includes DBI® Ultra die-to-wafer hybrid bonding know-how

Adeia, the newly launched brand for the intellectual property (IP) licensing business of Xperi Holding Corporation (NASDAQ: XPER) (“Xperi”) and LAPIS Technology Co., Ltd., (“LAPIS”), a ROHM Group subsidiary, today announced an agreement that includes a technology transfer of Adeia’s DBI® Ultra die-to-wafer hybrid bonding know-how to support the development and deployment of the technology into LAPIS’s product portfolio. The agreement also includes a license to Adeia’s foundational hybrid bonding patent portfolio.

“Our customers are at the forefront of advanced technology applications and continue to drive innovation in their fields. We are pleased to have the access to Adeia’s groundbreaking hybrid bonding technology that will propel our capabilities,” said Hiroyuki Fukuyama, vice president, LSI & member, Board of Directors of LAPIS. “It enables us to support our customers’ future requirements to develop the next-generation of products.”

“Combining LAPIS’s product development and manufacturing expertise with our foundational hybrid bonding technology and know-how will enable LAPIS to deliver a new generation of ASSPs and custom LSI ASICs,” said Dana Escobar, general manager of Adeia’s semiconductor business. “We look forward to continuing to work together and building upon our mutually beneficial technology partnership.”

Adeia has pioneered fundamental advances in the semiconductor industry over the last 30 years. With a large and growing portfolio of intellectual property covering hybrid bonding, semiconductor packaging and semiconductor processing technologies, Adeia licenses and partners with leading semiconductor companies around the world.

About Adeia

Adeia invents, develops and licenses fundamental innovations that shape the way millions of people explore and experience entertainment in an increasingly connected world. From TVs to smartphones, and across all types of entertainment experiences, Adeia’s technologies allow users to manage content and connections in a way that is smart, immersive and personal. For more information, please visit adeia.com.

About Xperi Holding Corporation

Xperi invents, develops, and delivers technologies that enable extraordinary experiences. Xperi technologies, delivered via its brands (Adeia, DTS, HD Radio, IMAX Enhanced, TiVo), and by its startup, Perceive, make entertainment more entertaining, and smart devices smarter. Xperi technologies are integrated into billions of consumer devices, media platforms, and semiconductors worldwide, driving increased value for partners, customers and consumers.

Xperi, Adeia, DTS, DBI, IMAX Enhanced, Invensas, HD Radio, Perceive, TiVo and their respective logos are trademarks or registered trademarks of affiliated companies of Xperi Holding Corporation in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

About LAPIS Technology Co., Ltd.

LAPIS Technology Co., Ltd. is a ROHM Group semiconductor company providing microcontrollers, wireless communication LSIs, video LSIs, and display driver LSIs. LAPIS Technology was established on October 1, 2020 by splitting off the LSI business from LAPIS Semiconductor Co., Ltd. For more information, please visit the following URL: https://www.lapis-tech.com/en/

Source: Xperi Holding Corp

XPER – I

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