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For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on.

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
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Cabling Installation & Maintenance is published by Endeavor Business Media, a division of EndeavorB2B.

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Thermo Fisher Scientific Announces New Fault Localization Solution for the Analysis of Advanced Logic Semiconductors

Thermo Scientific Meridian EX System uses an electron beam probe to help users localize defects within complex power networks and achieve 10X improvement in spatial resolution compared to optical fault isolation solutions

Thermo Fisher Scientific, the world leader in serving science, has introduced the Thermo Scientific™ Meridian™ EX System— an electron-beam-based failure analysis solution designed to enable precise fault localization on advanced semiconductor logic technologies.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20231031595383/en/

Introducing the Thermo Scientific Meridian EX Semiconductor Fault Isolation System (Photo: Business Wire)

Introducing the Thermo Scientific Meridian EX Semiconductor Fault Isolation System (Photo: Business Wire)

As semiconductor manufacturers adopt more complex architectures to deliver higher performing, energy efficient semiconductors, they are pushing the boundaries of existing failure analysis solutions. Where optical fault isolation tools can still be used for mainstream semiconductors, advanced logic devices now require new solutions to isolate and identify subtle electrical defects which may be fully obscured by metal interconnects on the backside and frontside of the device.

Thermo Fisher’s new Meridian EX System uses an electron beam to probe the device under test. The much smaller wavelength of electron beams versus lasers can help users achieve a 10X spatial resolution improvement compared to commercially available optical laser-based fault isolation solutions. This improvement helps eliminate “cross-talk” from adjacent circuits to deliver more reliable characterization data.

In addition, Meridian EX’s electron beam can enable users to capture dynamic data off metal interconnects, such as power distribution layers, which optical fault isolations systems cannot.

“Chip manufacturers are developing devices with smaller features, new power distribution architectures and new materials, resulting in an increased number of process defects that must be localized and characterized,” said Mohan Iyer, vice president and general manager, semiconductor, at Thermo Fisher Scientific. “As an industry leader in failure analysis workflows and applications, we’re proud to help semiconductor manufacturers address key fault isolation challenges by introducing the Meridian EX and adding electron beam probing technology to Thermo Fisher’s suite of advanced device analysis workflows.”

Features include:

  • A new, dedicated electron column design enables precision, through metal probing.
  • A new, high-speed beam switching sub-system enables localization of subtle chip defects.
  • Industry standard Thermo Scientific Meridian software interface for ease of use and rapid integration into existing lab failure analysis workflows.

Learn more about the Thermo Scientific Meridian EX System: thermofisher.com/meridian-ex

About Thermo Fisher Scientific

Thermo Fisher Scientific Inc. is the world leader in serving science, with annual revenue over $40 billion. Our Mission is to enable our customers to make the world healthier, cleaner and safer. Whether our customers are accelerating life sciences research, solving complex analytical challenges, increasing productivity in their laboratories, improving patient health through diagnostics or the development and manufacture of life-changing therapies, we are here to support them. Our global team delivers an unrivaled combination of innovative technologies, purchasing convenience and pharmaceutical services through our industry-leading brands, including Thermo Scientific, Applied Biosystems, Invitrogen, Fisher Scientific, Unity Lab Services, Patheon and PPD. For more information, please visit www.thermofisher.com.

As manufacturers adopt more complex architectures to deliver higher performing, energy efficient semiconductors, they now require new solutions to isolate and identify subtle electrical defects.

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