About Cabling Installation & Maintenance

Our mission: Bringing practical business and technical intelligence to today's structured cabling professionals

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on.

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Cabling Installation & Maintenance is published by Endeavor Business Media, a division of EndeavorB2B.

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ASE wins Device Technology of the Year award for VIPack™

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that its VIPack™ has received the ‘Device Technology of the Year Award’ in the 2023 3D InCites Awards program. This accolade recognizes industry-wide contributions in the development of heterogeneous integration technologies including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230502005061/en/

Introduced in 2022, VIPack™ is an advanced packaging platform designed to enable vertically integrated package solutions. VIPack™ represents ASE’s next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.

ASE’s VIPack™ is comprised of six core packaging technology pillars supported by a comprehensive and integrated co-design ecosystem. These include ASE’s high density RDL-based Fanout Package-on Package (FOPoP), Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP) as well as Through Silicon Via (TSV)-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities. The VIPack™ platform provides the capabilities necessary to enable trailblazing highly integrated silicon packaging solutions required to optimize clock speed, bandwidth, and power delivery, and to reduce co-design time, product development, and time to market.

Co-Founder of 3D InCites, Françoise von Trapp, conveyed, “ASE has been making a splash over the past year with VIPack™ and it caught the judges’ attention for its core technology pillars supported by a comprehensive and integrated co-design ecosystem.” She continued, “VIPack™ is being recognized for its innovative solutions that support complex applications across high-performance computing (HPC), artificial intelligence (AI), machine learning (ML) and network applications, as well as optical interconnects. On behalf of the 3D InCites community, I’d like to extend sincere congratulations to ASE.”

“This prestigious award acknowledges the tremendous impact of the VIPack™ platform as it continues to scale, and also brings home the outstanding efforts of our global teams that are dedicated to helping customers achieve product differentiation and competitive advantage,” said Dr. C.P. Hung, Vice President of R&D, ASE. “The rising adoption of chiplet-based co-designs is further fueling demand for multi-chip integration into a single package, and ASE’s VIPack™ delivers a collaborative platform for exceptional interconnect solutions where 3D heterogeneous integration has become critical.”

“We feel honored and absolutely thrilled to receive the Device Technology of the Year award from 3DInCites, as it is not only testament to the value of VIPack™, but the exemplary creativity of our teams to advance system capability and propel our industry forward,” said Yin Chang, ASE’s Senior Vice President of Sales & Marketing. He continued, “As we move further into the chiplets era, ASE’s VIPack™ is evolving, and delivering the technology advancements that enable us to be innovative, original, and imaginative.”

The award was presented to Mark Gerber, Sr. Director of Engineering and Technical Marketing, at the IMAPS Device Packaging Conference 2023 in Fountain Hills, Arizona.

Available now, ASE’s VIPack™ is a scalable platform that will expand in alignment with industry roadmaps. For more: https://ase.aseglobal.com/en/vipack

About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on LinkedIn and Twitter: @aseglobal.

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