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Our mission: Bringing practical business and technical intelligence to today's structured cabling professionals

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on.

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
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  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Cabling Installation & Maintenance is published by Endeavor Business Media, a division of EndeavorB2B.

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Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform

By: via Business Wire
  • Companies advance multi-die planning and implementation, leveraging Cadence’s Integrity 3D-IC platform, the industry’s only unified platform that combines system planning, packaging and system-level analysis
  • Integrity 3D-IC platform supports Samsung’s new 3D CODE standard, enabling designers to create a variety of advanced packaging technologies
  • Cadence and Samsung technologies provide customers with comprehensive, customized solutions for diverse configurations that reduce the overall 3D-IC design development time for 5G, AI, hyperscale, IoT and mobile applications

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced an expanded collaboration with Samsung Foundry to accelerate 3D-IC design development for next-generation applications like hyperscale computing, 5G, AI, IoT and mobile. This latest collaboration advances multi-die planning and implementation with the delivery of the latest reference flows and corresponding package design kits based on the Cadence® Integrity™ 3D-IC platform, the industry’s only unified platform that includes system planning, packaging and system-level analysis in a single cockpit. In addition, the Integrity 3D-IC platform supports Samsung’s new 3D CODE standard, a new system description language that simplifies the definition and interoperability of design creation and analysis flows in a unified environment.

When developing advanced package multi-die designs, engineers can encounter design analysis and flow complexities, configuration challenges, and system-level thermal and power integrity issues, all of which extend design turnaround time. To address these challenges, the comprehensive, unified solution—reference flows, package design kits and the Samsung 3D CODE standard—simplifies the multi-die design and implementation process, improving productivity and reducing design turnaround time. The reference flows based on the Integrity 3D-IC platform offer key capabilities, including early analysis for the power delivery network (PDN), thermal and system-level layout versus schematic (LVS) and design rule checking (DRC). The flows also incorporate the Cadence Allegro® X packaging technologies as well as multiphysics system-level analysis tools, Celsius™ Thermal Solver and Clarity™ 3D Solver, which provide further productivity benefits.

“Customers creating high-performance designs are looking to make use of the benefits advanced packaging technologies offer, such as lower power, lower yield cost and system performance boosts,” said Sangyun Kim, vice president of the Foundry Design Technology Team at Samsung Electronics. “With the introduction of our 3D CODE technology and Cadence’s comprehensive new flows, we’re providing mutual customers with the next-generation chiplet architectures required to achieve multi-die planning and implementation objectives so they can deliver high-quality products to market faster.”

“Through our continued collaboration with Samsung Foundry, we’re helping customers gain a competitive edge with our multi-die design platform,” said Vivek Mishra, corporate vice president in the Digital & Signoff Group at Cadence. “The reference flows based on the Cadence Integrity 3D-IC platform combined with Samsung’s latest technologies provide our customers a unified design environment that simplifies the workflow and reduces multi-die planning and implementation turnaround time when creating complex 3D-IC designs.”

The Cadence Integrity 3D-IC platform supports the company’s Intelligent System Design™ strategy, enabling SoC design excellence. For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/integrity3dadvpckg.

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2023 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

Category: Featured

Cadence expanded its collaboration with Samsung Foundry to accelerate 3D-IC design development for next-generation applications like hyperscale computing, 5G, AI, IoT and mobile.

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