Accelsius to Showcase Advanced Direct Liquid Cooling Technologies at 2024 OCP Global Summit

October 10, 2024 at 07:00 AM EDT

The company will present results from joint research and demonstrate its two-phase, direct-to-chip technology at the OCP Innovation Village

Accelsius™, whose patented two-phase, direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge operators, today announced its plans to showcase advanced cooling solutions at the 2024 OCP Global Summit in San Jose, California, from Oct. 15-17. The company will present research findings and demonstrate innovative technologies aimed at helping organizations dramatically improve data center performance and efficiency.

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Key highlights of Accelsius' participation in the OCP Global Summit include:

Technology White Paper and Test Results—Accelsius, in concert with a top-tier chip OEM, has conducted advanced experimental testing to demonstrate the feasibility of a common or universal cold plate that can use either water, propylene glycol-water mixture or low and medium-pressure refrigerant as the working fluid. The results of this research will be presented in a co-authored technology white paper at the OCP Future Technologies Symposium on Oct. 16, SJCC Lower Level – LL20BC, highlighting the testing methodology, results and conclusions.

“This work represents a significant step forward in advancing liquid cooling technologies for data centers,” said Dr. Richard Bonner, CTO of Accelsius. “By combining our expertise in two-phase direct-to-chip cooling with advanced chip technologies, we're paving the way for more efficient and powerful computing solutions.”

Tabletop Demonstrator—Along with the research, Accelsius developed a tabletop-size demonstrator for its NeuCool two-phase direct-to-chip technology. This demonstrator, which showcases the efficiency of refrigerant-based liquid cooling at the engineered cold plate level in a closed loop, will be available for hands-on exploration from 8 a.m. to 4 p.m. on Oct. 16 in the Lower Level Foyer of LL20BC as part of the Future Technologies Symposium. This tabletop hardware demonstration will allow the visualization of the boiling process and two-phase thermal performance in a relevant form factor.

Accelsius' NeuCool platform is a two-phase, direct-to-chip liquid cooling system that utilizes a safe, proven dielectric refrigerant. The system has been tested to 2,200 watts per server chip (CPU, GPU), providing significant performance headroom for AI and high-performance computing applications while offering potential energy savings of up to 50% compared to traditional air cooling.

To learn more about Accelsius’ NeuCool two-phase direct-to-chip in-rack liquid cooling solution, email info@accelsius.com or visit accelsius.com.

About Accelsius

Accelsius, founded by Innventure LLC, empowers data center and edge operators to meet their business, financial and sustainability goals through next-generation cooling systems. The Accelsius NeuCool Platform delivers patented two-phase, direct-to-chip liquid cooling systems with best-in-class thermal efficiencies. NeuCool uses a sustainable, safe dielectric fluid and intelligent monitoring to provide a risk-free technology that scales from a single rack to an entire data center. NeuCool technology combined with Accelsius' US-based manufacturing and robust professional services program gives data center operators the confidence to evolve cooling approaches while ensuring performance improvements and continued uptime. For more information, visit www.accelsius.com. LinkedIn: https://www.linkedin.com/company/accelsius/