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Bringing practical business and technical intelligence to today's structured cabling professionals.

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on:

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Transphorm Demonstrates a Bidirectional SuperGaN Power Supply with New Reference Design for E-Mobility and Energy/Industrial Markets

300 W DC-to-DC Battery Charger Board Showcases Key Capability of GaN Technology Necessary to Advance E-Mobility Applications

Transphorm, Inc. (Nasdaq: TGAN), the global leader in robust GaN power semiconductors, today announced the release of a new 300 W DC-to-DC GaN reference design for 2- and 3-wheeled electric vehicle battery chargers. The TDDCDC-TPH-IN-BI-LLC-300W-RD design uses TP65H150G4PS 150 mOhm SuperGaN® FETs in a robust TO-220 package to power a high performing, high efficiency energy harvesting and distribution battery charging system. The new board notably demonstrates one of the most anticipated value propositions of a GaN power supply: bidirectionality. This capability indicates that a single power system can deliver power in two directions from input (AC) to output (DC) and output (DC) to input (AC) depending on system needs, with GaN enabling energy efficiency in both conversions.

“The first value proposition of GaN in high power applications was realized by the highly efficient operation of the bridgeless totem-pole power factor correction circuit. This subsequently led to the next level of benefits across a variety of topologies, including overall smaller and lower-cost power systems across the full power conversion spectrum, from 30 watts to over 10 kilowatts,” said Primit Parikh, President and CEO, Transphorm. “Continuing the leadership of Transphorm GaN in higher power applications, we have now demonstrated bidirectional power conversion that can be used by vehicle on-board chargers for e-mobility, renewable energy and backup power systems, and other power supply applications requiring highly integrated, interchangeable input and output terminals.”

Bidirectionality is a core capability required to advance V2X (vehicle-to-everything) infrastructure for e-mobility applications that comprise V2L (vehicle-to-load), V2H (vehicle-to-house), and V2G (vehicle-to-grid) scenarios, which represent a projected overall V2X system market size ranging from a conservative 9 billion USD to an aggressive 70 billion USD by 2030.

In EV systems, renewable energy systems, and other applications within the V2X model, design and performance flexibility will be critical to innovation and wider deployment. The high power density and bidirectionality is a key enabler for this area. The V2X applications are prime use cases that can truly leverage all the SuperGaN technology’s superior value proposition. This new reference design is an exciting example of what’s possible in a future enabled by SuperGaN technology.

TDDCDC-TPH-IN-BI-LLC-300W-RD Reference Design Specifications

The TDDCDC-TPH-IN-BI-LLC-300W-RD board is a fully analog implementation without complex firmware development for the power stage. This design configuration enables simpler and faster power system development.

Specification highlights follow:

Topology

Full-Bridge LLC

Convection Cooling

Natural convention without forced air

Output Power

300 W

Output Voltage

48 V/6 A, 380 V/0.9 A

Peak Efficiency

97.3%

Power Density

36.5 W/in3

Target Applications and Availability

The TDDCDC-TPH-IN-BI-LLC-300W-RD board is ideal for high power density applications such as the DC-to-DC power stage of bidirectional DC-to-AC inverter power supplies used in energy harvesting applications with solar-, battery- and/or grid-tied solutions as well as AC-to-DC power supplies used in 2-, 3-, and 4-wheeler battery chargers.

The design guide and BOM can be downloaded here: https://www.transphormusa.com/en/reference-design/tddcdc-tph-in-bi-llc-300w-rd/.

About Transphorm

Transphorm, Inc., a global leader in the GaN revolution, designs and manufactures high performance and high reliability GaN semiconductors for high voltage power conversion applications. Having one of the largest Power GaN IP portfolios of more than 1,000 owned or licensed patents, Transphorm produces the industry’s first JEDEC and AEC-Q101 qualified high voltage GaN semiconductor devices. The Company’s vertically integrated device business model allows for innovation at every development stage: design, fabrication, device, and application support. Transphorm’s innovations move power electronics beyond the limitations of silicon to achieve over 99% efficiency, 50% more power density and 20% lower system cost. Transphorm is headquartered in Goleta, California and has manufacturing operations in Goleta and Aizu, Japan. For more information, please visit www.transphormusa.com. Follow us on Twitter @transphormusa and WeChat at Transphorm_GaN.

The SuperGaN mark is a registered trademark of Transphorm, Inc. All other trademarks are the property of their respective owners.

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