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Bringing practical business and technical intelligence to today's structured cabling professionals.

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on:

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Adeia Wins ECTC Award for Paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”

Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and media technology sectors to market, was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024.

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters associated with implementing hybrid bonding technology in high-volume manufacturing processes.

“As adoption of hybrid bonding accelerates, there is rising demand for practical information and guidance on implementing the technology in high volume manufacturing. This paper provides a detailed pathway for manufacturers to understand the parameters, limitations and yield considerations of hybrid bonding, ultimately enabling industry leaders to successfully implement the technology in their own processes,” said Dr. Workman.

Hybrid bonding technology in advanced 2.5 and 3D packaging has rapidly gained traction in the semiconductor industry to enhance performance and scalability. Advanced packaging architectures integrate multiple semiconductor components into a single package or module to create functional systems. Within the package or module, a chip-to-chip interconnect is formed with hybrid bonding to deliver the highest bandwidth with low latency.

Hybrid bonding represents a significant advancement in semiconductor technology, particularly in terms of performance per watt.

“By enabling faster processing within established thermal limits, hybrid bonding enhances efficiency and reduces energy consumption,” explained Dr. Workman. “It achieves this by facilitating higher interconnect density than alternatives like micro-bumps, thereby improving bandwidth and lowering latency. Higher density of interconnections between the memory die and logic chip improves performance and efficiency while offering better thermal connectivity.”

Looking ahead, Dr. Workman stated that hybrid bonding is gaining increasing traction in high-volume manufacturing applications. Interest and activity in hybrid bonding are expected to grow as progress is made in shrinking the pitch to a submicron level.

“This would allow hybrid bonding to be a solution for an even wider range of applications. The next step is demonstrating how hybrid bonding can be implemented with standard equipment and processes. This will expand the practical opportunities to leverage the full benefits of this technology,” he concludes.

With over 20 years of experience in process and equipment engineering, Dr. Workman has successfully launched and managed fabrication and assembly lines for semiconductors, photonics, solar cells and nanotechnology. He is known for his excellent problem-solving skills as well has his deep knowledge of materials and manufacturing systems.

About Adeia

Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia’s fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia’s IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit www.adeia.com.

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