ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications

By: Advanced Semiconductor Engineering, Inc. via Business Wire

February 18, 2025 at 01:00 AM EST

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX) today officially launched its fifth plant in Penang, Malaysia.
The new plant will see improved manufacturing capabilities for advanced packaging technologies, and comes at a time when next-gen use technologies such as GenAI are increasingly in demand.

ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan Lepas Free Industrial Zone. The new plant is part of a strategic expansion plan that will expand the floor space of ASE’s Malaysia facility from its current area of 1 million square feet to approximately 3.4 million square feet.

Today’s launch ushers in a new era of smart manufacturing for ASE in Malaysia. Over the years, the Malaysia site has been upgrading its manufacturing operations by integrating Industry 4.0 technology and factory automation solutions. From the detection of abnormalities using AI, to improving yield and optimizing production processes through data analysis, the new plant harnesses the power of Artificial Intelligence of Things (AIoT) to enhance productivity and efficiency on the factory floor.

Speaking at the event, Penang Deputy Chief Minister II Yang Berhormat Jagdeep Singh Deo A/L Karpal Singh mentioned, “Backed by over fifty years of industrial excellence, Penang continues to be a premier investment destination for global industrial leaders seeking to expand in Southeast Asia. The establishment of ASE’s new chip packaging and testing facility marks a significant milestone, introducing cutting-edge technological capabilities to its decades-long operations in the state. This further cements Penang’s position as a powerhouse in the global semiconductor landscape, reinforcing its reputation as the ‘Silicon Valley of the East.’”

Meanwhile, Mr. Sivasuriyamoorthy Sundara Raja, Deputy Chief Executive Officer, Investment Promotion and Facilitation of MIDA, emphasised ASE’s contribution to Malaysia’s growing technological leadership, “ASE’s continued expansion here is a testament to the long-standing partnership between Malaysia and Taiwan. To stay ahead in this ever-changing and competitive field, it’s crucial for our businesses to keep innovating and team up with key industry players. That’s why I encourage our local companies to look at opportunities to collaborate with leaders like ASE. These partnerships will not only drive demand for precision engineering, automation, and semiconductor manufacturing, but they’ll also help our homegrown leaders.”

Also in attendance was Dr. Tien Wu, CEO of ASE Inc, who hailed the facility as a critical step in strengthening ASE’s global footprint, “Southeast Asia is increasingly becoming an important base for semiconductors, given its growing digital economy propelling the demand for advanced chips and its shift towards design and chip manufacturing in recent years. With Malaysia solidifying its position as a regional semiconductor hub, we see our expanded facility playing an even greater role across the global semiconductor value chain and contributing to the country’s economic growth. ASE remains committed to being a driving force for the development of the local and regional semiconductor industry, while continuing to meet and exceed the needs and expectations of our customers.”

With the semiconductor market on track to reach US$1 trillion in revenue in the next decade, OSAT manufacturing remains critical to the global electronics supply chain. As a leading OSAT player, ASE Malaysia has been serving major semiconductor companies since 1991. The new plant comes online at a time when advanced AI chips are increasingly required across various next-gen applications in machine learning, enterprise-led AI use cases, edge computing, electric vehicles and autonomous driving, and more. To that end, ASE is committed to investing in resources and human capital to capture more market share and extend the breadth and depth of its service offerings. The facility expansion will also have greater hiring as well as training and development needs, with an additional 1,500 employees over the next few years.

About ASE, Inc.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), is the leading global provider of semiconductor manufacturing services in packaging and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on LinkedIn & X: @aseglobal.

About MIDA

MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 21 overseas offices. MIDA continues to be the strategic partner to businesses in seizing the opportunities arising from the technology revolution of this era. For more information, please visit www.mida.gov.my and follow us on X, Instagram, Facebook, LinkedIn, TikTok and YouTube.

About InvestPenang

InvestPenang is the Penang State Government’s principal agency for the promotion of investment. Its objectives are to develop and sustain Penang’s economy by enhancing and continuously supporting business activities in the State through foreign and local investments, including spawning viable new growth centers. To realise its objectives, InvestPenang also runs initiatives like the SMART Penang Center (providing assistance to SMEs), Penang CAT Center (for talent attraction and retention), and Global Business Services (GBS) Focus Group (promoting and developing digital economy) and Penang Silicon Design @5km+ (establishing a unique and interconnected ecosystem for IC design and technology enterprises). For more information, please visit https://investpenang.gov.my/ and follow InvestPenang’s social media channels: Facebook; LinkedIn; WhatsApp Channel and TikTok.

Safe Harbor Notice

This presentation contains "forward-looking statements" within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. These statements are made under the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition, or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan” 3 and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. These forward-looking statements are necessarily estimates reflecting the best judgment of our senior management and our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied by the forward-looking statements for reasons including, among others, risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent shift in United States trade policies; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including the 2023 Annual Report on Form 20-F filed on April 3, 2024.

View source version on businesswire.com: https://www.businesswire.com/news/home/20250217276074/en/

Contacts

Media contacts:

ASE

Jennifer Yuen

Jennifer.Yuen@aseus.com

Oliver Gomez

ogomez@hoffman.com

MIDA

Mr. Mohd Mazlan bin Mokhtar

Director of Electrical and Electronics Division, MIDA

T: +603-2267 6655

E: mazlan@mida.gov.my

InvestPenang

Communications & Business Intelligence

Elaine Cheah / Arief Ferdaus

T: +604-646 8833

E: elaine@investpenang.gov.my / arief@investpenang.gov.my

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ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications

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