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Bringing practical business and technical intelligence to today's structured cabling professionals.

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on:

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Adeia to Present at Upcoming Conferences on Hybrid Bonding Technology

SAN JOSE, Calif., Sept. 30, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), a leader in invention of semiconductor technology, announced that several of its semiconductor technologists will present at various upcoming industry conferences. The presentations will focus on Adeia’s hybrid bonding technology, a key enabler for next-generation high-performance computing and AI applications.

Adeia continues to see growing interest in its hybrid bonding technology across the semiconductor industry and will be presenting at the following upcoming conferences:

  • At the IMAPS Conference in Boston, October 1-3, 2024. Dr. Guilian Gao, a distinguished engineer and leading expert in Adeia’s semiconductor division, will present on "Hybrid Bonding Process Technology" in an invited session. This presentation will cover market demands, process overviews, and future projections for hybrid bonding technology.
  • At the International Conference on Planarization/CMP Technology (ICPT) in Wiesbaden, Germany, October 16-18, 2024, Dr. Laura Mirkarimi, head and senior vice president of semiconductor engineering at Adeia, will deliver an invited talk on "CMP, A Key Enabling Process for Hybrid Bonding," highlighting the critical role of chemical mechanical polishing in hybrid bonding technology advancement.
  • At the IEEE CPMT Symposium Japan (ICSJ), in Kyoto, Japan, November 13-15, 2024, Dr. Bongsub Lee, a director within Adeia’s semiconductor engineering team, will present an invited talk titled "Hybrid Bonding in Advanced Heterogeneous Integration: Key Metrology Enablers," focusing on innovative metrology techniques crucial for hybrid bonding processes.

About Adeia

Adeia is a leading R&D company that accelerates the adoption of innovative technologies in the media, entertainment, e-commerce, and semiconductor industries. Adeia's fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia's IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. Our inventions enable communications that connect our human experiences. For more, please visit www.adeia.com.

For Information Contact:

Investor Relations
Chris Chaney
ir@adeia.com

Semiconductor Business Development
Yan Chai
marketing@adeia.com

Media Relations
JoAnn Yamani
press@adeia.com


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