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Bringing practical business and technical intelligence to today's structured cabling professionals.

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on:

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Forge Nano Triples Semiconductor ALD Tool Production Space with New State-of-the-Art Cleanroom to Accommodate Growing Demand for Commercial Wafer Coating Equipment

  • 2,000 sq/ft cleanroom dedicated to manufacturing commercial ALD equipment for 200mm semiconductor markets
  • TEPHRA™ ALD cluster tools expected for customer delivery in early 2025
  • Forge Nano plans customer TEPHRA™ demonstration, facility tour

DENVER, Jan. 29, 2025 (GLOBE NEWSWIRE) -- Forge Nano, Inc., an atomic layer deposition solution provider, today announced the completion of its new semiconductor cleanroom. The 2,000 sq/ft cleanroom enables Forge Nano to manufacture multiple commercial TEPHRA™ ALD cluster tools to accommodate growing equipment demand from the semiconductor market.

Forge_0121_05

Forge Nano TEPHRA ALD cluster tool in the new cleanroom production space

Forge Nano announced the expansion of its semiconductor ALD business in 2024 with the launch of TEPHRA. Forge Nano’s ability to coat single wafers at 10x the throughput of traditional ALD systems has significantly grown customer demand thus requiring an expansion of the Company’s manufacturing capacity.

“The Forge Nano TEPHRA can enable conformal metal barrier seed layers for through silicon and through glass vias at aspect ratios greater than 25:1 at production speeds,” said Matt Weimer, Director of R&D at Forge Nano. “With this new cleanroom, Forge Nano will be able to showcase the capabilities of our ALDx atomic layer deposition processes to our customers and further our solutions for advanced packaging and 3D chip integration.”

The new cleanroom provides a Class 10 (ISO 4) space for processing sensitive customer samples and includes a metrology lab for advanced thin-film measurement and particle inspection. The remainder of the cleanroom will house Forge Nano’s own internal TEPHRA tool and provide space to build multiple customer tools, serving as a dual operating space for demonstrations and manufacturing. In addition to increased manufacturing space, this expansion is poised to accelerate Forge Nano’s ability to provide proof-of-concept and commercial solution validation to manufacturers planning to integrate new ALD processes.

Powered by Forge Nano’s ALDx technology, which offers ultrathin, uniform, pinhole-free films with an unprecedented 10x throughput for single-wafer processing, TEPHRA is dedicated to the manufacturing of specialty semiconductor applications on 200mm wafers and below. With efficient chemical use, rapid cycle times, increased yield, and low-risk manufacturing, TEPHRA is the only single-wafer cluster tool with commercial throughput speeds serving 200mm applications in advanced packaging, power semiconductor, radio frequency devices (RFD), microLEDs, microelectromechanical systems (MEMS), and more.

Forge Nano expects to deliver TEPHRA tools in early 2025. Forge Nano is offering on-site TEPHRA demonstrations to new and existing customers starting in early 2025. For more details on how to participate in the upcoming demonstration, please visit: https://www.forgenano.com/semiconductors

For more information on Forge Nano’s TEPHRA product, visit the TEPHRA product page at: https://www.forgenano.com/products/tephra

About Forge Nano

Forge Nano is designing the future of material change. With proprietary ALDx technology, Forge Nano enables semiconductor fabs to conformally coat 200mm wafers for encapsulation, passivation, high-κ dielectric and metal barrier seed applications. Forge Nano’s team of scientists have worked with an expansive portfolio of commercial partners to develop custom solutions to meet any need at any scale, from small-scale R&D and laboratory work to large-scale, high-volume production. Learn more at https://www.forgenano.com

Contact

Will McKenna
Brand Communications Director for Forge Nano
wmckenna@forgenano.com
(720) 432-6669

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/b8df4162-ad95-4859-a64c-ab66fd9ae3b3


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