Latest Releases Deliver Significant Gains in Performance, Reliability, and Security

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its highly anticipated JESD220H and JESD223G: Universal Flash Storage 5.0 and UFS Host Controller Interface (UFSHCI) 5.0. Designed for mobile applications, automotive and computing systems that demand high performance with low power consumption, UFS 5.0 will deliver faster data access and improved performance compared to its predecessor while maintaining compatibility with UFS 4.x hardware. For more information and download, visit the JEDEC website.

UFS offers high-performance, embedded storage with low power consumption, making it ideal for use in applications where power efficiency is essential. This includes computing and mobile systems like smartphones and wearables, as well as an expanding role in generative AI, automotive applications, edge computing and gaming consoles. Its high-speed serial interface and optimized protocol enable significant throughput for power-efficient system performance.

Taken together, UFS 5.0 and UFSHCI 5.0 will enable:

• Industry-leading sequential performance for AI workloads: UFS 5.0 enables sequential read and write speeds of up to 10.8 GB/s, a major advancement in storage bandwidth*
• Enhanced signal integrity through integrated link equalization to ensure reliable operation at higher data rates*
• Improved power integrity with dedicated supply rails: UFS 5.0 introduces a distinct power supply rail to provide noise isolation between PHY and memory subsystem, simplifying system integration*
• Advanced data protection with inline hashing: By performing data integrity checks directly within the storage path, UFS 5.0 enables faster and more efficient detection of data corruption or tampering

*Features resulting from the collaboration between JEDEC and the MIPI^® Alliance.

“These advancements position UFS 5.0 as a foundational technology for next-generation devices, enabling higher performance, greater reliability, and enhanced security for AI-enabled and other data-centric applications,” said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-64 Committee for Embedded Memory Storage and Removable Memory Cards.

Collaboration with the MIPI^® Alliance

To achieve the highest performance and most power efficient data transport, JEDEC UFS leverages industry-leading specifications from the MIPI Alliance to form its Interconnect Layer. This collaboration continues with UFS 5.0, which leverages the MIPI M-PHY^® version 6.0 specification and the UniPro^® version 3.0 specification. M-PHY 6.0 introduces a new High-Speed Gear 6 (HS-G6), which supports data rates double those of the previous maximum data rate of HS-G5, enabling UFS interface bandwidth of 46.6 Gb/s per lane per direction and supporting up to ~10.8 GB/s effective read/write operation for UFS 5.0 over 2 M-PHY lanes.

Company Support Quotes

"KIOXIA is honored to serve on the JEDEC committee and contribute to the standardization of UFS5.0. This new version introduces the support for interface bandwidth of up to 10.8 GB/s. We are confident that this will lead to further acceleration of the adoption and enhancements in functionality of AI solutions in the mobile sector. We extend our sincere gratitude to our partners at JEDEC and MIPI for their collaborative efforts in this vital initiative," said Katsuki Matsudera, GM of the Memory Technical Marketing Managing Department, KIOXIA Corporation.

“As a global leader in mobile technology solutions, MediaTek is prepared to support the next evolution of Universal Flash Storage, UFS 5.0. We are known for our commitment to providing platforms that feature a balance of high performance and high power-efficiency, and we’re confident that the upcoming standard will ensure the best possible user experience in smartphones, automotive applications, edge computing, and more for generations to come.”
-- Patrick Su, Deputy General Manager of System Platform Technology at MediaTek

Jay Hyun, VP of the NAND Planning & Strategy Group at Samsung: "As edge device AI applications continue to increase, storage performance and efficiency have become increasingly important. UFS 5.0 meets these demands by delivering up to two times the performance of UFS 4.1, while enabling smaller package designs and improved signal and power integrity. Faster booting support and more efficient SLC buffer management further support responsive, sustained on-device AI processing across mobile, automotive, and edge computing applications."

Omer Katz, Senior Director, Embedded Product Management at Sandisk: “UFS 5.0 marks a significant performance leap for the industry and sets the foundation for the next wave of intelligent edge devices. As a long-time contributor to JEDEC’s UFS roadmap, at Sandisk, we’re thrilled to help drive a standard that unlocks the next generation of AI-optimized mobile and edge applications with faster, more reliable, and more power-efficient storage solutions.”

"SK hynix is proud to contribute to the UFS 5.0 standard, the next leap in mobile storage for On-Device AI. With 10.8GB/s read speed, it dramatically reduce LLM loading times for instant AI responses. The official Zoned LU integration ensures sustained, optimized performance for heavy AI workloads. The Pre-Erase feature, designed to meet the needs of the smartphone industry, smartly optimize write speed — enabling users to experience AI functions instantly and accelerating AI innovation in next-generation mobile and automotive devices,” said Sangchul Kang, VP of NAND Product Planning at SK Hynix.

About JEDEC

JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 380 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, for manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit https://www.jedec.org.

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