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Our mission: Bringing practical business and technical intelligence to today's structured cabling professionals

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on.

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Cabling Installation & Maintenance is published by Endeavor Business Media, a division of EndeavorB2B.

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Media Alert: Atomera Presenting at the International Conference on Simulation of Semiconductor Processes and Devices 2021 (SISPAD)

Atomera Incorporated (Nasdaq: ATOM):

What:    

SISPAD 2021

 

   

 

Who:

   

Atomera Incorporated (Nasdaq: ATOM), a semiconductor materials and technology licensing company

 

   

 

Where:

   

The Anatole Hotel

 

   

2201 N Stemmons Fwy

 

   

Dallas, TX 75207

 

   

 

When:

   

September 27-29, 2021. The Conference begins at 9:30 a.m. CDT

Atomera Incorporated will present at the 2021 annual International Conference on Simulation of Semiconductor Processes and Devices. The presentation focuses on a novel technique for improving partially depleted RFSOI MOSFETs.

Daniel Connelly, Atomera’s principal scientist, will be giving the paper, entitled “RFSOI n-MOSFET OI-Layer Ground-Plane Engineering with Quasi-3D Simulations,” during Session 10: Cryogenic Simulation and Parasitics, on September 29 at 9:30 a.m. CDT.

The paper demonstrates that Mears Silicon Technology™ (MST®) facilitates 20-90% higher body conductance, which in turn leads to higher breakdown voltage in scaled devices where the body conductance to body ties at the edge of the switch can limit performance.

The improvements are achieved by using a novel technique for improving partially depleted RFSOI MOSFETs with the use of MST oxygen layers (referred to as OI in the paper) to trap and retain boron doping close to the buried oxide interface and so to form a p+ ground plane. Without MST, the boron is lost to the buried oxide during RFSOI device fabrication.

To facilitate the detailed simulation of these, devices a novel “quasi-3D” process model has been developed and tested against a full 3D simulation. The advantage of the new approach is that it allows reasonable execution time with a much finer 2D cross-sectional mesh than would otherwise be possible, which is particularly important for MST device simulation.

To learn more about the session presented by Daniel Connelly at SISPAD 2021, visit the conference program at https://sispad2021.org/technical-program/#S10. For more details on the latest developments by Atomera, please visit https://atomera.com/.

Follow Atomera:

Company website: https://atomera.com/

Atomera whitepaper: atomera.com/news-and-blogs/

Atomera blog: atomera.com/news-and-blogs/

LinkedIn: www.linkedin.com/company/atomera/

About Atomera

Atomera Incorporated is a semiconductor materials and technology licensing company focused on deploying its proprietary, silicon-proven technology into the semiconductor industry. Atomera has developed MST, which increases performance and power efficiency in semiconductor transistors. MST can be implemented using equipment already deployed in semiconductor manufacturing facilities and is complementary to other nano-scaling technologies in the semiconductor industry roadmap. More information can be found at www.atomera.com.

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