About Cabling Installation & Maintenance

Our mission: Bringing practical business and technical intelligence to today's structured cabling professionals

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on.

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Cabling Installation & Maintenance is published by Endeavor Business Media, a division of EndeavorB2B.

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Patrick McLaughlin

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Space-Saving Schottky Rectifiers from Diodes Incorporated Set New Benchmarks in Current Density

Diodes Incorporated (Diodes) (Nasdaq: DIOD) has announced the introduction of a series of high-current Schottky rectifiers in ultra-compact chip scale packages (CSPs). The DIODES™ SDM5U45EP3 (5A, 45V), DIODES™ SDM4A40EP3 (4A, 40V), and DIODES™ SDT4U40EP3 (4A, 40V) achieve the industry’s highest current densities in their class, addressing market demands for smaller and more powerful electronic systems.

Each device can be employed for a variety of different purposes, serving as blocking or reverse-polarity protection diodes, electrical over-stress protection diodes, and free-wheeling diodes. The rectifiers in this series are designed for use in space-constrained applications - such as portable, mobile, and wearable devices, as well as IoT hardware.

Leading the trio, the SDT4U40EP3 is the industry’s smallest 4A trench Schottky rectifier, being the first ever in a 1608 package. It takes 90% less PCB area than competing devices. Its 800A/cm2 current density, also the highest for a trench Schottky in the industry, is due to its patent-pending innovative cathode design and manufacturing processes. The resulting ultra-low forward voltage performance (0.47V typical) minimizes power losses, enabling the design of higher efficiency systems. Furthermore, its superior avalanche capability makes it robust enough to deal with extreme operating conditions, including transient voltages.

The X3-TSN1616-2 packaged SDM5U45EP3 has a 2mm2 footprint, while the 1.28mm2 footprint of the X3-TSN1608-2 packaged SDM4A40EP3 and SDT4U40EP3 enable system designers to maximize board real estate in modern, highly integrated consumer products. These ultra-thin CSPs, with their 0.25mm (typical) profiles, have shortened thermal paths - resulting in greater power dissipation, reducing thermal BOM costs and increasing reliability.

Advance samples are available upon request from: www.diodes.com/about/contact-us/sales-support/

About Diodes Incorporated

Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. We leverage our expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Our broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 31 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets. For more information visit www.diodes.com.

The DIODES logo is a registered trademark of Diodes Incorporated in the United States and other countries.

DIODES is a trademark of Diodes Incorporated in the United States and other countries.

Contacts

Company Contact:

Diodes Incorporated

Emily Yang

SVP, Worldwide Sales and Marketing

P: 972-987-3900

Contact Us

Investor Relations Contact:

Shelton Group

Leanne K. Sievers

President

P: 949-224-3874

E: lsievers@sheltongroup.com

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