About Cabling Installation & Maintenance

Our mission: Bringing practical business and technical intelligence to today's structured cabling professionals

For more than 30 years, Cabling Installation & Maintenance has provided useful, practical information to professionals responsible for the specification, design, installation and management of structured cabling systems serving enterprise, data center and other environments. These professionals are challenged to stay informed of constantly evolving standards, system-design and installation approaches, product and system capabilities, technologies, as well as applications that rely on high-performance structured cabling systems. Our editors synthesize these complex issues into multiple information products. This portfolio of information products provides concrete detail that improves the efficiency of day-to-day operations, and equips cabling professionals with the perspective that enables strategic planning for networks’ optimum long-term performance.

Throughout our annual magazine, weekly email newsletters and 24/7/365 website, Cabling Installation & Maintenance digs into the essential topics our audience focuses on.

  • Design, Installation and Testing: We explain the bottom-up design of cabling systems, from case histories of actual projects to solutions for specific problems or aspects of the design process. We also look at specific installations using a case-history approach to highlight challenging problems, solutions and unique features. Additionally, we examine evolving test-and-measurement technologies and techniques designed to address the standards-governed and practical-use performance requirements of cabling systems.
  • Technology: We evaluate product innovations and technology trends as they impact a particular product class through interviews with manufacturers, installers and users, as well as contributed articles from subject-matter experts.
  • Data Center: Cabling Installation & Maintenance takes an in-depth look at design and installation workmanship issues as well as the unique technology being deployed specifically for data centers.
  • Physical Security: Focusing on the areas in which security and IT—and the infrastructure for both—interlock and overlap, we pay specific attention to Internet Protocol’s influence over the development of security applications.
  • Standards: Tracking the activities of North American and international standards-making organizations, we provide updates on specifications that are in-progress, looking forward to how they will affect cabling-system design and installation. We also produce articles explaining the practical aspects of designing and installing cabling systems in accordance with the specifications of established standards.

Cabling Installation & Maintenance is published by Endeavor Business Media, a division of EndeavorB2B.

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Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative

The U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary codesign of hardware and software and enable processing of vast quantities of data at unprecedented speeds. Argonne is a premier research institution in microelectronics, the tiny devices that power and control computers, smartphones, electric vehicles and other information processing equipment. It also leads the projects as part of DOE’s Microelectronics Science Research Centers.

In December 2024, DOE’s Office of Science announced $160 million in funding to establish the research centers, which are being implemented through the historic CHIPS and Science Act of 2022. The centers will focus on microelectronics technologies for computing, communication, sensing and power. Researchers in the microelectronics field seek transformative advances in energy efficiency and/or resilience in extreme environments.

One of the Argonne projects, “Ultra Dense Memory: Atom Scale Material Dynamics and Systems Consequences,” will be led by Supratik Guha, senior adviser to Argonne’s Physical Sciences and Engineering directorate. The University of Chicago, Purdue University, the Georgia Institute of Technology and Chicago State University are academic partners, and IBM and Micron Technologies are industrial collaborators.

The project will focus on future generations of extreme-scale memories — architectures and technologies designed to handle massive amounts of data at exceptionally high speeds, needed for tomorrow’s high-performance computers and sensors — and their synthesis for on-chip and off-chip applications. This project is part of DOE’s Extreme Lithography & Materials Innovation Center.

The other project, “BIA: A Co-Design Methodology to Transform Materials and Computer Architecture Research for Energy Efficiency,” will be led by Argonne Distinguished Fellow Valerie Taylor, Mathematics and Computer Science division director. Lab and university partners are Fermi National Accelerator Laboratory, The University of Chicago, Northwestern University and Rice University. Named for the Olympian goddess of force and energy, the BIA project includes an industry advisory board with representatives from AMD, Enosemi, Lam Research, Northrop Grumman and NVIDIA.

The goal of BIA is to develop a codesign methodology for microelectronics that considers the relationships between vertically stacked, integrated electronics. Codesign for microelectronics requires a multidisciplinary team consisting of researchers in materials design, devices, computer systems and applications such as high energy physics, working together to address the unique application needs. BIA is part of the Microelectronics Energy Efficiency Research Center for Advanced Technologies.

Contacts

Christopher J. Kramer

Head of Media Relations

Argonne National Laboratory

Office: 630.252.5580

Email: media@anl.gov

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