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Editorial Advisory Board

  • Professor Andrea M. Armani, University of Southern California
  • Ruti Ben-Shlomi, Ph.D., LightSolver
  • James Butler, Ph.D., Hamamatsu
  • Natalie Fardian-Melamed, Ph.D., Columbia University
  • Justin Sigley, Ph.D., AmeriCOM
  • Professor Birgit Stiller, Max Planck Institute for the Science of Light, and Leibniz University of Hannover
  • Professor Stephen Sweeney, University of Glasgow
  • Mohan Wang, Ph.D., University of Oxford
  • Professor Xuchen Wang, Harbin Engineering University
  • Professor Stefan Witte, Delft University of Technology

Ranpak to Showcase Innovations in Automation Solutions and Sustainable Packaging at Upcoming PACK EXPO International

Following recent, successful global technology launches, Ranpak to demo advanced automated packaging solutions in-person

Ranpak Holdings Corp. (“Ranpak”) (NYSE: PACK), a global leader of environmentally sustainable, paper-based packaging solutions for e-commerce and industrial supply chains, today announced its plan to showcase its latest innovations in automation solutions and sustainable packaging to customers, partners and media at PACK EXPO International 2022, taking place from October 23-26 in Chicago.

This year marks both Ranpak’s 50th anniversary as well as the company’s return to exhibiting in-person at the show since the onset of the COVID pandemic. Ranpak’s presence at the EXPO will highlight its strategic investments in innovative automated packaging solutions to help customers lower costs, make logistics easier, and support the global shift to sustainable packaging.

Recent highlights of the company’s enhanced automation portfolio will be on demonstration including recently-launched solutions:

  • The next generation Cut’it!™ EVO solution, an in-line packing machine that enables customers to accelerate their packaging output, reduce operating costs, and improve the sustainability profile of their operations.
  • The Pad’it!® protective box-liner cushioning solution that protects fragile products.
  • The AutoFill™ high-speed end of line packaging solution, the solution of choice for distribution centers worldwide.

Ranpak invites PACK EXPO International attendees to visit Booth #22051 in the West Building to experience the company’s next-generation automation solutions and learn more about Ranpak’s newly launched technology solutions including Void Fill, Cushioning, Wrapping, and Cold Chain. Appointments are also available with Ranpak’s packaging experts at specified times for 1:1 consultations to discuss customers’ challenges.

“We are excited to make our return back to PACK EXPO to showcase our latest innovations in automation solutions and sustainable packaging,” said Omar Asali, Chief Executive Officer of Ranpak. “We look forward to hosting visitors at the Ranpak booth for them to experience first-hand how our suite of technology solutions improve supply chain performance and costs, reduce environmental impact, and support a variety of growing business needs globally.”

For additional information about Ranpak’s presence at PACK EXPO International, please visit: https://www.ranpak.com/pack-expo/

About Ranpak

Founded in 1972, Ranpak's goal was to create the first environmentally responsible system to protect products during shipment. Ranpak’s mission is to deliver sustainable packaging solutions that help improve supply chain performance and costs, reduce environmental impact, and support a variety of growing business needs globally. The development and improvement of materials, systems and total solution concepts have earned Ranpak a reputation as an innovative leader in e-commerce and industrial supply chain solutions. Ranpak is headquartered in Concord Township, Ohio and has approximately 850 employees. Additional information about Ranpak can be found on its website: https://www.ranpak.com.

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