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  • Professor Andrea M. Armani, University of Southern California
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  • Professor Xuchen Wang, Harbin Engineering University
  • Professor Stefan Witte, Delft University of Technology

Amtech Systems Receives Large Repeat Order for Advanced Packaging Reflow Systems

Amtech Systems, Inc. (NASDAQ: ASYS), a manufacturer of capital equipment, including thermal processing, wafer polishing, cleaning and related consumables and services used in fabricating semiconductor devices, such as silicon carbide (SiC), silicon power, and electronic assemblies with a focus on enabling technologies for electric vehicles (EV) and clean energy applications, announced today a multi-unit order for high volume reflow systems used in advanced packaging applications.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230315005838/en/

Pyramax reflow oven used for advanced packaging applications. (Photo: Business Wire)

Pyramax reflow oven used for advanced packaging applications. (Photo: Business Wire)

This order, valued at $1.8M, came from a leading OSAT customer of BTU International and will begin shipping this month through the third fiscal quarter of fiscal 2023. With this, the total number of units ordered by this key customer is over 300. The Pyramax reflow oven is the oven of choice for outsourced semiconductor assembly and test (OSAT) due to its combination of extreme control of thermal and atmosphere conditions at very high throughput.

“While the semiconductor industry is undergoing a period of uncertainty, we are encouraged by this recent order that serves the advanced computing market,” said Michael Whang, CEO of Amtech Systems. “Our relationships with key customers in the OSAT sector are ones we are particularly proud of – and in passing the 300-unit milestone with this customer, it’s a credit to the entire team responsible for this account,” added Whang.

About Amtech Systems, Inc.

Amtech Systems, Inc. is a leading, global manufacturer of capital equipment, including thermal processing, chemical mechanical polishing (CMP) technology, wafer cleaning, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC), silicon power, electronic assemblies and modules focusing on enabling technologies for electric vehicles (EV) and clean energy applications. We sell process equipment and services to semiconductor device and module manufacturers worldwide, particularly in Asia, North America and Europe. Our strategic focus is on semiconductor growth opportunities in power electronics, sensors and analog devices leveraging our strength in core competencies in thermal and substrate processing. Amtech's products are recognized under the leading brand names BTU International, Entrepix Inc., Bruce Technologies™, PR Hoffman™ and Intersurface Dynamics, Inc.

Cautionary Note Regarding Forward-Looking Statements

Certain information contained in this press release is forward-looking in nature. All statements in this press release, or made by management of Amtech Systems, Inc. and its subsidiaries ("Amtech"), other than statements of historical fact, are hereby identified as "forward-looking statements" (as such term is defined in Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, and the Private Securities Litigation Reform Act of 1995). The forward-looking statements in this press release relate only to events or information as of the date on which the statements are made in this press release. Examples of forward-looking statements include statements regarding Amtech's future financial results, operating results, business strategies, projected costs, products under development, competitive positions, plans and objectives of Amtech and its management for future operations, efforts to improve operational efficiencies and effectiveness and profitably grow our revenue, and enhancements to our technologies and expansion of our product portfolio. In some cases, forward-looking statements can be identified by terminology such as "may," "plan," "anticipate," "seek," "will," "expect," "intend," "estimate," "believe," "continue," "predict," "potential," "project," "should," "would," "could", "likely," "future," "target," "forecast," "goal," "observe," and "strategy" or the negative of these terms or other comparable terminology used in this press release or by our management, which are intended to identify such forward-looking statements. These statements are not guarantees of future performance and involve risks, uncertainties and assumptions that are difficult to predict. The Form 10-K that Amtech filed with the Securities and Exchange Commission (the "SEC") for the year-ended September 30, 2022, listed various important factors that could affect the Company's future operating results and financial condition and could cause actual results to differ materially from historical results and expectations based on forward-looking statements made in this document or elsewhere by Amtech or on its behalf. These factors can be found under the heading "Risk Factors" in the Form 10-K and in our subsequently filed Quarterly Reports on Form 10-Qs, and investors should refer to them. Because it is not possible to predict or identify all such factors, any such list cannot be considered a complete set of all potential risks or uncertainties. Except as required by law, we undertake no obligation to publicly update forward-looking statements, whether as a result of new information, future events, or otherwise.

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