Laser Focus World is an industry bedrock—first published in 1965 and still going strong. We publish original articles about cutting-edge advances in lasers, optics, photonics, sensors, and quantum technologies, as well as test and measurement, and the shift currently underway to usher in the photonic integrated circuits, optical interconnects, and copackaged electronics and photonics to deliver the speed and efficiency essential for data centers of the future.

Our 80,000 qualified print subscribers—and 130,000 12-month engaged online audience—trust us to dive in and provide original journalism you won’t find elsewhere covering key emerging areas such as laser-driven inertial confinement fusion, lasers in space, integrated photonics, chipscale lasers, LiDAR, metasurfaces, high-energy laser weaponry, photonic crystals, and quantum computing/sensors/communications. We cover the innovations driving these markets.

Laser Focus World is part of Endeavor Business Media, a division of EndeavorB2B.

Laser Focus World Membership

Never miss any articles, videos, podcasts, or webinars by signing up for membership access to Laser Focus World online. You can manage your preferences all in one place—and provide our editorial team with your valued feedback.

Magazine Subscription

Can you subscribe to receive our print issue for free? Yes, you sure can!

Newsletter Subscription

Laser Focus World newsletter subscription is free to qualified professionals:

The Daily Beam

Showcases the newest content from Laser Focus World, including photonics- and optics-based applications, components, research, and trends. (Daily)

Product Watch

The latest in products within the photonics industry. (9x per year)

Bio & Life Sciences Product Watch

The latest in products within the biophotonics industry. (4x per year)

Laser Processing Product Watch

The latest in products within the laser processing industry. (3x per year)

Get Published!

If you’d like to write an article for us, reach out with a short pitch to Sally Cole Johnson: [email protected]. We love to hear from you.

Photonics Hot List

Laser Focus World produces a video newscast that gives a peek into what’s happening in the world of photonics.

Following the Photons: A Photonics Podcast

Following the Photons: A Photonics Podcast dives deep into the fascinating world of photonics. Our weekly episodes feature interviews and discussions with industry and research experts, providing valuable perspectives on the issues, technologies, and trends shaping the photonics community.

Editorial Advisory Board

  • Professor Andrea M. Armani, University of Southern California
  • Ruti Ben-Shlomi, Ph.D., LightSolver
  • James Butler, Ph.D., Hamamatsu
  • Natalie Fardian-Melamed, Ph.D., Columbia University
  • Justin Sigley, Ph.D., AmeriCOM
  • Professor Birgit Stiller, Max Planck Institute for the Science of Light, and Leibniz University of Hannover
  • Professor Stephen Sweeney, University of Glasgow
  • Mohan Wang, Ph.D., University of Oxford
  • Professor Xuchen Wang, Harbin Engineering University
  • Professor Stefan Witte, Delft University of Technology

Ranpak Announces Cut’it!™ EVO Multi-Lid at MODEX 2024

Ranpak experts will be on site at MODEX 2024 to discuss how end-of-line automation supports unrivaled ROI and customer experience, as well as the features of Ranpak’s solutions.

Ranpak Holdings Corp. (“Ranpak”) (NYSE: PACK), a global leader of environmentally sustainable, paper-based packaging solutions for e-commerce and industrial supply chains, today announced the development of Cut’it!™ EVO Multi-Lid, a solution that allows up to four distinct lids to be applied via one Cut’it!™ EVO machine, dramatically improving customer experience and managing multiple branded lid requirements through a single packaging line.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240220848334/en/

(Photo: Business Wire)

(Photo: Business Wire)

Ranpak reported it will be bringing its automated end-of-line (EOL) packaging solutions to MODEX 2024, scheduled for 11-14th of March at World Congress Center in Atlanta, Georgia. Ranpak will exhibit in Hall A, Booth A10921. During the show, Ranpak will be demonstrating its comprehensive portfolio of automated solutions including its Cut’it!™ EVO in-line packaging machine, with materials and consultation on the features of the Cut’it!™ EVO Multi-Lid solution available as well. These solutions maximize packaging efficiency for customers.

Unbox the Future of Packaging with Four Unique Branded Lids on a Single Cut’it! EVO Machine

Ranpak’s Cut’it!™ EVO solution automatically shortens cartons to match their highest point of filling and then glues a lid securely in place. Cut’it!™ EVO delivers unrivaled ROI by enabling labor savings, EOL flow optimization, an enhanced unboxing experience, shipping cost reduction, reduced material usage, and improved stock management. Overall, it assists packaging operations in reducing costs and improving performance and sustainability.

Today, growth in e-commerce is driving more complex warehouse operations, including managing multiple branding requirements. Flexible box branding has become paramount for companies to navigate direct sales alongside B2B activities or providing fulfilment for different brands from one facility. In response to these trends, Ranpak’s Cut'it!™ EVO Multi-Lid emerges as a game-changer. With up to four unique branded lids available on a single machine, it addresses demand for flexible box branding. This innovative solution allows a single packaging line to efficiently serve multiple customers, optimizing space and future-proofing businesses.

Moreover, Cut'it!™ EVO Multi-Lid enhances the unboxing experience with easy-to-open boxes featuring a tear-off strip. The visually appealing boxes are both strong in construction and tamper evident due to glued lids, which minimizes damage during shipping, leading to fewer returns.

“We look forward to welcoming visitors to our exhibit at Modex,” said Bryan Boatner, Global Managing Director of Automation at Ranpak. “As market dynamics shift, the evolution of Cut'it!™ EVO Multi-Lid stands at the forefront, redefining the future of packaging and offering unrivalled ROI that extends far beyond labor savings. It truly offers customers the ability to transform their end-of-line supply chain operation.”

Ranpak also invites you to join us for an informative presentation on March 13 in standard theater H from 1:00 to 1:45PM. The session will cover how Ranpak’s automation technology can improve intralogistics in the warehouse by enabling a pick-to-shipper strategy, removing manual process steps and creating a path to unrivaled ROI.

To schedule a personal briefing and/or packing experience during the show, please contact boatner.bryan@ranpak.com or visit https://www.ranpak.com/modex/?utm_campaign=modex24&utm_source=pressrelease&utm_medium=digital-print

For more information about Ranpak, please visit: www.ranpak.com.

About Ranpak

Founded in 1972, Ranpak's goal was to create the first environmentally responsible system to protect products during shipment. Ranpak’s mission is to deliver sustainable packaging solutions that help improve supply chain performance and costs, reduce environmental impact, and support a variety of growing business needs globally. The development and improvement of materials, systems and total solution concepts have earned Ranpak a reputation as an innovative leader in e-commerce and industrial supply chain solutions. Ranpak is headquartered in Concord Township, Ohio and has approximately 600 employees. Additional information about Ranpak can be found on its website: https://www.ranpak.com.

Contacts

Stock Quote API & Stock News API supplied by www.cloudquote.io
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the following
Privacy Policy and Terms Of Service.