Laser Focus World is an industry bedrock—first published in 1965 and still going strong. We publish original articles about cutting-edge advances in lasers, optics, photonics, sensors, and quantum technologies, as well as test and measurement, and the shift currently underway to usher in the photonic integrated circuits, optical interconnects, and copackaged electronics and photonics to deliver the speed and efficiency essential for data centers of the future.

Our 80,000 qualified print subscribers—and 130,000 12-month engaged online audience—trust us to dive in and provide original journalism you won’t find elsewhere covering key emerging areas such as laser-driven inertial confinement fusion, lasers in space, integrated photonics, chipscale lasers, LiDAR, metasurfaces, high-energy laser weaponry, photonic crystals, and quantum computing/sensors/communications. We cover the innovations driving these markets.

Laser Focus World is part of Endeavor Business Media, a division of EndeavorB2B.

Laser Focus World Membership

Never miss any articles, videos, podcasts, or webinars by signing up for membership access to Laser Focus World online. You can manage your preferences all in one place—and provide our editorial team with your valued feedback.

Magazine Subscription

Can you subscribe to receive our print issue for free? Yes, you sure can!

Newsletter Subscription

Laser Focus World newsletter subscription is free to qualified professionals:

The Daily Beam

Showcases the newest content from Laser Focus World, including photonics- and optics-based applications, components, research, and trends. (Daily)

Product Watch

The latest in products within the photonics industry. (9x per year)

Bio & Life Sciences Product Watch

The latest in products within the biophotonics industry. (4x per year)

Laser Processing Product Watch

The latest in products within the laser processing industry. (3x per year)

Get Published!

If you’d like to write an article for us, reach out with a short pitch to Sally Cole Johnson: [email protected]. We love to hear from you.

Photonics Hot List

Laser Focus World produces a video newscast that gives a peek into what’s happening in the world of photonics.

Following the Photons: A Photonics Podcast

Following the Photons: A Photonics Podcast dives deep into the fascinating world of photonics. Our weekly episodes feature interviews and discussions with industry and research experts, providing valuable perspectives on the issues, technologies, and trends shaping the photonics community.

Editorial Advisory Board

  • Professor Andrea M. Armani, University of Southern California
  • Ruti Ben-Shlomi, Ph.D., LightSolver
  • James Butler, Ph.D., Hamamatsu
  • Natalie Fardian-Melamed, Ph.D., Columbia University
  • Justin Sigley, Ph.D., AmeriCOM
  • Professor Birgit Stiller, Max Planck Institute for the Science of Light, and Leibniz University of Hannover
  • Professor Stephen Sweeney, University of Glasgow
  • Mohan Wang, Ph.D., University of Oxford
  • Professor Xuchen Wang, Harbin Engineering University
  • Professor Stefan Witte, Delft University of Technology

Ranpak to Launch Game-Changing Data Driven Solutions Delivering Unrivalled ROI for End-of-Line Packaging

The interaction between Ranpak’s Cut’it!™ EVO automated in-line packaging machine and three new AI-powered vision tools creates a solution far greater than the sum of its parts.

Ranpak Holdings Corp. (“Ranpak”) (NYSE: PACK), a global leader of environmentally sustainable, paper-based packaging solutions for e-commerce and industrial supply chains, today announced it has enhanced its breakthrough Cut’it!™ EVO automated in-line packaging machine with three game-changing digital tools that deliver unrivalled ROI to end-of-line (EOL) packaging applications.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240227019908/en/

(Photo: Business Wire)

(Photo: Business Wire)

Ranpak’s solutions are designed to ensure materials are packed using the smallest amount of volume while minimizing void fill, supporting customers in reaching the maximum 40% void target mandated by the EU Packaging Directive. With over 50 years of innovation in paper packaging, Ranpak Automation solutions are also uniquely sustainable, leveraging fully recyclable paper materials.

Unlocking Unrivalled ROI By Beginning with the End in Mind

The Cut’it!™ EVO automated in-line packaging machine is at the core of Ranpak’s integrated approach to EOL automation. The machine automatically shortens cartons to match their highest point of filling before gluing a lid securely in place. Cut’it!™ EVO delivers unrivaled ROI as a standalone solution by enabling labor savings, EOL flow optimization, enhanced unboxing experience, shipping cost reduction, reduced material usage and consolidated box footprints.

However, when used in combination with Ranpak’s new digital tools, the benefits of the solution increase multiplicatively, helping customers stay ahead of regulatory requirements while unlocking a clear competitive advantage. These three digital tools accelerate the ROI already delivered by Cut’it!™ EVO to an unrivalled level. They include:

  • Ranpak Precube’it!™ which is the first element of this breakthrough EOL technology suite. This solution uses historical site order data to simulate machine utilization and box fill rates for future scenarios, amongst its other capabilities. It also consolidates and optimizes the range of box sizes required to be maintained on site, reducing the amount of corrugated material required by choosing the right design and size boxes for each parcel. It can also be utilized to reduce the number of split shipments. Precube’it!™ supports actionable insights in an analysis that is much more precise than other tools that typically calculate using liquid volume.
  • DecisionTower™ applies a unique combination of 2D and 3D AI-supported computer vision technology for a variety of insightful tasks, including quality control, order insights, and precision void filling. In this case, the solution directs the void fill converter to dispense an optimal amount of paper for each specific box. This optimizes dimensioning and usage of packaging materials. AI and machine learning algorithms help the solution deliver increased precision over time across all its applications.
  • Ranpak Connect works in conjunction with Cut’it!™ EVO, providing a detailed overview of machine utilization and performance in daily reporting on parameters including uptime and downtime root causes. It includes an integrated camera in the machine to support performance analyses and identifies training and maintenance needs before escalation is required.

“We are pleased to be presenting these uniquely integrated digital EOL packaging solutions to the marketplace, in order to support increased efficiency within warehouses combined with a more sustainable EOL packaging experience,” said Bryan Boatner, Global Managing Director of Automation at Ranpak. “Our perspective is that as packing operations look to gain efficiencies, EOL packaging automation, rather than an afterthought, should actually be where companies begin their automation process. Our experience is that the cascading benefits of end-of line automation can condense time to ROI to within one to three years Instead of the three to five years piecemeal and back-end investments usually deliver. This is unique in the industry, and not only ensures regulatory compliance around the globe, but also helps packaging operations meet their profitability and sustainability goals in new and innovative ways.”

Ranpak will be bringing these updated automated end-of-line (EOL) packaging solutions and more to MODEX 2024, scheduled for 11-14 March at World Congress Center in Atlanta, Georgia. Ranpak will be located at booth A10921 at the show.

To schedule a personal briefing and/or packing experience during the show, please contact boatner.bryan@ranpak.com or visit https://www.ranpak.com/modex/?utm_campaign=modex24&utm_source=pressrelease&utm_medium=digital-print

For more information about Ranpak, please visit: www.ranpak.com.

About Ranpak

Founded in 1972, Ranpak's goal was to create the first environmentally responsible system to protect products during shipment. Ranpak’s mission is to deliver sustainable packaging solutions that help improve supply chain performance and costs, reduce environmental impact, and support a variety of growing business needs globally. The development and improvement of materials, systems and total solution concepts have earned Ranpak a reputation as an innovative leader in e-commerce and industrial supply chain solutions. Ranpak is headquartered in Concord Township, Ohio and has approximately 600 employees. Additional information about Ranpak can be found on its website: https://www.ranpak.com.

Contacts

Stock Quote API & Stock News API supplied by www.cloudquote.io
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the following
Privacy Policy and Terms Of Service.