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Semtech Unveils High-Performance TIAs for 1.6T AI Data Centers

By: Semtech Corporation via Business Wire

September 07, 2025 at 20:00 PM EDT

GN1834D enables emerging 1.6T optical interconnect market while GN1818 offers up to 20% power reduction for enhanced 800G efficiency

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (“IoT”) systems and cloud connectivity service solutions, today announced two new FiberEdge® transimpedance amplifiers (TIAs) designed to address power efficiency challenges in AI infrastructure scaling. The new TIAs expand Semtech’s industry-leading signal integrity portfolio and further enhance power efficiency for continued 800G deployment optimization.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250907380868/en/

Semtech Unveils High-Performance TIAs for 1.6T AI Data Centers

As AI workloads drive exponential bandwidth growth toward 1.6T infrastructure, power consumption has become a critical constraint in data center scaling. Semtech’s latest FiberEdge innovations directly address this challenge, with the GN1834D adding to the company’s comprehensive 200G TIA solutions that enable 8x200G optical modules for 1.6T applications, while the GN1818 optimizes power efficiency for operators extending their 800G infrastructure investments, offering up to 20% power reduction.

“The explosive growth in datacenters supporting AI is driving demand for the highest optical interconnect speeds available, currently at 100G per lane but migrating quickly to 200G per lane over the next year,” said Scott Wilkinson, lead analyst for optical components at Cignal AI. “As operators transition to 1.6T optics, the high-speed datacom transceiver market will expand from about $9 billion in 2024 to more than $17 billion in 2026.”

“The 1.6T inflection point is upon us, with deployments starting imminently across hyperscale infrastructure,” said Amit Thakar, vice president of signal integrity product marketing at Semtech. “Our expanded 200G TIA portfolio provides the performance, power efficiency, and design flexibility that module designers need to deliver tomorrow’s innovative optical interconnect solutions today. Unlike point solutions entering the market, Semtech’s comprehensive approach enables customers to standardize on proven TIA technology across their entire roadmap scaling from 800G through 1.6T and beyond, while optimizing for the strict power budgets that AI workloads demand.”

GN1834D: Powering the 1.6T Infrastructure Revolution

The GN1834D expands Semtech’s industry-leading 200G TIA portfolio that enables the emerging 1.6T optical interconnect market through advanced 200G per channel performance and innovative 2.5D mounting technology. As a key component in 8x200G optical modules that deliver 1.6T throughput, the GN1834D provides the analog performance foundation that hyperscale operators need for next-generation AI cluster connectivity. This hybrid assembly approach combines flip chip mounting at the critical photodetector-to-TIA interface with wire bond outputs, minimizing parasitic effects and delivering superior signal integrity for next-generation applications.

GN1818: Power-Optimized 100G for Extended 800G Infrastructure

As operators continue scaling 800G infrastructure while planning 1.6T transitions, the GN1818 delivers strategic power optimization for existing deployments. The GN1818 represents a significant advance in 100G TIA efficiency, achieving up to 20% power reduction compared to alternatives while maintaining the proven performance characteristics that have made Semtech a trusted choice for hyperscale AI deployments. This power efficiency enhancement extends the value of current 800G infrastructure investments while operators prepare for 1.6T migration.

GN1818’s strategic advantages include:

Up to 20% power reduction: Low-power innovation while maintaining high-performance standards
Proven heritage: Built on Semtech's established high-performance and reliable TIA design principles
Compact 250μm pitch: Maximum port density for space-constrained optical modules
Performance without compromise: Maintains signal integrity and low latency for AI applications

Comprehensive Portfolio Drives Market Leadership

Semtech’s competitive advantage in the emerging 1.6T market lies in portfolio breadth that enables customer standardization across diverse connectivity requirements. The 200G per channel portfolio provides robust design flexibility for next-generation optical modules and now includes:

GN1834D: Linear TIA with 2.5D mounting, 750μm pitch
GN1832: Linear Flip Chip TIA, 500μm pitch
GN1834: Linear Flip Chip TIA, 750μm pitch
GN1836: Linear TIA, 250μm pitch

This comprehensive approach enables module manufacturers to optimize designs for specific applications while maintaining supply chain efficiency through single-supplier standardization.

Both the GN1834D and GN1818 are available now for sampling.

Semtech at CIOE 2025

Semtech will demonstrate its optical solutions portfolio at CIOE 2025 in Shenzhen, China at Booth #11C52 showcasing the power efficiency and performance innovations that enable next-generation AI infrastructure scaling.

Learn more about Semtech’s high-performance optical, analog and mixed-signal IC signal integrity solutions at www.semtech.com/optical.

About Semtech

Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductor, IoT systems and cloud connectivity service solutions dedicated to delivering high-quality technology solutions that enable a smarter, more connected and sustainable planet. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X.

Semtech, the Semtech logo, and FiberEdge are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks and trade names mentioned may be marks and names of their respective companies.

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