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Editorial Advisory Board

  • Professor Andrea M. Armani, University of Southern California
  • Ruti Ben-Shlomi, Ph.D., LightSolver
  • James Butler, Ph.D., Hamamatsu
  • Natalie Fardian-Melamed, Ph.D., Columbia University
  • Justin Sigley, Ph.D., AmeriCOM
  • Professor Birgit Stiller, Max Planck Institute for the Science of Light, and Leibniz University of Hannover
  • Professor Stephen Sweeney, University of Glasgow
  • Mohan Wang, Ph.D., University of Oxford
  • Professor Xuchen Wang, Harbin Engineering University
  • Professor Stefan Witte, Delft University of Technology

Forge Nano to Unveil Commercial Single Module Semiconductor Wafer Fab ALD Tool at SEMICON Taiwan

  • Forge Nano’s 200 mm single-wafer, thermal atomic layer deposition (ALD) platform for compound semiconductor manufacturing to be unveiled in Taipei
  • Tool build slots available with delivery expected in Q1 2026

DENVER, Sept. 04, 2025 (GLOBE NEWSWIRE) -- Forge Nano, Inc., a technology company pioneering domestic battery and semiconductor innovations, today announced it is unveiling a new commercial single module semiconductor wafer fab atomic layer deposition (ALD) tool – TEPHRAOne. The fully automated 200 mm single module platform is outfitted with features from Forge Nano’s flagship multi-process module TEPHRA in a streamlined configuration for oxide, nitride, metal and nanolaminate coatings.

tephraone

TEPHRAOne 200 mm single module commercial ALD tool.

"TEPHRAOne is our answer to the growing demand for commercial ALD coating speeds in a single module configuration,” said Paul Lichty, CEO of Forge Nano. “With the same high-speed deposition rates and unmatched chemical utilization as our multi-module TEPHRA, TEPHRAOne allows customers with singular coating needs to save critical floor space without sacrificing throughput and quality."

TEPHRAOne is equipped to deposit oxide, nitride or nanolaminates at up to 12 nanometers per minute, while utilizing up to 90% of loaded chemical precursor, to deliver single wafer coatings at batch speeds. The commercial tool includes fast pneumatic valves and in-situ reactor pressure control enabling sub-second coating cycles. Forge Nano’s catalyzed thermal ALD process is utilized in TEPHRAOne to enable high aspect ratio processing desired by RF device, MEMs & sensors and LED & photonics applications.

Forge Nano will be showcasing TEPHRAONE at SEMICON Taiwan, taking place in Taipei from September 10-12. To learn more, stop by the Forge Nano booth (#R7219) located on the 4th floor of TaiNEX 2 or download the equipment brochure here.

For more information about Forge Nano, please visit www.forgenano.com.

About Forge Nano

Forge Nano is a technology company pioneering domestic battery and semiconductor innovations using its platform technology, Atomic Armor. Atomic Armor is a scalable, adaptable nano-scale coating system that strengthens America’s most critical systems – at the atomic level. The superior surface coatings produced by our Atomic Armor™ process allow our partners to unlock peak performance. Learn more at https://www.forgenano.com

Media Contact:
Will McKenna
Brand Communications Director
Forge Nano
wmckenna@forgenano.com
(720) 432-6669

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/07986977-fe3b-46ef-a021-0b72e11829ca


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