Chiplet Summit opens pre-registration today for its third annual event on January 21-23 at the Santa Clara Convention Center. All major chip makers have adopted chiplets as their way to produce devices at leading-edge nodes.

The event covers the latest architectures, development platforms and methods, and applications. Expert panels will discuss best choices, optimization, and long-term trends. Pre-conference seminars will focus on chiplet basics, packaging methods, die-to-die interface basics, design methods, working with foundries, die-to-die interface applications, and the Open Chiplet Economy. Other features include a high-powered superpanel on “Chiplets: The Key to Solving the AI Energy Gap,” an expert table session (with beer and pizza), and an annual update of technologies and markets.

Industry-leading keynotes offer insight into trends and roadmaps. Speakers represent Synopsys, Alphawave Semi, Arm, Teradyne, Cadence, Keysight, and Open Compute Project (OCP). The focus is on best methods for designing processors, coprocessors, communications devices, and AI chips.

“In 2025, we expect to see the full impact of chiplets,” said Chuck Sobey, Summit General Chair. “They are ideal for applications such as AI that demand huge improvements in throughput, power consumption, and latency. Chiplet Summit helps designers make the right decisions for their projects.”

Chiplet Summit also features innovative products from industry leaders such as Synopsys, Alphawave Semi, Arm, Teradyne, Cadence, Keysight, Open Compute Project, Achronix, Siemens EDA, and SK hynix.

Supporting Resources

• Visit Chiplet Summit: ChipletSummit.com
• Follow Chiplet Summit on LinkedIn.com/groups/4129499
• Follow #ChipletSummit

To discuss sponsoring and exhibiting, contact:

Elizabeth Leventhal, Exhibit Sales Director, Elizabeth@ChipletSummit.com +1.760.809.5755

About Chiplet Summit

Chiplet Summit showcases the emerging chiplet market. The Summit is a product of Semper Technologies. For more information, see www.chipletsummit.com.

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